8inch SiC tlhahiso ea sehlopha sa wafer 4H-N SiC substrate
Tafole e latelang e bonts'a litlhaloso tsa li-wafer tsa rona tsa SiC tsa 8inch:
| Litlhaloso tsa SiC DSP tsa mofuta oa N oa 8inch | |||||
| Nomoro | Ntho | Yuniti | Tlhahiso | Lipatlisiso | Sephiri |
| 1:dipharamithara | |||||
| 1.1 | mofuta oa polytype | -- | 4H | 4H | 4H |
| 1.2 | tjantjello ea bokaholimo | ° | <11-20>4±0.5 | <11-20>4±0.5 | <11-20>4±0.5 |
| 2: Paramethara ea motlakase | |||||
| 2.1 | dopant | -- | Naetrojene ea mofuta oa n | Naetrojene ea mofuta oa n | Naetrojene ea mofuta oa n |
| 2.2 | ho hanyetsa | ohm ·cm | 0.015~0.025 | 0.01~0.03 | NA |
| 3: Paramethara ea mechini | |||||
| 3.1 | bophara | mm | 200±0.2 | 200±0.2 | 200±0.2 |
| 3.2 | botenya | μm | 500±25 | 500±25 | 500±25 |
| 3.3 | Tsela ea ho shebana le li-notch | ° | [1- 100]±5 | [1- 100]±5 | [1- 100]±5 |
| 3.4 | Botebo ba Notch | mm | 1 ~ 1.5 | 1 ~ 1.5 | 1 ~ 1.5 |
| 3.5 | LTV | μm | ≤5 (10mm * 10mm) | ≤5 (10mm * 10mm) | ≤10(10mm*10mm) |
| 3.6 | TTV | μm | ≤10 | ≤10 | ≤15 |
| 3.7 | Seqha | μm | -25~25 | -45~45 | -65~65 |
| 3.8 | Koahela | μm | ≤30 | ≤50 | ≤70 |
| 3.9 | AFM | nm | Ra≤0.2 | Ra≤0.2 | Ra≤0.2 |
| 4: Sebopeho | |||||
| 4.1 | bongata ba liphaephe tse nyenyane | ea/cm2 | ≤2 | ≤10 | ≤50 |
| 4.2 | dikahare tsa tshepe | liathomo/cm2 | ≤1E11 | ≤1E11 | NA |
| 4.3 | TSD | ea/cm2 | ≤500 | ≤1000 | NA |
| 4.4 | BPD | ea/cm2 | ≤2000 | ≤5000 | NA |
| 4.5 | TED | ea/cm2 | ≤7000 | ≤10000 | NA |
| 5. Boleng ba pele | |||||
| 5.1 | ka pele | -- | Si | Si | Si |
| 5.2 | qetello ea bokaholimo | -- | Si-face CMP | Si-face CMP | Si-face CMP |
| 5.3 | karoloana | ea/wafer | ≤100 (boholo ≥0.3μm) | NA | NA |
| 5.4 | ho ngoapa | ea/wafer | ≤5, Bolelele bohle ≤200mm | NA | NA |
| 5.5 | Moeli li-chips/li-indents/mapetso/matheba/tšilafalo | -- | Ha ho letho | Ha ho letho | NA |
| 5.6 | Libaka tsa mefuta e mengata | -- | Ha ho letho | Sebaka ≤10% | Sebaka ≤30% |
| 5.7 | letšoao le ka pele | -- | Ha ho letho | Ha ho letho | Ha ho letho |
| 6: Boleng ba morao | |||||
| 6.1 | qetello ea morao | -- | MP ea sefahleho sa C | MP ea sefahleho sa C | MP ea sefahleho sa C |
| 6.2 | ho ngoapa | mm | NA | NA | NA |
| 6.3 | Moeli oa liphoso tsa morao li-chips/li-indent | -- | Ha ho letho | Ha ho letho | NA |
| 6.4 | Ho teneha ha mokokotlo | nm | Ra≤5 | Ra≤5 | Ra≤5 |
| 6.5 | Ho tšoaea ka morao | -- | Notch | Notch | Notch |
| 7: bohale | |||||
| 7.1 | bohale | -- | Chamfer | Chamfer | Chamfer |
| 8: Sephutheloana | |||||
| 8.1 | sephutheloana | -- | Epi-e loketse ka vacuum sephutheloana | Epi-e loketse ka vacuum sephutheloana | Epi-e loketse ka vacuum sephutheloana |
| 8.2 | sephutheloana | -- | Li-wafer tse ngata sephutheloana sa khasete | Li-wafer tse ngata sephutheloana sa khasete | Li-wafer tse ngata sephutheloana sa khasete |
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