4 inch Sapphire Wafer C-Plane SSP/DSP 0.43mm 0.65mm
Lisebelisoa
● Growth substrate bakeng sa metsoako ea III-V le II-VI.
● Electronics le optoelectronics.
● Lisebelisoa tsa IR.
● Silicon On Sapphire Integrated Circuit(SOS).
● Radio Frequency Integrated Circuit(RFIC).
Tlhahisong ea LED, li-wafers tsa safire li sebelisoa e le karoloana bakeng sa kholo ea likristale tsa gallium nitride (GaN), tse hlahisang leseli ha ho sebelisoa motlakase. Sapphire ke sesebelisoa se loketseng bakeng sa kholo ea GaN hobane e na le sebopeho sa kristale se ts'oanang le coefficient ea katoloso ea mocheso ho GaN, e fokotsang likoli le ho ntlafatsa boleng ba kristale.
Ho optics, li-wafers tsa safire li sebelisoa e le lifensetere le lilense libakeng tse nang le khatello e phahameng le mocheso o phahameng, hammoho le lits'ebetsong tsa litšoantšo tsa infrared, ka lebaka la ponahalo ea tsona e phahameng le ho thatafala ha tsona.
Tlhaloso
Ntho | 4-inch C-sefofane(0001) 650μm Sapphire Wafers | |
Lisebelisoa tsa Crystal | 99,999%, Bohloeki bo Phahameng, Monocrystalline Al2O3 | |
Kereiti | Prime, Epi-Ready | |
Boemo ba Bokaholimo | C-plane(0001) | |
Sefofane sa C-hang-hang se lebile ho M-axis 0.2 +/- 0.1° | ||
Diameter | 100.0 limilimithara +/- 0.1 limilimithara | |
Botenya | 650 μm +/- 25 μm | |
Maemo a mantlha a Flat | A-sefofane(11-20) +/- 0.2° | |
Bolelele ba Phatlalatso ba Pele | 30.0 limilimithara +/- 1.0 limilimithara | |
Lehlakore le le Leng le hloekisitsoeng | Sebaka se ka Pele | Epi-polished, Ra <0.2 nm (ka AFM) |
(SSP) | Back Surface | Sebaka se setle, Ra = 0,8 μm ho 1,2 μm |
Lehlakore Habeli le bentšitsoeng | Sebaka se ka Pele | Epi-polished, Ra <0.2 nm (ka AFM) |
(DSP) | Back Surface | Epi-polished, Ra <0.2 nm (ka AFM) |
TTV | <20 μm | |
KOBANE | <20 μm | |
TLHOKOMELO | <20 μm | |
Ho hloekisa/ Ho paka | Ho hloekisa kamore ea ho hloekisa ea sehlopha sa 100 le ho paka vacuum, | |
Likotoana tse 25 ka har'a sephutheloana sa khasete e le 'ngoe kapa sephutheloana se le seng. |
Ho paka & ho Romela
Ka kakaretso, re fana ka sephutheloana ka lebokose la lik'hasete tsa 25pcs; hape re ka paka ka setshelo se le seng sa wafer tlasa phaposi ea ho hloekisa ea sehlopha sa 100 ho latela tlhoko ea moreki.