Multi-Wire Diamond Sawing Machine bakeng sa SiC Sapphire Ultra-Hard Brittle Materials
Kenyelletso ea Multi-Wire Diamond Sawing Machine
Mochini oa ho sakha oa litaemane o nang le lithapo tse ngata ke mokhoa oa morao-rao oa ho seha o etselitsoeng ho sebetsana le thepa e thata haholo le e brittle. Ka ho kenya lithapo tse ngata tse tšoanang tse koahetsoeng ka daemane, mochini o ka khaola liphaephe tse ngata ka nako e le 'ngoe, oa fumana lisebelisoa tse phahameng le tse nepahetseng. Theknoloji ena e fetohile sesebelisoa sa bohlokoa liindastering tse kang semiconductors, photovoltaics ea letsatsi, li-LED, le li-ceramics tse tsoetseng pele, haholo-holo bakeng sa lisebelisoa tse kang SiC, safire, GaN, quartz le alumina.
Ha ho bapisoa le mokhoa o tloaelehileng oa ho seha oa terata e le 'ngoe, tlhophiso ea terata e mengata e fana ka lilae tse makholo ho isa ho tse makholo ka batch, e fokotsa haholo nako ea potoloho ha e ntse e boloka ho bata haholo (Ra <0.5 μm) le ho nepahala ha dimensional (± 0.02 mm). Moralo oa eona oa modular o kopanya tsitsipano ea mohala e ikemetseng, lits'ebetso tsa ho sebetsana le lisebelisoa tsa mosebetsi, le ho lekola marang-rang, ho netefatsa tlhahiso ea nako e telele, e tsitsitseng le e ikemetseng ka botlalo.
Mekhoa ea Teknoloji ea Mochini oa Sawing oa Diamond oa Multi-Wire
| Ntho | Tlhaloso | Ntho | Tlhaloso |
|---|---|---|---|
| Boholo ba boholo ba mosebetsi (Sekwere) | 220 × 200 × 350 limilimithara | Khanna enjene | 17.8 kW × 2 |
| Boholo ba boholo ba mosebetsi (Ho potoloha) | Φ205 × 350 limilimithara | Mohala oa terata | 11.86 kW × 2 |
| Karohano ea li-spindle | Φ250 ±10 × 370 × 2 axis (mm) | Enjene ea ho phahamisa e sebetsang | 2.42 kW × 1 |
| Axis e ka sehloohong | 650 limilimithara | Enjene ea swing | 0.8 kW × 1 |
| Lebelo la terata | 1500 m/min | Motlakase oa ho hlophisa | 0.45 kW × 2 |
| Wire bophara | Φ0.12–0.25 limilimithara | Tension motor | 4.15 kW × 2 |
| Phahamisa lebelo | 225 mm/min | Enjene e seretse | 7.5 kW × 1 |
| Max. ho potoloha ha tafole | ±12° | Bokhoni ba tanka ea seretse | 300 L |
| Swing angle | ±3° | Phallo e phodileng | 200 L/min |
| Leqhubu la ho sisinyeha | ~ 30 linako/mots | Temp. nepahalo | ±2 °C |
| Sekhahla sa phepelo | 0.01–9.99 mm/mots | Phepelo ea motlakase | 335+210 (mm²) |
| Sekhahla sa phepelo ea mohala | 0.01–300 mm/min | Moea o petelitsoeng | 0.4–0.6 MPa |
| Boholo ba mochini | 3550 × 2200 × 3000 limilimithara | Boima ba 'mele | 13,500 lik'hilograma |
Mokhoa o Sebetsang oa Mochini oa Sawing oa Diamond o nang le Wire Multi-Wire
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Multi-Wire Cutting Motion
Lithapo tse ngata tsa litaemane li tsamaea ka lebelo le hokahaneng ho fihla ho 1500 m/min. Li-pulleys tse tataisoang ka mokhoa o nepahetseng le taolo ea tsitsipano e koetsoeng (15-130 N) li boloka lithapo li tsitsitse, li fokotsa monyetla oa ho kheloha kapa ho robeha. -
Fepa e Nepahetseng & Maemo
Boemo bo tsamaisoang ke servo bo fihlella ho nepahala ha ± 0.005 mm. Laser ka boikhethelo kapa ka thuso ea pono ho ntlafatsa sephetho sa libopeho tse rarahaneng. -
Ho Pholisa le ho Tlosa Lithōle
Sepholisa se nang le khatello e phahameng se tsoela pele ho tlosa li-chips le ho pholisa sebaka sa mosebetsi, ho thibela tšenyo ea mocheso. Ho sefa ka mekhahlelo e mengata ho eketsa bophelo bo pholileng le ho fokotsa nako ea ho phomola. -
Smart Control Platform
Bakhanni ba servo ba arabelang haholo (<1 ms) ba fetola phepelo, tsitsipano le lebelo la terata ka matla. Taolo e kopaneng ea diresepe le ho penya ha 'ngoe paramethareng e tsamaisa tlhahiso ea bongata.
