Likarolo tsa Sapphire tse Hlophisitsoeng tsa Shaped Shaped Optical Windows tse nang le Precision Polishing

Tlhaloso e Khutšoanyane:

Lifensetere tsa safire tse entsoeng ka mokhoa o ikhethileng li emela sehlohlolong sa boenjiniere ba optical bo nepahetseng, bo sebelisang Czochralski-grown monocrystalline Al₂O₃ e nang le sebopeho se laoloang sa crystallographic (hangata C-axis kapa A-axis) ho ntlafatsa ts'ebetso bakeng sa lits'ebetso tse itseng. Ts'ebetso ea rona ea kholo ea kristale e fana ka thepa e nang le homogeneity e ikhethang (<5×10⁻⁶ refractive index variation) le li-inclusions tse fokolang (<0.01ppm), ho netefatsa ts'ebetso e tsitsitseng ea optical ho pholletsa le lihlopha tsa tlhahiso. Lifensetere li boloka botsitso bo tsotehang ba tikoloho, ka CTE ea 5.3 × 10⁻⁶/K e bapileng le C-axis, e lumellang ho kopanngoa ka mokhoa o se nang moeli likopanong tse nang le lisebelisoa tse ngata tse itšetlehileng ka libaesekele tse futhumetseng. Mekhoa ea rona e tsoetseng pele ea ho bentša e fihlela bohloeki bo ka tlase ho 0.5nm RMS, e leng ea bohlokoa bakeng sa lisebelisoa tsa laser tse matla haholo moo bofokoli bo ka bakang tšenyo.

Joaloka moetsi ea kopantsoeng ka ho otloloha, XKH e fana ka litharollo tse felletseng ho tloha ho motsoako oa thepa ho isa tlhahlobong ea ho qetela:

Tšehetso ea Moralo: Sehlopha sa rona sa boenjiniere se fana ka tlhahlobo ea DFM (Design for Manufacturing) e sebelisa lipapiso tsa Zemax le COMSOL ho ntlafatsa geometry ea fensetere bakeng sa litlhoko tse khethehileng tsa optical/mechanical.

Litšebeletso tsa Prototyping: Phetoho e potlakileng (

Likhetho tsa ho Koaela: Liaparo tsa tloaelo tsa AR tse tšoarellang ho feta maemo a MIL-C-675C, ho kenyelletsa:

Broadband (400-1100nm) <0.5% reflectivity

VUV-optimized (193nm) ka > 92% phetiso

Liaparo tsa ITO tse tsamaisang (100-1000Ω/sq) bakeng sa tšireletso ea EMI

Tiisetso ea Boleng: Setsi se felletseng sa metrology se kenyeletsang:

4D PhaseCam laser interferometers bakeng sa λ/20 netefatso ea flatness

FTIR spectroscopy bakeng sa 'mapa oa phetiso ea spectral

Mekhoa ea ho hlahloba e ikemetseng bakeng sa tlhahlobo ea 100% ea bofokoli ba holim'a metsi


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  • Likaroloana

    Litekanyetso tsa tekheniki

    Fensetere ea safire
    Boemo 8-400mm
    Mamello ya dimensional +0/-0.05mm
    Boleng ba bokaholimo(mongoa & cheka) 40/20
    Ho nepahala ha bokaholimo λ/10per@633nm
    Aperture e Hlakileng 85%, ~90%
    Ho mamellana ka ho tšoana ±2''-±3''
    Bevel 0.1-0.3mm
    Ho roala AR/AF/ka kopo ya moreki

     

    Likarolo tsa Bohlokoa

    1.Material Superiority

    · Thepa e ntlafetseng ea Thermal: E bonts'a mocheso oa mocheso oa 35 W / m·K (ho 100 ° C), o nang le coefficient e tlaase ea ho atolosa mocheso (5.3 × 10⁻⁶/K) e thibelang ho senyeha ha optical tlas'a ho palama baesekele e potlakileng ea mocheso. Boitsebiso bo boloka botšepehi ba sebopeho esita le nakong ea phetoho ea mocheso oa mocheso ho tloha ho 1000 ° C ho ea mocheso oa kamore ka metsotsoana.

    · Ho tsitsa ha Lik'hemik'hale: E bonts'a ho senyeha ha zero ha e pepesehetse ho concentrated acids (HF e sa kenyelelitsoe) le alkalis (pH 1-14) ka nako e telele, e leng se etsang hore e be se loketseng bakeng sa lisebelisoa tsa ho lokisa lik'hemik'hale.

    · Optical Refinement: Ka khōlo e tsoetseng pele ea kristale ea C-axis, e finyella> phetiso ea 85% ka mokhoa o bonahalang (400-700nm) ka tahlehelo ea ho hasanya ka tlase ho 0.1% / cm.
    · Ho belisoa ha hyper-hemispherical ka boikhethelo ho fokotsa likhakanyo tsa bokaholimo ho <0.2% sebakeng se le seng ho 1064nm.

    2.Bokhoni ba Boenjiniere ba Precision

    · Nanoscale Surface Control: Ho sebelisa magnetorheological finishing (MRF), ho finyella ho hlaka holimo <0.3nm Ra, e bohlokoa bakeng sa lisebelisoa tsa laser tse matla haholo moo LIDT e fetang 10J / cm² ho 1064nm, 10ns pulses.

