Sistimi ea ho Seha Laser e Tataisoang ke Metsi ea Microjet bakeng sa Lisebelisoa tse Tsoetseng Pele

Microjet Water-Guided Laser Cutting System for Advanced Materials Featured Image

Tlhaloso e Khutšoanyane:

Kakaretso:

Ha liindasteri li ntse li tsoela pele ho ea ho li-semiconductors tse tsoetseng pele le lisebelisoa tse sebetsang ka bongata, tharollo ea machining e nepahetseng empa e le bonolo e ba ea bohlokoa. Sistimi ena e tsamaisoang ke metsi ea microjet e tsamaisoang ke metsi e entsoe ka ho khetheha bakeng sa mesebetsi e joalo, e kopanyang boemo bo tiileng ba Nd: YAG theknoloji ea laser e nang le kotopo e phahameng ea khatello ea metsi ea microjet, e fanang ka matla ka ho nepahala ho feteletseng le khatello e tlase ea mocheso.

E ts'ehetsa 532nm le 1064nm wavelengths ka tlhophiso ea matla ea 50W, 100W, kapa 200W, sistimi ena ke tharollo ea katleho bakeng sa bahlahisi ba sebetsang ka lisebelisoa tse kang SiC, GaN, daemane le metsoako ea ceramic. E loketse hantle haholo mesebetsi ea ho etsa lintho tsa elektroniki, sefofane, optoelectronics le likarolo tse hloekileng tsa matla.

Re romelle lengolo-tsoibila

Likaroloana

Top Melemo

1. Tsepamiso ea Matla e ke keng ea Baptjoa ka Tataiso ea Metsi
Ka ho sebelisa jete ea metsi e hatelitsoeng hantle e le leqhubu la laser waveguide, sistimi e felisa tšitiso ea moea mme e netefatsa ho tsepamisa maikutlo ho felletseng ka laser. Sephetho ke bophara bo sehiloeng ka mokhoa o moqotetsane - bo nyane joalo ka 20μm - bo nang le mapheo a bohale, a hloekileng.

2. Minimal Thermal Footprint
Taolo ea nako ea 'nete ea mocheso ea sistimi e netefatsa hore sebaka se anngoeng ke mocheso ha se fete 5μm, se bohlokoa bakeng sa ho boloka ts'ebetso ea thepa le ho qoba li-microcracks.

3. Bophara ba Material Compatibility
Phatlalatso ea maqhubu a mabeli (532nm/1064nm) e fana ka tokiso e ntlafalitsoeng ea ho monya, e etsa hore mochini o ikamahanye le mefuta e fapaneng ea li-substrates, ho tloha ho likristale tse bonaletsang ho isa ho lirafshoa tse opaque.

4. Lebelo le Phahameng, Taolo ea Motion ea Phahameng ka ho Fetisisa
Ka likhetho tsa li-motor tse tsamaeang ka kotloloho le tse otlolohileng, sistimi e ts'ehetsa litlhoko tse phahameng ntle le ho senya ho nepahala. Ho sisinyeha ha li-axis tse hlano ho thusa hape ho etsa mokhoa o rarahaneng oa ho etsa lipaterone le ho fokotsa likarolo tse ngata.

5. Moqapi oa Modular le Scalable
Basebelisi ba ka hlophisa litlhophiso tsa sistimi ho ipapisitse le litlhoko tsa ts'ebeliso - ho tloha ho prototyping e thehiloeng ho lab ho isa lits'ebetsong tsa tekanyo ea tlhahiso-ho etsa hore e tšoanelehe hohle libakeng tsa R&D le tsa indasteri.

Libaka tsa Kopo

Li-Semiconductors tsa Moloko oa Boraro:
E nepahetse bakeng sa li-wafers tsa SiC le GaN, sistimi e etsa dicing, trenching le slicing ka bots'epehi bo ikhethang.

Diamond le Oxide Semiconductor Machining:
E sebelisetsoa ho seha le ho cheka lisebelisoa tse thata haholo joalo ka daemane ea kristale e le 'ngoe le Ga₂O₃, e se nang carbonization kapa thermal deformation.

Likarolo tse Tsoetseng Pele tsa Sefofane:
E ts'ehetsa sebopeho sa sebopeho sa li-composite tsa ceramic tse matla haholo le li-superalloys bakeng sa enjine ea jete le likarolo tsa satellite.

Lisebelisoa tsa Photovoltaic le Ceramic:
E nolofalletsa ho seha li-wafers tse tšesaane tse se nang li-burr le li-substrate tsa LTCC, ho kenyeletsoa likoti le li-slot milling bakeng sa likhokahano.

Li-scintillators le likarolo tsa Optical:
E boloka boreleli le phetisetso ea thepa ea optical e senyehang joalo ka Ce: YAG, LSO, le tse ling.

Tlhaloso

Sebopeho	Tlhaloso
Mohloli oa Laser	DPSS Nd:YAG
Likhetho tsa Wavelength	532nm / 1064nm
Maemo a Matla	50/100/200 Watts
Nepahalo	±5μm
Khaola Bophara	E moqotetsane joalo ka 20μm
Sebaka se Ametsoeng ke Mocheso	≤5μm
Mofuta oa Motsamao	Linear / Direct Drive
Lisebelisoa tse Tšehetsoeng	SiC, GaN, Diamond, Ga₂O₃, joalo-joalo.

Ke Hobane'ng ha U Khetha Sisteme ee?

● E felisa mathata a tloaelehileng a laser machining joalo ka ho phatloha ha mocheso le ho phunya
● E ntlafatsa tlhahiso le botsitso bakeng sa thepa ea theko e phahameng
● E khona ho ikamahanya le maemo bakeng sa tšebeliso ea lifofane le indasteri
● Sethala sa bopaki ba bokamoso bakeng sa mahlale a ntlafatso a thepa

Q&A

Q1: Ke lisebelisoa life tse ka sebetsang tsamaisong ee?
A: Sistimi e etselitsoe lisebelisoa tse thata le tse brittle tsa boleng bo holimo. E ka sebetsana ka katleho le silicon carbide (SiC), gallium nitride (GaN), diamond, gallium oxide (Ga₂O₃), LTCC substrates, aerospace composite, photovoltaic wafers, le scintillator crystals tse kang Ce: YAG kapa LSO.

Q2: Theknoloji ea laser e tataisoang ke metsi e sebetsa joang?
A: E sebelisa microjet ea metsi e nang le khatello e phahameng ho tataisa lebone la laser ka ponahatso e felletseng ea kahare, e tsamaisa matla a laser ka mokhoa o atlehileng ka ho hasanya ho fokolang. Sena se tiisa ho tsepamisa maikutlo ho hoholo, mojaro o tlase oa mocheso, le ho fokotsa ho nepahala ka bophara ba mela ho fihla ho 20μm.

Q3: Litlhophiso tsa matla a laser tse fumanehang ke life?
A: Bareki ba ka khetha ho tloha ho 50W, 100W, le 200W khetho ea matla a laser ho itšetlehile ka lebelo la bona la ho sebetsa le litlhoko tsa tharollo. Likhetho tsohle li boloka botsitso bo phahameng ba mabone le ho pheta-pheta.