6 Inch / 8 Inch POD / FOSB Fiber Optic Splice Lebokose la Phatlalatso Lebokose la polokelo la RSP Remote Service Platform FOUP Front Opening Unified Pod

6 Inch / 8 Inch POD / FOSB Fiber Optic Splice Box Lebokose la Phatlalatso Lebokose la polokelo la RSP Remote Service Platform FOUP Front Opening Unified Pod Setšoantšo se bontšitsoeng

Tlhaloso e Khutšoanyane:

TheFOSB (Lebokose la Thomello le Bulang ka Pele)ke sets'oants'o se entsoeng ka nepo, se bulang ka pele se etselitsoeng ho tsamaisa le ho boloka liphaephe tsa semiconductor tse 300mm. E bapala karolo ea bohlokoa ho sireletseng li-wafers nakong ea phetisetso ea li-inter-fab le thomello ea maeto a malelele ha e ntse e netefatsa hore maemo a holimo a bohloeki le bots'epehi ba mochini lia bolokoa.

Re romelle lengolo-tsoibila

Likaroloana

Setšoantšo se qaqileng

Kakaretso ea FOSB

E entsoe ka thepa e hloekileng haholo, e sa fetoheng 'me e entsoe ho latela maemo a SEMI, FOSB e fana ka ts'ireletso e ikhethang khahlano le tšilafalo ea likaroloana, ho tsoa ho sa fetoheng le ho makala 'meleng. E sebelisoa haholo ho pholletsa le tlhahiso ea semiconductor ea lefats'e, thepa, le litšebelisano tsa OEM/OSAT, haholo-holo meleng ea tlhahiso e iketsang ea 300mm wafer fabs.

Sebopeho le Lisebelisoa tsa FOSB

Lebokose le tloaelehileng la FOSB le entsoe ka likarolo tse 'maloa tse nepahetseng, kaofela li etselitsoe ho sebetsa ka mokhoa o sa reroang ka boiketsetso ba feme le ho netefatsa polokeho ea wafer:

'Mele o ka Sehloohong: E bōpiloe ho tloha lipolasetiki tsa boenjiniere tse hloekileng tse kang PC (polycarbonate) kapa PEEK, e fana ka matla a phahameng a mochine, tlhahiso e tlaase ea likaroloana, le khanyetso ea lik'hemik'hale.
Monyako o Bulang ka Pele: E etselitsoe ho lumellana ka botlalo ka boiketsetso; e na le li-gaskets tse tiileng tse tiisang hore ho na le phapanyetsano e fokolang ea moea nakong ea lipalangoang.
Terei ea ka hare ea Reticle / Wafer: E boloka li-wafers tse ka bang 25 ka mokhoa o sireletsehileng. Terei e thibela ho tsitsisa 'me e koaletsoe ho thibela liphaphatha ho sisinyeha, ho phunya kapa ho harola.
Latch Mechanism: Sistimi ea ho notlela ts'ireletso e tiisa hore lemati le lula le koetsoe nakong ea ho tsamaea le ho ts'oaroa.
Traceability Features: Mefuta e mengata e kenyelletsa li-tag tsa RFID tse kentsoeng, libarcode, kapa likhoutu tsa QR bakeng sa kopanyo e felletseng ea MES le ho lata ho pholletsa le ketane ea thepa.
Taolo ea ESD: Thepa e na le static-dissipative, hangata e na le resistivity ea holim'a metsi pakeng tsa 10⁶ le 10⁹ ohms, e thusa ho sireletsa li-wafers ho tsoa ho electrostatic discharge.

Likarolo tsena li etsoa libakeng tse hloekileng tsa phaposi 'me li kopana kapa li feta litekanyetso tsa machaba tsa SEMI tse kang E10, E47, E62, le E83.

Melemo ea Bohlokoa

● Tšireletso ea Boemo bo Phahameng ba Wafer

Li-FOSB li hahiloe ho sireletsa li-wafers ho tsoa tšenyo ea 'mele le litšila tsa tikoloho:

Sistimi e koetsoeng ka botlalo, e tiisitsoeng ka hermetically e thibela mongobo, mosi oa lik'hemik'hale le likaroloana tse tsamaisoang ke moea.
Anti-vibration hare-hare e fokotsa kotsi ea ho tsosoa ke mechine kapa li-microcracks.
Khetla ea kantle e thata e mamella litlamorao le khatello ea ho bokellana nakong ea lisebelisoa.

