Mochini oa ho Sila o Mahlakore a Mabeli ka ho Sebetsa bakeng sa SiC Sapphire Si wafer
Setšoantšo se qaqileng
Selelekela sa Lisebelisoa tsa ho Sila ka ho Nepahala tse Mahlakoreng a Mabeli
Sesebelisoa sa ho sila ka nepo se mahlakore a mabedi ke sesebelisoa sa mochini se tsoetseng pele se entsoeng bakeng sa ts'ebetso e tsamaellanang ea libaka ka bobeli tsa mosebetsi. Se fana ka ho ba bataletse le ho boreleli bo phahameng ka ho sila lifahleho tse ka holimo le tse ka tlase ka nako e le 'ngoe. Theknoloji ena e loketse haholo bakeng sa mefuta e mengata ea thepa, e koahelang litšepe (tšepe e sa hloekang, titanium, li-alloy tsa aluminium), li-non-metal (li-ceramic tsa tekheniki, khalase ea optical), le li-polymer tsa boenjiniere. Ka lebaka la ts'ebetso ea eona ea bokaholimo bo habeli, sistimi e fihlella ho tšoana ho hoholo (≤0.002 mm) le ho ba thata haholo ha bokaholimo (Ra ≤0.1 μm), e leng se etsang hore e be ea bohlokoa boenjiniere ba likoloi, li-microelectronics, li-bearing tse nepahetseng, lifofane le tlhahiso ea optical.
Ha e bapisoa le li-grinder tse lehlakoreng le le leng, sistimi ena ea lifahleho tse peli e fana ka phallo e phahameng le liphoso tse fokotsehileng tsa ho seta, kaha ho nepahala ha ho tiisa ho tiisetsoa ke ts'ebetso ea ho sebetsa ka nako e le 'ngoe. Hammoho le li-module tse iketsang tse kang ho kenya/ho jarolla ka roboto, taolo ea matla a koetsoeng, le tlhahlobo ea tekanyo ea inthanete, lisebelisoa li kopana ka mokhoa o se nang mathata lifekthering tse bohlale le libaka tse kholo tsa tlhahiso.
Lintlha tsa Tekheniki — Lisebelisoa tsa ho Sila ka ho Sebetsa ka ho Nepahala tse Mahlakoreng a Mabeli
| Ntho | Tlhaloso | Ntho | Tlhaloso |
|---|---|---|---|
| Boholo ba poleiti ea ho sila | φ700 × 50 mm | Khatello e phahameng ka ho fetisisa | 1000 kgf |
| Tekanyo ea mojari | φ238 mm | Lebelo le holimo la poleiti | ≤160 rpm |
| Nomoro ea mofani | 6 | Lebelo le tlase la poleiti | ≤160 rpm |
| Botenya ba mosebetsi | ≤75 mm | Ho potoloha ha lebili la letsatsi | ≤85 rpm |
| bophara ba mosebetsi | ≤φ180 mm | Sekhutlo sa letsoho la ho tjheseletsa | 55° |
| Sekoti sa silindara | 150 mm | Tekanyetso ea matla | 18.75 kW |
| Tlhahiso (φ50 mm) | Likhomphutha tse 42 | Thapo ea motlakase | 3×16+2×10 mm² |
| Tlhahiso (φ100 mm) | Likhomphutha tse 12 | Tlhokahalo ea moea | ≥0.4 MPa |
| Sebaka sa mochini | 2200×2160×2600 mm | Boima bo kahare | 6000 kg |
Kamoo Mochini o Sebetsang Kateng
1. Ts'ebetso ea Mabili a Mabeli
Mabili a mabeli a silang a fapaneng (daemane kapa CBN) a potoloha ka mahlakoreng a fapaneng, a sebelisa khatello e ts'oanang holim'a karolo ea mosebetsi e tšoaretsoeng ho li-carrier tsa lipolanete. Ketso ena e habeli e lumella ho tlosoa ka potlako ka ho ts'oana ho ikhethang.
2. Sebaka le Taolo
Dikurufu tsa bolo tse nepahetseng, di-servo motors, le ditataiso tse otlolohileng di netefatsa ho nepahala ha sebaka sa ±0.001 mm. Di-gauge tse kopaneng tsa laser kapa tsa optical di latela botenya ka nako ya sebele, e leng se nolofalletsang puseletso e iketsang.
3. Ho Pholisa le ho Sefa
Sistimi ea mokelikeli o nang le khatello e phahameng e fokotsa ho sotha ha mocheso le ho tlosa lithōle ka katleho. Sehatsetsi se potoloha hape ka ho sefa ha makenete le centrifugal ka mekhahlelo e mengata, ho lelefatsa bophelo ba lebili le ho tsitsisa boleng ba ts'ebetso.
4. Sethala sa Taolo e Bohlale
E hlomelitsoe ka Siemens/Mitsubishi PLCs le HMI ea skrine e ka letsohong le letona, sistimi ea taolo e lumella polokelo ea diresepe, tlhokomelo ea ts'ebetso ea nako ea sebele, le tlhahlobo ea liphoso. Li-algorithms tse ikamahanyang le maemo li laola ka bohlale khatello, lebelo la potoloho, le sekhahla sa phepelo ho latela boima ba thepa.
Litšebeliso tsa Mochini oa ho Sila o nang le Mahlakore a Mabeli ka ho Sebetsa
Tlhahiso ea Likoloi
Lipheletso tsa crankshaft tsa mechini, masale a piston, li-gear tsa phetisetso, tse fihlellang ho bapanya ha ≤0.005 mm le ho ba thata ha bokaholimo ba Ra ≤0.2 μm.
