12 INCK SICID CARBIT CARBIE CARbide Creeter Solometer 300mm Foreffeation 4h-n e loketseng
Litšobotsi tsa sehlahisoa
1. Ho fana ka phepelo e phahameng haholo: tokisetso e matla ea carbide e fetang makhetlo a mararo ea silingoana, e loketseng ho khefutsa mocheso o matla.
2. Matla a phahameng a ho pharalla a ho pharalla ha masimo: Matla a masimo a senyeha ke makhetlo a 10 a sililoeng ka makhetlo a 10 a sililoeng, a loketse likopo tsa khatello e phahameng.
3. Leadbap ea Standana: The Bandgap is 3.26ev
4. Ho thata haholo: thata.
5. Sekhoba ba lik'hemik'hale: Ts'ebetso e matla ea ho loantša, e tsitsitseng tikolohong e phahameng le tikolohong e thata.
6. Boholo bo boholo: 12 inch (300mm) substrate, ntlafatse katleho ea tlhahiso, ho fokotsa litšenyehelo tsa unit.
7. Bohlaba bo na le letsoalo: Bophahamo ba mahlare a Khohlano a Ntlha e Phahameng Ho netefatsa hore ho na le bofokoli bo tlase le ho feto-fetoha le maemo.
Taolo ea Lihlahisoa tsa Sehlahisoa
1. Lipalo tsa motlakase:
Likoloi: E sebelisitsoe likoloi tsa motlakase, liphate tsa indasteri le lifofane tsa matla.
Li-diodes: joalo ka li-diodes tsa Schotky (SBD), li sebelisetsoang ho fallisoa ka nepo le ho fetola liphallelo tsa matla.
2. Lisebelisoa tsa RF:
RF Power Amplifier: e sebelisoang ho 5G Business ea Business Business Station Liteishene le likhopolo tsa satellite.
Lisebelisoa tsa Microwave: E Nepahetse Bakeng sa Lits'ebeletso tsa Radar le Wireless PUSELETSO EA PUSO.
3. Likoloi tse ncha tsa matla:
Tsamaiso ea Lipalo ea Electric ea motlakase: Botsamaisi ba likoloi le bajaki ba likoloi tsa motlakase.
Phetoho ea ho tjhesa: Mojule oa matla oa lisebelisoa tse potlakileng.
4. LITLHAKISO TSA BOPHELO:
E phahameng ea voltage e phahameng ho feta: Bakeng sa taolo ea taolo ea Liindasteri le tsamaiso ea matla a indasteri.
GRID GRID: bakeng sa phetisetso ea phetisetso ea HVDC le li-se-feto-feto-feto-fetoha li-brastemistors tsa elektroniki.
5. Aerospace:
Ba elemera e phahameng: E loketse libaka tsa mocheso o phahameng tsa lisebelisoa tsa Aerospace.
6. Tšimo ea lipatlisiso:
Phapanyetsano ea Seicanap Seicouctor Patlisiso: Bakeng sa nts'etsopele ea lisebelisoa tse ncha tsa semicondtor lisebelisoa le lisebelisoa.
Buka ea li-kich ea li-12-Inch Siride ke mofuta oa boikhathollo bo phahameng ba semiconducctor " E sebelisoa haholo ka litšoaneleho tsa elektroniki, lisebelisoa tsa matla tsa moea, likoloi tse ncha tsa matla, li na le lisebelisoa tsa indasteri ho khothaletsa lisebelisoa tse latelang tsa mokhatlo oa elektroniki.
Ha silamise ea moriri e ntse e na le likopo tse fokolang tse tsamaisoang ka likhalase tsa arcrant, lithuso tsa motlakase o matla oa ho phela ka nako e telele. Hajoale, nts'etsopele ea mantlha ea Silbor carbide e tsamaisoa ke likoloi tsa liindasteri tse kang likoloi tsa puisano le tsa indasteri ho hlaolela ka tsela e sebetsang haholoanyane le e tšepahalang.
XKH e ikemiselitse ho fana ka lintlha tse phahameng tse 12
1. Ho latela tlhahiso
2. Ts'ebetso ea ts'ebetso: Fa bareki ts'ehetso ea tekheniki ea khōlo ea li-opitaxele, lihlahisoa tsa sesebelisoa le lits'ebetso tse ling ho ntlafatsa ts'ebetso ea sehlahisoa.
