Copper substrate single kristale Cu sephaphatha 5x5x0.5/1mm 10x10x0.5/1mm 20x20x0.5/1mm

Tlhaloso e Khutšoanyane:

Li-substrates tsa rona tsa koporo le li-wafers li entsoe ka koporo e phahameng ea bohloeki (99.99%) e nang le sebopeho se le seng sa kristale, se fanang ka motlakase o babatsehang le motlakase oa mocheso. Li-wafers tsena li fumaneha ka li-cubic orientations tsa <100>, <110>, le <111>, e leng se etsang hore e be tse loketseng bakeng sa lisebelisoa tsa lisebelisoa tsa elektroniki tse sebetsang hantle le tsa semiconductor. Ka boholo ba 5 × 5 × 0.5 mm, 10 × 10 × 1 mm, le 20 × 20 × 1 limilimithara, likaroloana tsa rona tsa koporo li ka khoneha ho fihlela litlhoko tse fapaneng tsa tekheniki. Paramethara ea lattice bakeng sa liphaephe tsena tsa kristale e le 'ngoe ke 3.607 Å, e netefatsang botšepehi bo nepahetseng bakeng sa lisebelisoa tse tsoetseng pele tsa lisebelisoa. Likhetho tse kaholimo li kenyelletsa likhakanyo tse pholisitsoeng ka lehlakoreng le le leng (SSP) le li-final-side polished (DSP), tse fanang ka maemo a bonolo bakeng sa lits'ebetso tse fapaneng tsa tlhahiso.


Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Tlhaloso

Ka lebaka la ho hanyetsa mocheso o phahameng le ho tšoarella ha mechine, li-substrates tsa koporo li sebelisoa haholo ho li-microelectronics, mekhoa ea ho senya mocheso le theknoloji ea ho boloka matla, moo tsamaiso e nepahetseng ea mocheso le ho tšepahala ho leng bohlokoa. Lintho tsena li etsa hore li-substrates tsa koporo e be lisebelisoa tsa bohlokoa lits'ebetsong tse ngata tse tsoetseng pele tsa theknoloji.
Tsena ke tse ling tsa litšobotsi tsa koporo e le 'ngoe ea kristale substrate:Motlakase o motle haholo, conductivity ea bobeli ho ea silevera. Thermal conductivity e ntle haholo, 'me conductivity ea mocheso ke eona e ntle ka ho fetisisa har'a litšepe tse tloaelehileng. Ts'ebetso e ntle ea ts'ebetso, e ka phethahatsa mefuta e fapaneng ea theknoloji ea ho sebetsa ka tšepe.Ho hanyetsa kutu ho molemo, empa mehato e meng ea tšireletso e ntse e hlokahala.Theko e lekanyelitsoeng e tlaase, 'me theko e na le moruo haholoanyane ka thepa ea tšepe ea substrate.
Substrate ea koporo e sebelisoa haholo liindastering tse fapaneng ka lebaka la ts'ebetso ea eona e ntle ea motlakase, conductivity ea mocheso le matla a mochini. Lisebelisoa tse ka sehloohong tsa koporo ke tse latelang:
1. Electronic oa potoloho boto: koporo foil substrate lintho tse bonahalang e le hatisitsoeng potoloho boto (PCB). E sebelisoa bakeng sa boto ea potoloho ea li-high density interconnect, flexible circuit board, joalo-joalo E na le thepa e ntle ea conductivity le mocheso oa ho senya mocheso 'me e loketse lisebelisoa tsa elektronike tse matla.

2. Lisebelisoa tsa tsamaiso ea mocheso: e sebelisoang e le setsi sa ho pholisa bakeng sa mabone a LED, lisebelisoa tsa elektronike tse matla, joalo-joalo Ho etsa lihlahisoa tse fapaneng tsa mocheso, li-radiator le likarolo tse ling tsa tsamaiso ea mocheso. Ts'ebetso e ntle ea mocheso oa koporo e sebelisoa ho tsamaisa le ho qhala mocheso ka katleho.

3. Ts'ebeliso ea tšireletso ea motlakase: joalo ka khetla ea sesebelisoa sa elektroniki le lera le sireletsang, ho fana ka tšireletso e sebetsang ea motlakase. E sebelisoa bakeng sa liselefouno, lik'homphieutha le lihlahisoa tse ling tsa elektroniki tsa khetla ea tšepe le lera le sireletsang ka hare. Ka ts'ebetso e ntle ea ts'ireletso ea motlakase, e ka thibela tšitiso ea motlakase.

4.Likopo tse ling: e le lisebelisoa tsa potoloho tse tsamaisang bakeng sa ho aha litsamaiso tsa motlakase. E sebelisoa ha ho etsoa lisebelisoa tse fapaneng tsa motlakase, li-motor, li-transformer le likarolo tse ling tsa motlakase. E le thepa e khabisitsoeng, sebelisa thepa ea eona e ntle ea ho sebetsa.

Re ka iketsetsa litlhaloso tse fapaneng, botenya le libopeho tsa Copper Single crystal substrate ho latela litlhoko tse khethehileng tsa bareki.

Setšoantšo se qaqileng

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