● Full Automation Compatibility

Li-FOSB li etselitsoe ho sebelisoa AMHS (Automated Material Handling Systems):

E lumellana le matsoho a liroboto a lumellanang le SEMI, likou tsa thepa, li-stockers le li-openers.
Mochini o bulang ka pele o hokahana le FOUP e tloaelehileng le litsamaiso tsa likou tsa thepa bakeng sa othomathike ea feme e se nang seamless.

● Boqapi bo Lokisitsoeng ka Phaposing e Hloekileng

E entsoe ka thepa e hloekileng, e sa pheleng hantle.
Ho bonolo ho hloekisa le ho sebelisa hape; e loketseng bakeng sa tikoloho ea phaposi e hloekileng ea Sehlopha sa 1 kapa e phahameng.
E lokolohile ho li-ion tsa tšepe e matla, ho netefatsa hore ha ho na tšilafalo nakong ea phetiso ea wafer.

● Intelligent Tracking & MES Integration

Mekhoa ea boikhethelo ea RFID/NFC/barcode e lumella ho latelloa ka botlalo ho tloha ho lesela ho isa ho lesela.
FOSB e 'ngoe le e 'ngoe e ka tsejoa ka mokhoa o ikhethileng le ho lateloa ka har'a sistimi ea MES kapa WMS.
E ts'ehetsa ponaletso ea tšebetso, boitsebahatso ba sehlopha, le taolo ea thepa.

Lebokose la FOSB - Letlapa la Litlhaloso tse Kopantsoeng

Sehlopha	Ntho	Boleng
Lisebelisoa	Wafer Contact	Polycarbonate
Lisebelisoa	Shell, Lemati, Mosako oa Lemati	Polycarbonate
Lisebelisoa	Retainer ka morao	Polybutylene Terephthalate
Lisebelisoa	Ho tšoara, Auto Flange, Info Pads	Polycarbonate
Lisebelisoa	Gasket	Thermoplastic Elastomer
Lisebelisoa	KC Plate	Polycarbonate
Litlhaloso	Bokhoni	25 li-wafers
Litlhaloso	Botebo	332.77 mm ±0.1 mm (13.10" ±0.005")
Litlhaloso	Bophara	389.52 mm ±0.1 mm (15.33" ±0.005")
Litlhaloso	Bophahamo	336.93 mm ±0.1 mm (13.26" ±0.005")
Litlhaloso	2-Pack Bolelele	680 limilimithara (26.77")
Litlhaloso	2-Pack Bophara	415 limilimithara (16.34")
Litlhaloso	2-Pack Height	365 limilimithara (14.37")
Litlhaloso	Boima (bo se nang letho)	4.6 lik'hilograma (10.1 lb)
Litlhaloso	Boima (Bo tletse)	7.8kg (17.2 lb)
Wafer Compatibility	Boholo ba Wafer	300 limilimithara
Wafer Compatibility	Pitch	10.0 limilimithara (0.39")
Wafer Compatibility	Lifofane	± 0.5 mm (0.02") ho tloha ka lebitso

Maemo a Kopo

Li-FOSB ke lisebelisoa tsa bohlokoa ho 300mm wafer logistics le polokelo. Li amoheloa ka bongata maemong a latelang:

Fab-to-Fab Transfers: Bakeng sa li-wafers tse tsamaeang pakeng tsa lisebelisoa tse fapaneng tsa tlhahiso ea semiconductor.
Foundry Deliveries: Ho tsamaisa li-wafers tse felileng ho tloha ho masela ho ea ho bareki kapa setsing sa ho paka.
OEM / OSAT Logistics: Ts'ebetsong ea ho paka le ho etsa liteko tse tsoang kantle.
Polokelo ea Mokha oa Boraro le Botoro: Sireletsa polokelo ea nako e telele kapa ea nakoana ea li-wafers tsa bohlokoa.
Liphetisetso tsa ka hare tsa Wafer: Likampong tse kholo tsa masela moo li-module tsa tlhahiso tse hole li hokahaneng ka AMHS kapa lipalangoang tsa matsoho.

Ts'ebetsong ea lefats'e ea phepelo ea thepa, li-FOSB e se e le maemo a lipalangoang tsa boleng bo holimo, tse netefatsang hore ho tsamaisoa ntle ho tšilafalo lik'honthinenteng tsohle.

