4 inch SiC Wafers 6H Semi-Insulating SiC Substrates tsa mantlha, lipatlisiso, le boemo ba dummy
Tlhaloso ea Sehlahisoa
Kereiti | Kereiti ea Tlhahiso ea Zero MPD (Mophato oa Z) | Mophato o Tlwaelehileng wa Tlhahiso(P Grade) | Sehlopha sa Dummy (D Grade) | ||||||||
Diameter | 99.5 limilimithara ~ 100.0 limilimithara | ||||||||||
4H-SI | 500 μm±20 μm | 500 μm±25 μm | |||||||||
Wafer Orientation |
Off axis : 4.0° ho ea<1120 > ±0.5° bakeng sa 4H-N, On axis : <0001>±0.5° bakeng sa 4H-SI | ||||||||||
4H-SI | ≤1cm-2 | ≤5 cm-2 | ≤15 cm-2 | ||||||||
4H-SI | ≥1E9 Ω·cm | ≥1E5 Ω·cm | |||||||||
Maemo a Motheo a Flat | {10-10} ±5.0° | ||||||||||
Bolelele ba Phatlalatso ba Pele | 32.5 mm±2.0 limilimithara | ||||||||||
Bolelele ba Bokhabane ba Bobeli | 18.0 limilimithara±2.0 limilimithara | ||||||||||
Boemo ba Bobeli ba Flat | Sefahleho sa silicon holimo: 90° CW. ho tloha ho Prime flat ± 5.0 ° | ||||||||||
Kenyelletso ea Edge | 3 limilimithara | ||||||||||
LTV/TTV/Bow /Warp | ≤3 μm/≤5 μm/≤15 μm/≤30 μm | ≤10 μm/≤15 μm/≤25 μm/≤40 μm | |||||||||
Boqhobane | C sefahleho | Sepolishe | Ra≤1 nm | ||||||||
Ke sefahleho | CMP | Ra≤0.2 nm | Ra≤0.5 nm | ||||||||
Edge Cracks By High Intensity Leseli | Ha ho letho | Bolelele bo akaretsang ≤ 10 mm, e le 'ngoe bolelele≤2 mm | |||||||||
Hex Plates By High Intensity Light | Kakaretso ≤0.05% | Kakaretso ≤0.1% | |||||||||
Libaka tsa Polytype Ka Leseli le Matla a Phahameng | Ha ho letho | Kakaretso≤3% | |||||||||
Likakaretso tsa Carbon tse bonoang | Kakaretso ≤0.05% | Kakaretso ≤3% | |||||||||
Silicon Surface Scratches By High Intensity Light | Ha ho letho | Cumulative length≤1*wafer bophara | |||||||||
Edge Chips Phahameng ka ho Matla Leseli | Ha ho e lumelletsoeng ≥0.2 mm bophara le botebo | 5 e lumelletsoe, ≤1 mm ka 'ngoe | |||||||||
Tšilafalo ea Sefahleho sa Silicon Ka Matla a Phahameng | Ha ho letho | ||||||||||
Sephutheloana | Multi-wafer Cassette Kapa Single Wafer Container |
Setšoantšo se qaqileng
Ngola molaetsa wa hao mona mme o re romele wona