Melemo ea Konokono ea Mochini oa Sawing oa Diamond oa Multi Wire
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Tlhahiso e Phahameng
E khona ho khaola li-wafers tse 50-200 ka ho matha, ka tahlehelo ea kerf <100 μm, ho ntlafatsa tšebeliso ea thepa ho fihlela ho 40%. Phallo ke 5–10× ea mekhoa e tloaelehileng ea terata e le 'ngoe. -
Taolo e nepahetseng
Ho tsitsisa ha terata ka har'a ± 0.5 N ho netefatsa liphetho tse tsitsitseng ho lisebelisoa tse fapaneng tsa brittle. Tlhokomelo ea nako ea 'nete ho sebopeho sa 10" HMI e ts'ehetsa polokelo ea risepe le ts'ebetso e hole. -
Tenyetseha, Modular Build
E lumellana le bophara ba terata ho tloha ho 0.12-0.45 mm bakeng sa mekhoa e fapaneng ea ho itšeha. Ho ikhethela ho sebetsana le liroboto ho lumella mela ea tlhahiso e ikemetseng ka botlalo. -
Tšepahalang ea Mophato oa Liindasteri
Liforeimi tse nang le mosebetsi o boima / tse ferekaneng li fokotsa ho senyeha (<0.01 mm). Li-pulleys tsa tataiso tse nang le liphahlo tsa ceramic kapa carbide li fana ka lihora tse fetang 8000 tsa bophelo ba ts'ebeletso.
Libaka tsa Kopo tsa Mochini oa Sawing oa Diamond oa Multi-Wire
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Li-semiconductors: Ho khaola SiC bakeng sa li-module tsa motlakase tsa EV, li-substrates tsa GaN bakeng sa lisebelisoa tsa 5G.
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Photovoltaics: Sekoahelo sa silicon sa lebelo le phahameng se nang le ± 10 μm ho tšoana.
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LED & Optics: Li-substrates tsa Sapphire bakeng sa epitaxy le likarolo tse nepahetseng tsa optical tse nang le <20 μm edge chipping.
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Li-Ceramics tse tsoetseng pele: Ts'ebetso ea alumina, AlN, le lisebelisoa tse ts'oanang bakeng sa likarolo tsa taolo ea sepakapaka le mocheso.
FAQ - Multi-Wire Diamond Sawing Machine
Q1: Melemo ea ho seha mehala e mengata ha e bapisoa le mechini ea terata e le 'ngoe ke efe?
A: Sistimi ea lithapo tse ngata e ka arola li-wafers tse ngata ho isa ho tse makholo ka nako e le 'ngoe, tsa eketsa katleho ka 5-10×. Tšebeliso ea thepa e boetse e phahame ka tahlehelo ea kerf e ka tlase ho 100 μm, e etsa hore e be e loketseng bakeng sa tlhahiso ea bongata.
Q2: Ke mefuta efe ea thepa e ka sebetsoang?
A: Mochine o etselitsoe lisebelisoa tse thata le tse brittle, ho akarelletsa le silicon carbide (SiC), safire, gallium nitride (GaN), quartz, alumina (Al₂O₃), le aluminium nitride (AlN).
Q3: Ho nepahala ho ka finyelloang le boleng ba bokaholimo ke bofe?
A: Bokhopo bo ka holimo bo ka fihla Ra <0.5 μm, ka ho nepahala ha dimensional ± 0.02 mm. Edge chipping e ka laoloa ho <20 μm, ho kopana le semiconductor le litekanyetso tsa indasteri ea optoelectronic.
Q4: Na mokhoa oa ho itšeha o baka mapetsong kapa a senya?
A: Ka taolo e phahameng ea khatello e pholileng le e koalehileng, kotsi ea li-micro-cracks le tšenyo ea khatello ea maikutlo e fokotsehile, ho netefatsa botšepehi bo botle ba wafer.