FOSB khahlano le FOUP – Phapano ke Efe?

Sebopeho	FOSB (Lebokose la Thomello le Bulang ka Pele)	FOUP (Front Opening Unified Pod)
Tšebeliso ea Pele	Inter-fab wafer shipping le logistics	Phetisetso ea li-wafer ka har'a masela le ts'ebetso e ikemetseng
Sebopeho	Setshelo se thata, se tiisitsoeng se nang le tšireletso e eketsehileng	Pod e ka sebelisoang hape e ntlafalitsoeng bakeng sa othomathike ea kahare
Ho thibela moea	Ts'ebetso e phahameng ea ho tiisa	E etselitsoe ho kena habonolo, 'me moea o se ke oa kena
Khafetsa ea Tšebeliso	Mahareng (e tsepamisitswe haholo hodima dipalangwang tse bolokehileng tsa sebaka se selelele)	Maqhubu a phahameng ka har'a mela ea tlhahiso e ikemetseng
Bokhoni ba Wafer	Ka tloaelo li-wafers tse 25 lebokose le leng le le leng	Ka tloaelo li-wafers tse 25 ka pod
Automation Support	E lumellana le li-openers tsa FOSB	E kopantsoe le likou tsa mojaro tsa FOUP
Ho latela melao	SEMI E47, E62	SEMI E47, E62, E84, le tse ling

Leha bobeli ba bona ba sebetsa likarolo tsa bohlokoa molemong oa lisebelisoa tsa li-wafer, li-FOSB li etselitsoe ho tsamaisa thepa e matla lipakeng tsa masela kapa ho bareki ba kantle, athe li-FOUP li shebane haholo le katleho ea mohala oa tlhahiso.

Lipotso tse atisang ho botsoa (FAQ)

Q1: Na li-FOSB li ka sebelisoa hape?
Ee. Li-FOSB tsa boleng bo holimo li etselitsoe ho sebelisoa khafetsa 'me li khona ho mamella mekoloko e mengata ea ho hloekisa le ho sebetsana le eona haeba li hlokomeloa hantle. Ho khothalletsoa ho hloekisa kamehla ka lisebelisoa tse tiisitsoeng.

Q2: Na li-FOSB li ka etsoa molemong oa ho tsebahatsa kapa ho latela mohlala?
Ruri. Li-FOSB li ka etsoa ka li-logos tsa bareki, li-tag tsa RFID tse khethehileng, tiiso e thibelang mongobo, esita le ho kenya mebala e fapaneng bakeng sa tsamaiso e bonolo ea thepa.

Q3: Na li-FOSB li loketse tikoloho ea likamore tse hloekileng?
Ee. Li-FOSB li entsoe ka lipolasetiki tsa boemo bo hloekileng 'me li tiisitsoe ho thibela tlhahiso ea likaroloana. Li loketse tikoloho ea phaposi e hloekileng ea Sehlopha sa 1 ho isa ho 1000 le libaka tsa bohlokoa tsa semiconductor.

Q4: Li-FOSB li buloa joang nakong ea boiketsetso?
Li-FOSB li tsamaisana le li-openers tse khethehileng tsa FOSB tse tlosang lemati le ka pele ntle le ho ama ka letsoho, ho boloka botšepehi ba maemo a bohloeki.

Mabapi le rona

XKH e sebetsa ka ho khetheha ho nts'etsopele ea theknoloji e phahameng, tlhahiso, le thekiso ea likhalase tse khethehileng tsa optical le lisebelisoa tse ncha tsa kristale. Lihlahisoa tsa rona li fana ka lisebelisoa tsa elektroniki tsa optical, lisebelisoa tsa elektroniki tsa bareki le sesole. Re fana ka lisebelisoa tsa mahlo tsa Sapphire, likoahelo tsa lense tsa mohala oa thekeng, Ceramics, LT, Silicon Carbide SIC, Quartz, le liphaphatha tsa kristale tsa semiconductor. Ka boitseanape bo nang le boiphihlelo le lisebelisoa tse tsoetseng pele, re ipabola ts'ebetsong ea lihlahisoa tse sa tloaelehang, ka sepheo sa ho ba khoebo e etelletseng pele ea theknoloji e phahameng ea optoelectronic.