Thepa ea Infrared Picosecond Dual-Platform Laser Cutting bakeng sa Optical Glass/Quartz/Sapphire Processing

Tlhaloso e Khutšoanyane:

Kakaretso ea Tekheniki:
The Infrared Picosecond Dual-Station Laser Cutting System ke tharollo ea boemo ba indasteri e etselitsoeng machining a nepahetseng a lisebelisoa tse bonaletsang. E na le mohloli oa laser oa 1064nm infrared picosecond laser (bophara ba pulse <15ps) le moralo oa sethala sa liteishene tse peli, sistimi ena e fana ka ts'ebetso e habeli ea ts'ebetso, e nolofalletsang mochini o se nang sekoli oa likhalase tsa optical (mohlala, BK7, silika e kopantsoeng), likristale tsa quartz, le sapphire (α-up ho fihlela ho 9) ho thatafala
Ha ho bapisoa le li-laser tse tloaelehileng tsa nanosecond kapa mekhoa ea ho itšeha ka mechine, Infrared Picosecond Dual-Station Laser Cutting System e finyella bophara ba micron-level kerf (e tloaelehileng: 20–50μm) ka mochine oa "ablation" o batang, o nang le sebaka se amehileng ke mocheso se lekanyelitsoeng ho <5μm. Mokhoa oa ho sebetsa oa liteishene tse peli o eketsa ts'ebeliso ea lisebelisoa ka 70%, athe sistimi ea tekano ea pono (CCD boemo bo nepahetseng: ± 2μm) e etsa hore e be e loketseng bakeng sa tlhahiso e kholo ea likarolo tsa khalase tse kobehileng tsa 3D (mohlala, khalase ea sekoaelo sa smartphone, lilense tsa smartwatch) indastering ea lisebelisoa tsa elektroniki tsa bareki. Sistimi e kenyelletsa li-module tsa ho jarolla / ho laolla, tse tšehetsang tlhahiso e tsoelang pele ea 24/7.

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Parameter e kholo

Mofuta oa Laser	Infrared Picosecond
Boholo ba Sethala	700×1200 (mm)
	900×1400 (mm)
Botenya ba ho Seha	0.03-80 (mm)
Ho poma Lebelo	0-1000 (mm/s)
Karohano ea Khale	<0.01 (mm)
Tlhokomeliso: Boholo ba sethala bo ka etsoa ka mokhoa o ikhethileng.

Likarolo tsa Bohlokoa

1.Theknoloji ea Ultrafast Laser:
· Maqhubu a makhutšoane a boemo ba Picosecond (10⁻¹²s) a kopantsoeng le theknoloji ea tokiso ea MOPA a fihlella matla a mangata a matla >10¹² W/cm².
· Infrared wavelength (1064nm) e kenella ka har'a lisebelisoa tse bonaletsang ka ho monya ka mokhoa o sa tsitsang, ho thibela ho ntšoa ha bokaholimo.
· Proprietary multi-focus optical system e hlahisa libaka tse 'ne tse ikemetseng tsa ts'ebetso ka nako e le ngoe.

2.Sistimi ea Kamahanyo ea liteishene tse peli:
· Granite-base dual linear motor stages (ho nepahala ha maemo: ±1μm).
· Nako ea ho fetola seteishene <0.8s, e nolofalletsang ts'ebetso ea "processing-loading/download".
· Taolo e ikemetseng ea mocheso (23±0.5 ° C) seteisheneng ka seng e netefatsa botsitso ba nako e telele ba mochini.

3.Intelligent Process Control:
* Sebaka sa polokelo ea thepa se kopantsoeng (likhasete tse 200+) bakeng sa ho tsamaisana le paramethara.
· Tlhahlobo ea nako ea sebele ea plasma e fetola matla a laser ka matla (tharollo ea phetoho: 0.1mJ).
· Tšireletso ea lesira la moea e fokotsa mapetsong a manyenyane (<3μm).
Tabeng e tloaelehileng ea kopo e kenyelletsang 0.5mm-thick sapphire wafer dicing, tsamaiso e finyella lebelo la ho itšeha la 300mm / s ka litekanyo tsa ho phunya <10μm, e emelang ntlafatso ea 5x ho feta mekhoa ea setso.

