4 inch SiC Wafers 6H Semi-Insulating SiC Substrates tsa mantlha, lipatlisiso, le boemo ba dummy

Tlhaloso e Khutšoanyane:

Semi-insulated silicon carbide substrate e thehoa ka ho seha, ho sila, ho bentša, ho hloekisa le theknoloji e 'ngoe ea ho sebetsa ka mor'a ho hōla ha kristale ea silicon carbide. Lera kapa multilayer kristale layer e holisoa holim'a substrate e fihlelang litlhoko tsa boleng e le epitaxy, ebe sesebelisoa sa microwave RF se etsoa ka ho kopanya moralo oa potoloho le ho paka. E fumaneha joalo ka indasteri ea 2inch 3inch 4inch 6inch 8 inch, lipatlisiso le liteko tsa grade semi-insulated silicon carbide single crystal substrates.


Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Tlhaloso ea Sehlahisoa

Kereiti

Kereiti ea Tlhahiso ea Zero MPD (Mophato oa Z)

Mophato o Tlwaelehileng wa Tlhahiso(P Grade)

Sehlopha sa Dummy (D Grade)

 
Diameter 99.5 limilimithara ~ 100.0 limilimithara  
  4H-SI 500 μm±20 μm

500 μm±25 μm

 
Wafer Orientation  

 

Off axis : 4.0° ho ea<1120 > ±0.5° bakeng sa 4H-N, On axis : <0001>±0.5° bakeng sa 4H-SI

 
  4H-SI

≤1cm-2

≤5 cm-2

≤15 cm-2

 
  4H-SI

≥1E9 Ω·cm

≥1E5 Ω·cm

 
Maemo a mantlha a Flat

{10-10} ±5.0°

 
Bolelele ba Phatlalatso ba Pele 32.5 mm±2.0 limilimithara  
Bolelele ba Bokhabane ba Bobeli 18.0 limilimithara±2.0 limilimithara  
Boemo ba Bobeli ba Flat

Sefahleho sa silicon holimo: 90° CW. ho tloha ho Prime flat ± 5.0 °

 
Kenyelletso ea Edge

3 limilimithara

 
LTV/TTV/Bow /Warp ≤3 μm/≤5 μm/≤15 μm/≤30 μm ≤10 μm/≤15 μm/≤25 μm/≤40 μm  
 

Boqhobane

C sefahleho

    Sepolishe Ra≤1 nm

Ke sefahleho

CMP Ra≤0.2 nm    

Ra≤0.5 nm

Edge Cracks By High Intensity Leseli

Ha ho letho

Bolelele bo akaretsang ≤ 10 mm, e le 'ngoe

bolelele≤2 mm

 
Hex Plates By High Intensity Light Kakaretso ≤0.05% Kakaretso ≤0.1%  
Libaka tsa Polytype Ka Leseli le Matla a Phahameng

Ha ho letho

Kakaretso≤3%  
Likakaretso tsa Carbon tse bonoang Kakaretso ≤0.05% Kakaretso ≤3%  
Silicon Surface Scratches By High Intensity Light  

Ha ho letho

Cumulative length≤1*wafer bophara  
Edge Chips Phahameng ka ho Matla Leseli Ha ho e lumelletsoeng ≥0.2 mm bophara le botebo 5 e lumelletsoe, ≤1 mm ka 'ngoe  
Tšilafalo ea Sefahleho sa Silicon Ka Matla a Phahameng

Ha ho letho

 
Sephutheloana

Multi-wafer Cassette Kapa Single Wafer Container

 

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