Katleho e Kholo Theknolojing ea ho Phahamisa ea Laser ea Silicon Carbide ea lisenthimithara tse 12

Tafole ea likateng

1.​​Katleho e Kholo Theknolojing ea ho Phahamisa Laser ea Silicon Carbide ea lisenthimithara tse 12​​

2.​​Bohlokoa bo bongata ba katleho ea theknoloji bakeng sa nts'etsopele ea indasteri ea SiC​​

3.​​Litebello tsa Bokamoso: Tšebelisano-'moho e Felletseng ea Ntšetso-pele le Indasteri ea XKH​

Haufinyane tjena, Beijing Jingfei Semiconductor Technology Co., Ltd., moetsi ea ka sehloohong oa lisebelisoa tsa semiconductor tsa malapeng, e entse tsoelo-pele e kholo theknolojing ea ho sebetsana le li-wafer tsa silicon carbide (SiC). Khamphani e atlehile ho fihlela ho tlosoa ha li-wafer tsa silicon carbide tsa lisenthimithara tse 12 ka ho sebelisa lisebelisoa tsa eona tsa ho phahamisa laser tse entsoeng ka boikemelo. Phetoho ena e tšoaea mohato oa bohlokoa bakeng sa Chaena lefapheng la lisebelisoa tsa tlhahiso ea senotlolo sa semiconductor tsa moloko oa boraro 'me e fana ka tharollo e ncha bakeng sa phokotso ea litšenyehelo le ntlafatso ea bokhoni indastering ea lefats'e ea silicon carbide. Theknoloji ena e ne e se e netefalitsoe ke bareki ba bangata tšimong ea silicon carbide ea lisenthimithara tse 6/8, ka ts'ebetso ea lisebelisoa e fihlang maemong a tsoetseng pele a machabeng.

Tsoelo-pele ena ea theknoloji e na le bohlokoa bo bongata bakeng sa nts'etsopele ea indasteri ea silicon carbide, ho kenyeletsoa:

1. Phokotso e Kholo ea Litšenyehelo tsa Tlhahiso:Ha ho bapisoa le li-wafer tsa silicon carbide tse tloaelehileng tsa lisenthimithara tse 6, li-wafer tsa silicon carbide tsa lisenthimithara tse 12 li eketsa sebaka se fumanehang ka makhetlo a ka bang mane, e leng se fokotsang litšenyehelo tsa li-chip tsa yuniti ka 30%-40%.

2. Bokgoni bo Ntlafaditsweng ba Phepelo ya Indasteri:E sebetsana le mathata a tekheniki a ho sebetsana le wafer ya silicon carbide ya boholo bo boholo, e fana ka tshehetso ya disebediswa bakeng sa katoloso ya lefatshe ya bokgoni ba tlhahiso ya silicon carbide.

3. Ts'ebetso e Potlakileng ea ho Nkela Sebaka Sebaka​​:E roba taolo ea theknoloji ea lik'hamphani tsa kantle ho naha lefapheng la lisebelisoa tse kholo tsa ho sebetsana le silicon carbide, e fana ka tšehetso ea bohlokoa bakeng sa nts'etsopele e ikemetseng le e laoloang ea lisebelisoa tsa semiconductor tsa Chaena.

4. ​​Khothaletso ea ho Tumme ha Ts'ebeliso e Tlase:Phokotso ea litšenyehelo e tla potlakisa ts'ebeliso ea lisebelisoa tsa silicon carbide masimong a bohlokoa joalo ka likoloi tse ncha tsa eneji le matla a nchafatsoang.

Beijing Jingfei Semiconductor Technology Co., Ltd. ke kgwebo ya Setsi sa Semiconductors sa Chinese Academy of Sciences, se shebaneng le dipatlisiso le ntshetsopele, tlhahiso le thekiso ya disebediswa tse ikgethang tsa semiconductor. Ka theknoloji ya tshebediso ya laser motheong wa yona, khamphani e thehile letoto la disebediswa tsa ho sebetsana le semiconductor tse nang le ditokelo tsa thepa ya kelello tse ikemetseng, tse sebeletsang bareki ba ka sehloohong ba tlhahiso ya semiconductor ya malapeng.

CEO oa Jingfei Semiconductor o itse, “Kamehla re khomarela boqapi ba theknoloji ho khanna tsoelo-pele ea indasteri. Ntshetsopele e atlehileng ea theknoloji ea silicon carbide laser lift-off ea lisenthimithara tse 12 ha se feela pontšo ea bokhoni ba botekgeniki ba k'hamphani empa hape e rua molemo tšehetsong e matla ea Khomishene ea Saense le Theknoloji ea Masepala ea Beijing, Setsi sa Li-Semiconductors sa Sekolo sa Mahlale sa Chaena, le projeke ea bohlokoa e ikhethang ea 'Disruptive Technological Innovation' e hlophisitsoeng le ho kenngoa tšebetsong ke Setsi sa Naha sa Boqapi ba Theknoloji sa Beijing-Tianjin-Hebei. Nakong e tlang, re tla tsoela pele ho eketsa matsete a R&D ho fa bareki litharollo tse ling tsa lisebelisoa tsa semiconductor tsa boleng bo holimo.”

Qetello

Ha re sheba pele, XKH e tla sebelisa pokello ea eona e felletseng ea lihlahisoa tsa silicon carbide substrate (e koahelang lisenthimithara tse 2 ho isa ho tse 12 ka bokhoni ba ho kopanya le ho sebetsana le lintho tse ikhethileng) le theknoloji ea lintho tse ngata (ho kenyeletsoa 4H-N, 4H-SEMI, 4H-6H/P, 3C-N, jj.) ho sebetsana ka mafolofolo le phetoho ea theknoloji le liphetoho tsa 'maraka indastering ea SiC. Ka ho ntlafatsa chai ea wafer khafetsa, ho fokotsa litšenyehelo tsa tlhahiso, le ho tebisa tšebelisano-'moho le bahlahisi ba lisebelisoa tsa semiconductor le bareki ba ho qetela, XKH e ikemiselitse ho fana ka litharollo tsa substrate tse sebetsang hantle le tse tšepahalang haholo bakeng sa matla a macha a lefats'e, lisebelisoa tsa elektroniki tse nang le motlakase o phahameng, le lits'ebetso tsa indasteri tse nang le mocheso o phahameng. Re ikemiselitse ho thusa bareki ho hlola litšitiso tsa tekheniki le ho fihlela ho kenngoa ha thepa ka mokhoa o ka atolosoang, re ipeha boemong ba molekane oa mantlha oa thepa ea bohlokoa ketane ea boleng ba SiC.