Li-wafer tsa SiC tsa lisenthimithara tse 4 6H tse thibelang mocheso tse nang le mocheso o fokolang, tse entsoeng ka lipatlisiso le tse sa tloaelehang.

Tlhaloso e Khutšoanyane:

Karoloana ea silicon carbide e sa keneng mochesong e thehoa ka ho seha, ho sila, ho bentša, ho hloekisa le theknoloji e 'ngoe ea ts'ebetso kamora kholo ea kristale ea silicon carbide e sa keneng mochesong. Karoloana ea kristale e nang le lera kapa lera le nang le mekhahlelo e mengata e lengoa holim'a karoloana e fihlelang litlhoko tsa boleng e le epitaxy, ebe sesebelisoa sa microwave RF se etsoa ka ho kopanya moralo oa potoloho le sephutheloana. E fumaneha e le li-substrate tsa kristale tse peli tsa 3inch 4incgh 6inch 8 inch tsa indasteri, lipatlisiso le liteko tsa sehlopha sa silicon carbide e le 'ngoe e sa keneng mochesong.


Likaroloana

Tlhaloso ea Sehlahisoa

Sehlopha

Kereiti ea Tlhahiso ea Lefela la MPD (Kereiti ea Z)

Kereiti e Tloaelehileng ea Tlhahiso (Kereiti ea P)

Kereiti ea Dummy (Kereiti ea D)

 
Bophara 99.5 mm ~ 100.0 mm  
  4H-SI 500 μm±20 μm

500 μm±25 μm

 
Boikutlo ba Wafer  

 

Mothapo o sa sebetseng: 4.0° ho ya ho< 1120 > ± 0.5° bakeng sa 4H-N, Mothapo o sa sebetseng: <0001>± 0.5° bakeng sa 4H-SI

 
  4H-SI

≤1cm-2

≤5 cm-2

≤15 cm-2

 
  4H-SI

≥1E9 Ω·cm

≥1E5 Ω·cm

 
Boikutlo ba Motheo bo bataletseng

{10-10} ±5.0°

 
Bolelele ba Sephara ba Motheo 32.5 mm±2.0 mm  
Bolelele ba Bobedi bo Sephara 18.0 mm±2.0 mm  
Boikutlo bo Bobedi bo bataletseng

Silicon e shebile holimo: 90° CW. ho tloha ho Prime flat ±5.0°

 
Ho se kenyeletsoe ha Moeli

3 mm

 
LTV/TTV/Seqha/Sekotwana ≤3 μm/≤5 μm/≤15 μm/≤30 μm ≤10 μm/≤15 μm/≤25 μm/≤40 μm  
 

Ho ba le makukuno

Sefahleho sa C

    Sepolishe Ra≤1 nm

Sefahleho sa Si

CMP Ra≤0.2 nm    

Ra≤0.5 nm

Mapetso a Moeli ka Leseli le Matla a Phahameng

Ha ho letho

Bolelele bo bokellaneng ≤ 10 mm, e le 'ngoe

bolelele ≤2 mm

 
Lipoleiti tsa Hex ka Leseli le Phahameng la Matla Sebaka se bokellaneng ≤0.05% Sebaka se bokellaneng ≤0.1%  
Libaka tsa Polytype ka Leseli le Matla a Phahameng

Ha ho letho

Sebaka se bokellaneng ≤3%  
Ho kenyeletsoa ha Khabone e Bonahalang Sebaka se bokellaneng ≤0.05% Sebaka se bokellaneng ≤3%  
Ho ngoatheloa ha bokaholimo ba Silicon ke Leseli le Matla a Phahameng  

Ha ho letho

Bolelele bo bokellaneng ≤1 * bophara ba wafer  
Li-chips tsa Edge tse Phahameng ka Matla a Phahameng Ha ho letho le dumelletsweng bophara le botebo ba ≥0.2 mm 5 e lumelletsoe, ≤1 mm ka 'ngoe  
Tšilafalo ea Bokaholimo ba Silicon ka Matla a Phahameng

Ha ho letho

 
Sephutheloana

Cassette ea wafer e nang le li-multi-wafer kapa setshelo se le seng sa wafer

 

Setšoantšo se qaqileng

Setšoantšo se qaqileng (1)
Setšoantšo se qaqileng (2)

  • E fetileng:
  • E 'ngoe:

  • Ngola molaetsa oa hau mona 'me u o romelle ho rona