Khalase e fetoha ka potlakothepa ea sethalabakeng sa mebaraka ea bofelo e etelletsoeng pele kelitsi tsa datalepuisano ea mohalaKa hare ho litsi tsa data, e tšehetsa lijari tse peli tsa bohlokoa tsa ho paka:meralo ea li-chipletlhahiso/tlhahiso ea optical (I/O).
Eonacoefficient e tlase ea katoloso ea mocheso (CTE)ledijari tsa khalase tse tsamaellanang le ultraviolet e tebileng (DUV)li nolofalitsetlamo e kopantsoengleTs'ebetso ea 300 mm ea wafer e tšesaane ka moraoho ba phallo e tloaelehileng ea tlhahiso.
Ha di-module tsa switch le accelerator di ntse di hola ka nqane ho boholo ba wafer-stepper,bajari ba phanelee se e le ea bohlokoa haholo. 'Maraka oali-substrate tsa mantlha tsa khalase (GCS)ho lebelletsoe hore e tla fihlaLidolara tse limilione tse 460 ka 2030, ka diponelopele tse nang le tšepo tse bontšang hore ho tla amoheloa batho ba bangata2027–2028. Ho sa le jwalo,li-interposer tsa khalaseho lebeletsoe hore ho feteLidolara tse limilione tse 400esita le tlas'a likhakanyo tsa tlhokomelo e hlokolosi, lekarolo e tsitsitseng ea sesebelisoa sa ho jara khalasee emela 'maraka oa hoo e ka bangLidolara tse limilione tse 500.
In sephutheloana se tsoetseng pele, khalase e fetohile ho tloha ho ba karolo e bonolo ho ea ho bakhoebo ea sethalaBakeng salijari tsa khalasetlhahiso ea chelete e ntse e fetoha ho tloha hoLitheko tsa phanele ka 'ngoe to moruo ka potoloho, moo phaello e itšetlehileng kasebelisa lipotoloho hape, Liphetho tsa ho tlosa bond ka laser/UV, tlhahiso ea ts'ebetsolephokotso ea tšenyo e ka lehlakoreng. . Tjhelete ena e matlafatsang e thusa bafepedi ba fanang ka yonaLi-portfolio tse nang le maemo a CTE, bafani ba liphutheloanaho rekisa mekotla e kopaneng easejanari + sekhomaretsi/LTHC + debondlebarekisi ba ho khutlisa thepa sebakeng seoe ikhethang ka netefatso ea boleng ba mahlo.
Likhamphani tse nang le boiphihlelo bo tebileng ba khalase—joalo kaMoralo oa Optik, e tsebahalang ka eonabajari ba bataletseng hahololeli-geometri tsa moeli tse entsoeng ka boenjinierelephetiso e laoloang—di behilwe hantle ketaneng ena ya boleng.
Lisebelisoa tsa mantlha tsa khalase joale li notlolla bokhoni ba tlhahiso ea liphanele tsa ponts'o hore e be phaello kaTGV (Ka Glass Via), RDL e ntle (Lera la Kabo Bocha)lemekhoa ea ho hahaBaetapele ba 'maraka ke bao ba tsebang ho sebetsana le li-interface tsa bohlokoa:
-
Ho cheka/ho fata TGV ka chai e phahameng
-
Ho tlatsa koporo ntle le letho
-
Lithography ea phanele e nang le ho lumellana ho ikamahanyang le maemo
-
2/2 µm L/S (mola/sebaka)ho etsa dipaterone
-
Mahlale a ho sebetsana le phanele a laoloang ka ho kobeha
Barekisi ba substrate le ba OSAT ba sebelisanang le bahlahisi ba likhalase tsa ponts'o ba ntse ba fetolabokgoni ba sebaka se seholoka hare homelemo ea litšenyehelo bakeng sa ho paka ka phanele.
Ho tloha ho Carrier ho ea ho Lisebelisoa tsa Platform tse Felletseng
Khalase e fetohile ho tloha homojari oa nakoanaho kena hosethala se felletseng sa thepabakeng sasephutheloana se tsoetseng pele, e lumellanang le mekhoa e meholo e kangkopanyo ea chiplet, ho etsa liphanele, ho bokella ka ho otlolohaletlamo e kopantsoeng—ha ka nako e ts'oanang ho ntse ho thatafatswa ditekanyetso tsamechine, mochesolekamore ea ho hlwekisatshebetso.