    · Complex Geometry Fabrication: E kenyelletsa 5-axis ultrasonic machining bakeng sa ho theha mechine ea microfluidic (50μm bophara ba mamello) le diffractive optical elements (DOE) e nang le <100nm tharollo ea likarolo.

    · Metrology Integration: E kopanya interferometry ea khanya e tšoeu le atomic force microscopy (AFM) bakeng sa sebopeho sa bokaholimo ba 3D, ho netefatsa ho nepahala ha foromo <100nm PV ho pholletsa le substrates tse 200mm.

    Lisebelisoa tsa mantlha

    1. Ntlafatso ea Mekhoa ea Tšireletso

    · Hypersonic Vehicle Domes: E etselitsoe ho mamella meroalo ea aerothermal ea Mach 5+ ha e ntse e boloka phetiso ea MWIR bakeng sa lihlooho tsa ba batlang. Litiiso tse khethehileng tsa nanocomposite li thibela delamination tlas'a meroalo ea vibration ea 15G.

    · Li-Platform tsa Quantum Sensing: Liphetolelo tsa Ultra-low birefringence (<5nm/cm) li nolofalletsa magnetometry e nepahetseng lits'ebetsong tsa ho lemoha ka tlas'a metsi.

    2.Industrial Process Innovation

    · Semiconductor Extreme UV Lithography: Lifensetere tse bentšitsoeng tsa Grade AA tse nang le <0.01nm surface roughness li fokotsa tahlehelo ea EUV (13.5nm) e hasanyang litsamaisong tsa stepper.

    · Tlhokomelo ea Nuclear Reactor: Mefuta e fapaneng ea Neutron-transparent (Al₂O₃ isotopically purified) e fana ka tlhahlobo ea pono ea nako ea 'nete ho li-cores tsa Gen IV.

    3.Emerging Technology Integration

    · Space-Based Optical Comms: Liphetolelo tse thatafalitsoeng ke mahlaseli (kamora ho pepeseha ha 1Mrad gamma) li boloka >80% ea phetiso bakeng sa LEO satellite laser crosslinks.

    · Li-interfaces tsa Biophotonics: Litlhare tsa Bio-inert li thusa lifensetere tse kentsoeng tsa Raman spectroscopy bakeng sa ho lekola tsoekere e tsoelang pele.

    4.Mekhoa e tsoetseng pele ea Matla

    · Fusion Reactor Diagnostics: Multi-layer conductive coatings (ITO-AlN) e fana ka pono ea plasma le ts'ireletso ea EMI litsing tsa tokamak.

    · Sebopeho sa Hydrogen: Liphetolelo tsa Cryogenic-grade (tse lekiloeng ho 20K) li thibela ho kenngoa ha haedrojene libakeng tsa polokelo tsa metsi tsa H₂.

    Lits'ebeletso tsa XKH le Matla a Phepelo

    Litšebeletso tsa 1.Custom Manufacturing

    · Tloaelo e thehiloeng ho Metako: E ts'ehetsa meralo e sa tloaelehang (1 mm ho isa ho 300 mm litekanyo), thomello e potlakileng ea matsatsi a 20, le prototyping ea lekhetlo la pele nakong ea libeke tse 4.

    · Litharollo tsa Coating: Anti-reflection (AR), anti-fouling (AF), le wavelength-specific coatings (UV/IR) ho fokotsa tahlehelo ea ho bonahatsa.

    · Ho hloekisoa ka mokhoa o nepahetseng le ho lekoa: Ho belisoa ha boemo ba atomic ho finyella ≤0.5 nm holim'a bokhabane, ka interferometry e netefatsang ho lumellana ha λ/10.

    2.Supply Chain & Tšehetso ea Theknoloji

    · Khokahano e otlolohileng: Taolo ea ts'ebetso e felletseng ho tloha kholong ea kristale (mokhoa oa Czochralski) ho isa ho seha, ho bentša, le ho roala, ho netefatsa bohloeki ba lintho tse bonahalang (ho se na letho-/ho se na moeli) le ho tsitsa ha batch.

    · Tšebelisano-'moho ea indasteri: E netefalitsoe ke borakonteraka ba sepakapaka; e sebelisane le CAS ho nts'etsapele meaho e meholo ea li-heterostructures bakeng sa sebaka sa lehae.

    3.Product Portfolio & Logistics

    · Thepa e tloaelehileng: 6-inch ho isa ho 12-inch wafer formats; litheko tsa yuniti ho tloha ho 43to82 (boholo / bo itšetlehileng ka ho roala), ka thomello ea letsatsi le le leng.

    · Therisano ea tekheniki mabapi le meralo e ikhethileng ea ts'ebeliso (mohlala, lifensetere tse nang le litepisi bakeng sa likamore tsa vacuum, meaho e hananang le mocheso oa mocheso).

    Fensetere ea 3 ea sebopeho se sa tloaelehang sa safire
    Fensetere ea 4 ea sebopeho se sa tloaelehang sa safire

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  • E 'ngoe:

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