Melemo ea ho sebetsa

1.Integrated dual-station cutting and splitting system for flexible operation;
2.Ho sebetsa ka lebelo le phahameng la li-geometri tse rarahaneng ho matlafatsa ts'ebetso ea phetoho ea ts'ebetso;
3.Taper-free cutting edges with minimal chipping (<50μm) le ts'ebetso e sireletsehileng ea opareitara;
Phetoho ea 4.Seamless pakeng tsa lihlahisoa tsa lihlahisoa tse nang le ts'ebetso e utloahalang;
5.Litšenyehelo tse tlase tsa ts'ebetso, litefiso tse phahameng tsa chai, ts'ebetso e se nang tšebeliso le ts'ilafalo;
6.Zero tlhahiso ea slag, litšila tse metsi kapa metsi a litšila ka botšepehi bo tiisitsoeng ba holim'a metsi;

Pontšo ea mohlala

Infrared picosecond dual-platform glass laser cutting equipment 5

Lisebelisoa tse Tloaelehileng

1.Consumer Electronics Manufacturing:
· Ho itšeha ka mokhoa o nepahetseng oa khalase ea sekoaelo sa smartphone 3D (ho nepahala ha R-angle: ± 0.01mm).
· Ho phunya masoba a manyenyane ka lilense tsa oache ea safire (bonyane aperture: Ø0.3mm).
· Ho phethela libaka tse fetisoang ka likhalase tsa optical bakeng sa lik'hamera tse sa bonts'itsoeng hantle.

Tlhahiso ea 2.Optical Component:
· Microstructure machining bakeng sa lihlopha tsa lense tsa AR/VR (boholo ba tšobotsi ≥20μm).
· Ho itšeha ka mahlakoreng a mabeli a li-quartz bakeng sa laser collimators (ho mamellana ha angular: ± 15").
· Sebopeho sa profil ea li-filters tsa infrared (taper e sehang <0.5 °).

3.Semiconductor Packaging:
· Khalase ka tsela (TGV) e sebetsa maemong a liphaephe (karolelano ea 1:10).
· Microchannel etching holim'a likhalase substrates bakeng sa microfluidic chips (Ra <0.1μm).
· Ho fokotsa makhetlo a mangata bakeng sa li-resonator tsa quartz tsa MEMS.

Bakeng sa tlhahiso ea lifensetere tsa optical tsa LiDAR tsa koloi, sisteme e thusa ho seha likhalase tsa quartz tse botenya ba 2mm ka mokhoa o sehiloeng oa 89.5 ± 0.3 °, ho fihlela litlhoko tsa tlhahlobo ea vibrate ea boemo ba likoloi.

Ts'ebetso ea Ts'ebetso

E etselitsoe ka ho khetheha bakeng sa ho itšeha ka nepo ea lisebelisoa tse brittle / tse thata ho kenyelletsa:
1.Khalase e tloaelehileng & likhalase tsa optical (BK7, silica e kopantsoeng);
2. Likristale tsa quartz & substrates tsa safire;
3. Khalase e futhumetseng le li-filters tsa optical
4. Li-substrates tsa seipone
E khona ho cheka likoti ka bobeli le ho cheka mekoti e ka hare (bonyane Ø0.3mm)

Laser Cutting Molao-motheo

Laser e hlahisa li-pulse tsa ultrashort tse nang le matla a phahameng haholo a hokahanang le sesebelisoa sa mosebetsi ka har'a li-timescales tsa femtosecond-to-picosecond. Nakong ea ho phatlalatsoa ka thepa, sefate se senya sebopeho sa sona sa khatello ea kelello ho etsa likoti tsa micron-scale filamentation. Optimized hole spacing hlahisa li-micro-cracks tse laoloang, tse kopanang le theknoloji ea ho phunya ho finyella karohano e nepahetseng.

Laser Cutting Melemo

1.High automation integration (ts'ebetso e kopantsoeng ea ho itšeha / ho phunya) ka tšebeliso e tlaase ea matla le ts'ebetso e bonolo;
Ts'ebetso ea 2.Non-contact e nolofalletsa bokhoni bo ikhethang bo ke keng ba finyelloa ka mekhoa e tloaelehileng;
Ts'ebetso ea 3.Consumable-free e fokotsa litšenyehelo tsa ho tsamaisa le ho ntlafatsa ts'ebetso ea tikoloho;
4.Superior e nepahetseng ka zero taper angle le ho felisa tšenyo ea mosebetsi oa bobeli;
XKH e fana ka lits'ebeletso tse felletseng tsa ho ikamahanya le maemo bakeng sa litsamaiso tsa rona tsa ho itšeha ka laser, ho kenyeletsoa tlhophiso ea sethala, nts'etsopele e ikhethileng ea ts'ebetso, le litharollo tse ikhethileng tsa ts'ebeliso ho fihlela litlhoko tse ikhethang tsa tlhahiso ho pholletsa le liindasteri tse fapaneng.