6 inch-8 inch LN-on-Si Composite Substrate Teckness 0.3-50 μm Si/SiC/Sapphire of Materials

Tlhaloso e Khutšoanyane:

The 6-inch ho 8-inch LN-on-Si composite substrate ke thepa e phahameng ea ts'ebetso e kopanyang lifilimi tse tšesaane tsa lithium niobate (LN) tse nang le silicon (Si), tse nang le botenya ho tloha ho 0.3 μm ho ea ho 50 μm. E etselitsoe lisebelisoa tse tsoetseng pele tsa semiconductor le lisebelisoa tsa optoelectronic. E sebelisa mekhoa e tsoetseng pele ea ho kopanya kapa ea epitaxial, substrate ena e netefatsa boleng bo phahameng ba kristale ea filimi e tšesaane ea LN ha e ntse e sebelisa boholo bo boholo ba liphaephe (6-inch ho isa ho 8-inch) ea silicon substrate ho ntlafatsa katleho ea tlhahiso le litšenyehelo.
Ha ho bapisoa le lisebelisoa tse tloaelehileng tsa LN tse tloaelehileng, karoloana e kopantsoeng ea 6-inch ho isa ho 8-inch LN-on-Si e fana ka ts'ebetso e phahameng ea mocheso le botsitso ba mochini, e etsa hore e tšoanelehe bakeng sa ts'ebetso e kholo ea boemo ba liphaephe. Ho phaella moo, lisebelisoa tse ling tsa motheo tse kang SiC kapa safire li ka khethoa ho finyella litlhoko tse khethehileng tsa kopo, ho kenyelletsa le lisebelisoa tse phahameng tsa RF, li-photonics tse kopantsoeng, le li-sensor tsa MEMS.

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Litekanyetso tsa tekheniki

0.3-50μm LN / LT ka li-Insulators
Lera le ka holimo
Diameter	6-8 inch
Boitloaelo	X, Z, Y-42 joalo-joalo.
Lisebelisoa	LT, LN
Botenya	0.3-50μm
Substrate (E ikemiseditseng)
Lintho tse bonahalang	Si, SiC, Sapphire, Spinel, Quartz

Likarolo tsa Bohlokoa

Karolo e ka tlase ea 6-inch ho isa ho 8-inch LN-on-Si e kopantsoeng e khetholloa ka thepa ea eona e ikhethang ea lisebelisoa le liparamente tse ka sebelisoang, tse nolofalletsang ts'ebeliso e pharaletseng indastering ea semiconductor le optoelectronic:

1.Large Wafer Compatibility: The 6-inch to 8-inch wafer size e tiisa ho kopanngoa ha seamless le melapo e teng ea ho etsa semiconductor (mohlala, mekhoa ea CMOS), ho fokotsa litšenyehelo tsa tlhahiso le ho nolofalletsa tlhahiso ea bongata.

2.Boleng bo phahameng ba Crystalline: Mekhoa e ntlafalitsoeng ea epitaxial kapa bonding e tiisa hore ho na le sekoli se fokolang filiming e tšesaane ea LN, e leng se etsang hore e be se loketseng bakeng sa li-modulators tse phahameng tsa tšebetso, li-filters tsa surface acoustic wave (SAW), le lisebelisoa tse ling tse nepahetseng.

3.Botenya bo Fetohang (0.3-50 μm): Likarolo tsa Ultrathin LN (<1 μm) li loketse li-chips tse kopantsoeng tsa photonic, ha lihlopha tse teteaneng (10-50 μm) li tšehetsa lisebelisoa tsa RF tse matla haholo kapa li-piezoelectric sensors.

Likhetho tsa 4.Multiple Substrate: Ho phaella ho Si, SiC (conductivity e phahameng ea mocheso) kapa safire (insulation e phahameng) e ka khethoa e le lisebelisoa tsa motheo ho finyella litlhoko tsa lisebelisoa tse phahameng tsa maqhubu, mocheso o phahameng, kapa matla a matla.

5.Thermal le Mechanical Stability: The silicon substrate e fana ka tšehetso e matla ea mechine, e fokotsa ho phunya kapa ho senya nakong ea ho sebetsa le ho ntlafatsa lihlahisoa tsa lisebelisoa.

Litšobotsi tsena li beha karolo e ka tlase ea 6-inch ho 8-inch LN-on-Si e le sesebelisoa se ratoang bakeng sa mahlale a morao-rao a kang 5G communications, LiDAR, le quantum optics.

