Dia300x1.0mmt Thickness Sapphire Wafer C-Plane SSP/DSP

Tlhaloso e Khutšoanyane:

Shanghai Xinkehui New Material Co., Ltd. e ka hlahisa liphaephe tsa safire tse nang le libopeho tse fapaneng tse fapaneng (c, r, a, le m-plane), le ho laola angle-cut-cut ho ea ho 0.1 degree. Ka ho sebelisa theknoloji ea rona ea thepa, re khona ho fihlela boleng ba boleng bo holimo bo hlokahalang bakeng sa lits'ebetso tse joalo ka kholo ea epitaxial le wafer bonding.

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Hlahisa lebokose la wafer

Lisebelisoa tsa Crystal	99,999% ea Al2O3,Bohloeki bo Phahameng, Monocrystalline, Al2O3
Boleng ba kristale	Li-inclusions, li-block marks, mafahla, 'Mala, li-micro-bubble le litsi tsa ho hasana ha li eo.
Diameter	2inch	3 intshi	4inch	6inch - 12inch
Diameter	50.8± 0.1mm	76.2±0.2mm	100±0.3mm	Ho latela lipehelo tsa tlhahiso e tloaelehileng
Botenya	430±15µm	550±15µm	650±20µm	E ka etsoa ke moreki
Boitloaelo	C- sefofane (0001) ho M-sefofane (1-100) kapa A-sefofane (1 1-2 0) 0.2±0.1° /0.3±0.1°, R-sefofane (1-1 0 2), A-sefofane (1 1-2 0 ), M-plane(1-1 0 0), Any Orientation , Any angle
Bolelele ba pele bo bataletseng	16.0±1mm	22.0±1.0mm	32.5±1.5 limilimithara	Ho latela lipehelo tsa tlhahiso e tloaelehileng
Maemo a mantlha a bataletseng	A-sefofane (1 1-2 0 ) ± 0.2°
TTV	≤10µm	≤15µm	≤20µm	≤30µm
LTV	≤10µm	≤15µm	≤20µm	≤30µm
TIR	≤10µm	≤15µm	≤20µm	≤30µm
KOBANE	≤10µm	≤15µm	≤20µm	≤30µm
Warp	≤10µm	≤15µm	≤20µm	≤30µm
Sebaka se ka Pele	Epi-Polished (Ra< 0.2nm)

*Bow: Ho kheloha ha ntlha e bohareng ea bokaholimo ba sephaphatha sa mahala, se sa koaeloang ho tloha sefofaneng sa litšupiso, moo sefofane sa litšupiso se hlalosoang ke likhutlo tse tharo tsa khutlotharo e lekanang.

*Warp: Phapang lipakeng tsa boholo le bohole ba bonyane ba sebaka se bohareng sa sephaphatha sa mahala, se sa koaeloang ho tloha sefofaneng sa litšupiso se hlalositsoeng kaholimo.

Lihlahisoa le lits'ebeletso tsa boleng bo holimo bakeng sa lisebelisoa tsa semiconductor tsa moloko o latelang le kholo ea epitaxial:

Boemo bo phahameng ba ho bata (TTV e laoloang, seqha, warp joalo-joalo)

Tlhoekiso ea boleng bo holimo (tšilafalo ea likaroloana tse tlase, tšilafalo e tlase ea tšepe)

Ho cheka substrate, grooving, ho itšeha, le ho bentša ka morao

Ho kenyeletsoa ha data joalo ka bohloeki le sebopeho sa substrate (boikhethelo)

Haeba u hloka li-sapphire substrates, ka kopo ikutloe u lokolohile ho ikopanya le:

lengolo-tsoibila:eric@xkh-semitech.com+86 158 0194 2596 /doris@xkh-semitech.com+86 187 0175 6522

Re tla khutlela ho uena kapele!