Semiconductor le Elektroniki
Ho fokotsoa ha di-wafer tsa silicon bakeng sa sephutheloana se tsoetseng pele sa 3D IC; di-substrate tsa ceramic di silwa ka mamello ya boholo ba ±0.001 mm.
Boenjiniere ba ho Sebetsa ka ho Sebetsa
Ho sebetsana le dikarolo tsa haeteroliki, dikarolo tsa ho bea, le di-shim moo ho hlokahalang mamello ya ≤0.002 mm.
Likarolo tsa Optical
Ho phethela khalase ea sekoahelo sa smartphone (Ra ≤0.05 μm), likheo tsa lense ea safire, le li-substrate tsa optical tse nang le khatello e fokolang ea ka hare.
Likopo tsa Lifofane
Ho sebetsa ka mechine ea li-tenons tsa turbine tsa superalloy, likarolo tsa ho thibela ho ruruha tsa ceramic, le likarolo tse bobebe tsa sebopeho tse sebelisoang li-satellite.
Melemo ea Bohlokoa ea Mochini oa ho Sila o Mahlakore a Mabeli ka ho Sebetsa
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Kaho e Tiileng
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Foreimi ea tšepe e entsoeng ka tšepe e boima e nang le phekolo ea ho imolla khatello ea maikutlo e fana ka ho thothomela ho tlase le botsitso ba nako e telele.
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Li-bering tsa boemo bo nepahetseng le li-screw tsa bolo tse thata haholo li fihlella ho pheta-pheta ka hare ho0.003 mm.
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Sebopeho sa Mosebelisi se Bohlale
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Karabelo e potlakileng ea PLC (<1 ms).
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HMI ea lipuo tse ngata e tšehetsa tsamaiso ea diresepe le pono ea ts'ebetso ea dijithale.
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E tenyetseha le ho Atoloha
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Ho tsamaellana ha modular le matsoho a roboto le litsamaiso tsa ho tsamaisa thepa ho nolofalletsa ts'ebetso e se nang motho.
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E amohela dibonto tse fapaneng tsa mabili (resin, daemane, CBN) bakeng sa ho sebetsana le ditshipi, diseramike, kapa dikarolo tse kopaneng.
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Bokhoni ba ho nepahala haholo
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Taolo ea khatello ea selika-likoe e tiisaHo nepahala ha ±1%.
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Lisebelisoa tse inehetseng li lumella ho etsoa ha likarolo tse seng tsa maemo a tloaelehileng, joalo ka metso ea turbine le likarolo tsa ho koala ka nepo.
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Lipotso Tse Botsoang Khafetsa - Mochini oa ho Sila o Mahlakoreng a Mabeli ka ho Sebetsa
P1: Ke lisebelisoa life tseo Mochini oa ho Sila o nang le Mahlakore a Mabeli o ka li sebelisang?
A1: Mochini oa ho Sila o Mahlakore a Mabeli o khona ho sebetsana le mefuta e mengata ea thepa, ho kenyeletsoa le litšepe (tšepe e sa hloekang, titanium, li-alloy tsa aluminium), liseramike, polasetiki ea boenjiniere le khalase ea optical. Mabili a silang a khethehileng (daemane, CBN, kapa resin bond) a ka khethoa ho latela thepa ea mosebetsi.
P2: Boemo ba ho nepahala ha Mochini oa ho Sila o nang le Mahlakore a Mabeli ke bofe?
A2: Mochini o fihlella ho bapaloa ha ≤0.002 mm le ho ba thata ha bokaholimo ba Ra ≤0.1 μm. Ho nepahala ha sebaka ho bolokoa ka hare ho ±0.001 mm ka lebaka la li-screw tsa bolo tse tsamaisoang ke servo le litsamaiso tsa ho lekanya tse hokahaneng.
P3: Mochini oa ho Sila o nang le Mahlakore a Mabeli o ntlafatsa tlhahiso joang ha o bapisoa le li-grinder tse nang le lehlakore le le leng?
A3: Ho fapana le mechini e nang le lehlakore le le leng, Mochini oa ho Sila o nang le Mahlakore a Mabeli o sila lifahleho tse peli tsa mosebetsi ka nako e le 'ngoe. Sena se fokotsa nako ea potoloho, se fokotsa liphoso tsa ho khomarela, 'me se ntlafatsa haholo phallo ea motlakase—e loketseng mela ea tlhahiso ea bongata.
P4: Na Mochini oa ho Sila o nang le Mahlakore a Mabeli o ka kopanngoa le litsamaiso tsa tlhahiso tse iketsang?
A4: E. Mochini o entsoe ka likhetho tsa othomathike tse iketsang ka mokhoa o ikhethileng, joalo ka ho kenya/ho theola thepa ka roboto, taolo ea khatello e koetsoeng, le tlhahlobo ea botenya ba moleng, e leng se etsang hore o lumellane ka botlalo le libaka tse bohlale tsa fektheri.
Mabapi le rona
XKH e ikhethile ka nts'etsopele ea theknoloji e phahameng, tlhahiso le thekiso ea khalase e khethehileng ea mahlo le thepa e ncha ea kristale. Lihlahisoa tsa rona li sebeletsa lisebelisoa tsa elektroniki tsa mahlo, lisebelisoa tsa elektroniki tsa bareki le sesole. Re fana ka likarolo tsa mahlo tsa Sapphire, likoahelo tsa lense ea mohala oa thekeng, Ceramics, LT, Silicon Carbide SIC, Quartz, le li-wafer tsa kristale tsa semiconductor. Ka boiphihlelo bo nang le boiphihlelo le lisebelisoa tsa sejoale-joale, re ipabola ts'ebetsong ea lihlahisoa tse seng tsa maemo a holimo, re ikemiselitse ho ba khoebo e etellang pele ea theknoloji e phahameng ea lisebelisoa tsa optoelectronic.
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