E lemojari(ka bobeli wafer le phanele),khalase e bonaletsang, e nang le CTE e tlasee nolofalletsaho lokisa khatello ea maikutlo ho fokolitsoengleho tlosa bond ka laser/UV, ho ntlafatsa chai bakeng sali-wafer tse ka tlase ho 50 µm, phallo ea ts'ebetso ea lehlakore le ka moraoleliphanele tse tsosolositsoeng, ka hona ho fihlella bokgoni ba ho sebedisa ditjeo tse ngata.
E lesubstrate ea mantlha ea khalase, e nkela metsoako ea tlhaho sebaka le tšehetsotlhahiso ea maemo a phanele.
-
Li-TGVfana ka matla a teteaneng a otlolohileng le ho tsamaisa matshwao.
-
SAP RDLe sutumelletsa meeli ea wiring ho2/2 µm.
-
Libaka tse bataletseng, tse ka lokisoang ke CTEfokotsa warpage.
-
Ponaletso ea ponoe lokisetsa substrate bakeng saoptics e kopantsoeng hammoho (CPO).
Ho sa le jwalo,ho qhala ha mochesoliphephetso li rarolloa kalifofane tsa koporo, li-via tse rokeletsoeng, Marangrang a ho fana ka motlakase ka morao (BSPDN)lepholiso e mahlakore a mabeli.
E lesesebelisoa sa khalase, thepa ena e atleha tlas'a mekhoa e 'meli e fapaneng:
-
Mokhoa o sa sebetseng, e nolofalletsang meralo e meholo ea 2.5D AI/HPC le switch e fihlelang bongata ba lithapo le palo ea li-bump e ke keng ea fihlelloa ke silicon ka litšenyehelo tse tšoanang le sebaka.
-
Mokhoa o sebetsang, ho kopanyaSIW/lifilthara/li-antennaleliforo tse entsoeng ka tšepe kapa litataiso tsa maqhubu tse ngotsoeng ka laserka hare ho substrate, ho mena litsela tsa RF le ho tsamaisa I/O ea optical ho ea moeling ka tahlehelo e nyane.
Pono ea 'Maraka le Matla a Indasteri
Ho ea ka tlhahlobo ea morao-rao eaSehlopha sa Yole, thepa ea khalase e fetohilee bohareng ba phetohelo ea liphutheloana tsa semiconductor, e susumetsoang ke mekhoa e meholo hobohlale ba maiketsetso (AI), khomphutha e sebetsang hantle (HPC), Khokahano ea 5G/6Gleoptics e kopantsoeng hammoho (CPO).
Bahlahlobisisi ba hatisa hore khalasethepa e ikhethang—ho kenyeletsoa leCTE e tlase, botsitso bo phahameng ba tekanyolepepeneneng ea mahlo—etsa hore e be ea bohlokoa bakeng sa ho fihlelalitlhoko tsa mechine, tsa motlakase le tsa mochesoea liphutheloana tsa moloko o latelang.
Yole o tsoela pele ho hlokomela horelitsi tsa datalemehala ea puisanoe lule e lelienjineri tsa kholo ea mantlhabakeng sa ho amoheloa ha khalase ka har'a sephutheloana, halikoloi, tšireletsolelisebelisoa tsa elektroniki tsa bareki ba maemo a holimoMakala ana a itshetlehile haholo hodimakopanyo ea chiplet, tlamo e kopantsoengletlhahiso ea maemo a phanele, moo khalase e seng feela e ntlafatsang tshebetso empa hape e fokotsang ditjeo tsohle.
Qetellong, ho hlaha haliketane tse ncha tsa phepelo Asia—haholo-holo hoChaena, Korea Boroa le Japane—e tsebahala e le ntho ea bohlokoa e thusang ho holisa tlhahiso le ho matlafatsatikoloho ea lefats'e bakeng sa khalase e tsoetseng pele ea ho paka.
Nako ea poso: Mphalane-23-2025