3. Teko le Setifikeiti
4.R & D Tšebelisano 'moho: Ho ba le lisebelisoa tse ncha tsa koae tsa sibide le bareki ho khothaletsa tlhahiso ea theknoloji.
Chate ea data
| 1 2 inch Sicon Carbide (sic) tlhaku e subrate | |||||
| Keletso | Tlhahiso ea Zeromd Sehlopha (z sehlopha sa " | TLHOKOMELISO E NANG KOTSI Kereiti (p Kereiti ea P) | Sehlopha sa Dummy (D Kerese) | ||
| Bophara | 3 0 0 mm ~ 13305mm | ||||
| Botenya | 4H-n | 750μm ± 15 μm | 750μm ± 25 μm | ||
| 4h-si | 750μm ± 15 μm | 750μm ± 25 μm | |||
| Wafer Miter | Theoha axis: 4h ± bakeng sa 4h-n, ka la 4h-n, ka axis: <0001> ± 0.5 ± 0.5 ± 0.5 ± 0.5 ± 0.5 ± | ||||
| Li-Dentip tsa Micropipe | 4H-n | ≤0.4cm-2 | ≤4cm-2 | ≤25cm-2 | |
| 4h-si | ≤ 40cm-2 | ≤10cm-2 | ≤25cm-2 | ||
| TLHOKOMELISO | 4H-n | 0.015 ~ 0.024 ω · · · · ω | 0.015 ~ 0.028 ni sm | ||
| 4h-si | ≥1E10 ω · · · · · · · · · · · · · · · · · kam | ≥1e5 ni · · scan | |||
| Boima bo sephara bo sephara | {10-10} ± 5.0 ° | ||||
| Bolelele ba mantlha | 4H-n | N / a | |||
| 4h-si | Notch | ||||
| TLHOKOMELISO | 3 mm | ||||
| Ltv / ttv / seqha / warp | ≤ 40μm / ≤15μm / ≤35 μm / ≤ 405 μm | ≤5μm / ≤15μm / ≤35 «μm / μ55 ≤ 405 ≤ 40. μm | |||
| Ho ba thata | Rum1 NM | ||||
| CMP Ra≤0.2 NM | Ra≤0.5 nm | ||||
| Mapolanka a maputsoa ka khanya e phahameng Hex plates ka khanya e phahameng haholo Libaka tsa Polytype ka khanya e phahameng haholo Lintho tse bonoang tsa carbon Li-silicon tsa silicon ka leseli le phahameng haholo | Ha ho na motho Sebaka se kopaneng ≤0.05% Ha ho na motho Sebaka se kopaneng ≤0.05% Ha ho na motho | Bolelele ba bolelele ≤ 20 mm, bolelele bo le bong Sebaka sa cumlative ≤0.1% Sebaka sa pele <% Sebaka sa cumlative ≤3% Cumulative bolelele ba bolelele ba cumulato | |||
| Li-chips tse phahameng ka khanya e phahameng haholo | Ha ho motho ea lumelletsoeng ≥0.2mm le bophara le botebo | 7 E lumelletsoe, ≤1 mm e 'ngoe le e' ngoe | |||
| . | ≤ 4000 cm-2 | N / a | |||
| (BPD) Etsisa ho se sebetse ha lifofane | ≤1000 cm-2 | N / a | |||
| Silicon bokaholimo ba silicon ka leseli le phahameng haholo | Ha ho na motho | ||||
| Ho paka | Magarte-Waferte kapa sejana se le seng sa Wafer | ||||
| Lintlha: | |||||
| 1 e lekoa ke meeli e sebetsa ka holim'a bokaholimo bohle ntle le sebaka se ikhethileng. 2the makhala a lokela ho hlahlojoa sefahleho sa S SI feela. 3 Lintlha tsa ho qhekella li tsoa feela li-seffera tsa Koh. | |||||
XKH e tla tsoelapele ho tsetela lipatlisiso le nts'etsopele ea ho nts'etsapele phepelo ea li-sicon tsa silise e kholo Ka ho fokotsa litšenyehelo le bokhoni bo ntseng bo eketseha, XKH bo tla tlisa katleho indastering ea semiconductor.
Setšoantšo se qaqileng