Lisebelisoa tse ka Sehloohong

Karolo e ka tlase ea 6-inch ho isa ho 8-inch LN-on-Si e entsoeng ka bongata e amoheloa haholo indastering ea theknoloji e phahameng ka lebaka la thepa ea eona e ikhethang ea electro-optic, piezoelectric le acoustic:

1.Optical Communications le Integrated Photonics: E nolofalletsa li-modulators tsa electro-optic tse phahameng ka potlako, li-waveguides, le li-circuits tse kopantsoeng tsa photonic (PICs), ho sebetsana le litlhoko tsa bandwidth tsa litsi tsa data le marang-rang a fiber-optic.

2.5G/6G RF Devices: Motsoako o phahameng oa piezoelectric oa LN o etsa hore e be o loketseng bakeng sa li-filters tsa surface acoustic wave (SAW) le bulk acoustic wave (BAW), ho ntlafatsa ts'ebetso ea lipontšo liteisheneng tsa 5G le lisebelisoa tsa mohala.

3.MEMS le Li-Sensors: Phello ea piezoelectric ea LN-on-Si e thusa li-accelerometers tse phahameng-sensitivity, li-biosensors, le li-transducers tsa ultrasonic bakeng sa lisebelisoa tsa bongaka le tsa indasteri.

4.Quantum Technologies: Joaloka lisebelisoa tse sa tloaelehang tsa optical, lifilimi tse tšesaane tsa LN li sebelisoa mehloling ea leseli la quantum (mohlala, li-pair tsa photon tse kentsoeng) le li-chips tse kopantsoeng tsa quantum.

5.Lasers le Nonlinear Optics: Likarolo tsa Ultrathin LN li nolofalletsa moloko oa bobeli oa li-harmonic (SHG) le lisebelisoa tsa optical parametric oscillation (OPO) bakeng sa lisebelisoa tsa laser le tlhahlobo ea spectroscopic.

Karolo e lekantsoeng ea 6-inch ho isa ho 8-inch LN-on-Si e kopanyang lisebelisoa e lumella lisebelisoa tsena hore li etsoe ka masela a maholo a liphaephe, e leng ho fokotsang litšenyehelo tsa tlhahiso haholo.

Customization le Litšebeletso

Re fana ka lits'ebeletso tse felletseng tsa ts'ehetso ea tekheniki le lits'ebeletso tsa hau bakeng sa substrate e kopaneng ea 6-inch ho isa ho 8-inch LN-on-Si ho fihlela litlhoko tse fapaneng tsa R&D le tlhahiso:

1.Tlhahiso e Tloaelehileng: Botenya ba filimi ea LN (0.3-50 μm), mokhoa oa kristale (X-cut / Y-cut), le thepa ea substrate (Si / SiC / safire) e ka etsoa ho ntlafatsa ts'ebetso ea lisebelisoa.

2.Wafer-Level Processing: Phepelo e ngata ea li-wafers tsa 6-inch le 8-inch, ho kenyelletsa le lits'ebeletso tsa morao-rao tse kang dicing, polishing, le ho roala, ho netefatsa hore li-substrates li loketse ho kopanngoa ha lisebelisoa.

3.Technical Consultation and Testing: Tlhaloso ea lisebelisoa (mohlala, XRD, AFM), tlhahlobo ea ts'ebetso ea electro-optic, le ts'ehetso ea ho etsisa lisebelisoa ho potlakisa ho netefatsa moralo.

Morero oa rona ke ho theha substrate e kopaneng ea 6-inch ho isa ho 8-inch LN-on-Si e le tharollo ea mantlha ea lisebelisoa tsa optoelectronic le semiconductor, e fanang ka ts'ehetso ea ho qetela ho tloha ho R&D ho isa tlhahiso ea bongata.

Qetello

Karolo e ka tlase ea 6-inch ho isa ho 8-inch LN-on-Si e kopantsoeng, e nang le boholo ba eona bo boholo ba liphaephe, boleng bo holimo ba thepa, le ho feto-fetoha ha maemo, e tsamaisa tsoelo-pele ea puisano ea optical, 5G RF, le mahlale a quantum. Ebang ke bakeng sa tlhahiso ea boleng bo phahameng kapa tharollo e ikhethileng, re fana ka li-substrate tse tšepahalang le litšebeletso tse tlatselletsang ho matlafatsa boqapi ba theknoloji.