Dia50.8mm Sapphire Wafer Sapphire Window e Phahameng ea Optical Transmittance DSP/SSP

Dia50.8mm Sapphire Wafer Sapphire Window High Optical Transmittance DSP/SSP Setšoantšo se Featured

Tlhaloso e Khutšoanyane:

Ka lebaka la letlapa le sa lumellaneng hantle le lik'hemik'hale le thepa ea 'mele e tsitsitseng, sapphire(Al2O3) wafer ke karolo e tsebahalang ea li-nitrides tsa III-V, superconductor le magnetic epi-film. Li sebelisoa haholo ho GaN le kholo ea filimi e tšesaane ea epitaxial, silicon holim'a safire, 'maraka oa LED le indasteri ea optics.

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Ke hobane'ng ha Sapphire?

Litšobotsi tsa safire e le 'ngoe ea kristale
1. Sapphire e na le transmittance e phahameng ea optical, kahoo e sebelisoa haholo e le microelectronic tube dielectric material, ultrasonic conduction element, waveguide laser cavity, le lintho tse ling tsa optical, e le lisebelisoa tsa fensetere bakeng sa lisebelisoa tsa sesole sa infrared, likoloi tsa sebaka, li-lasers tse matla le li-optical. puisano.

2. Sapphire e na le boima bo phahameng, matla a phahameng, mocheso o phahameng oa ho sebetsa, ho hanyetsa abrasion, litšoaneleho tsa ho hanyetsa kutu, kahoo sapphire substrate e atisa ho sebelisoa libakeng tse thata, tse kang gauge ea metsi a boiler (ho hanyetsa mocheso o phahameng), mochine oa khoutu ea thepa, ho beha, le tlhahiso e 'ngoe e nepahetseng (ho hanyetsa ho apara), mashala, khase, lisebelisoa tsa ho lemoha seliba le lifensetere tsa detector (anti-corrosion).

3. Sapphire e na le litšoaneleho tsa ho kenya motlakase, ho pepeseha, ho tsamaisa mocheso o motle, le ho tiea ho hoholo, kahoo e ka sebelisoa e le thepa ea substrate ea lipotoloho tse kopantsoeng, tse kang LED le microelectronic circuits, ultra-high-speed integrated circuit.

Tlhaloso

Diameter	50.8mm +/-0.1mm kapa +/-0.02mm
Botenya	0.43mm± 0.1mm kapa +/-0.02mm
Boitloaelo	C-plane/A-Plane/M-Plane/R-Plane
Boleng ba bokaholimo (ho ngolla le ho cheka)	60/40, 40/20 kapa ho feta
Ho nepahala ha bokaholimo	λ/10, λ/2, λ
Aperture e Hlakileng	85%, >90%
Ho bapisa	+/-3', +/-30''
Bevel	0.1 ~ 0.3mm×45 tekanyo
Ho roala	AR, BBAR kapa ka kopo ea bareki (UV, VIS, IR)

Che	Thepa	Sepheo	Mamello	Litlhaloso
1	Diameter	50.8 limilimithara	± 0.1mm
2	Botenya	430μm	±15μm
3	Tsela e kaholimo ea sefofane sa C	ho tloha C-axis ho M0.2°	± 0.1°
4	Bolelele ba pele bo bataletseng	16 limilimithara	± 11 limilimithara
5	Boemo ba mantlha bo bataletseng	Sefofane (11-20)	±0.1°
6	Lehlakore le ka morao Roughness	0.8 ~ 1.2um
7	Lehlakore le ka pele Roughness	<0.3nm
8	Bophahamo ba sephaphatha	Mofuta oa R
9	Phapang e Felletseng ea Botenya, TTV	≤ 10μm(LTV≤5μm, 5*5)
10	SORI	≤10μm
11	Inamela	-10 μm ≤ BOW ≤ 0
12	Laser Mark	N/A		ha ba na
	Sephutheloana	Li-wafers tse 25 ka khaseteng e le 'ngoe
	Bokhoni ba ho latela mohlala	Li-wafer li tla lateloa ho latela nomoro ea cassette

LBH

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