Melemo eaKa Glass Via (TGV)le ka Silicon Via(TSV) lits'ebetso tse fetang TGV haholo-holo:
(1) litšobotsi tse ntle tsa motlakase oa maqhubu a phahameng. Lisebelisoa tsa khalase ke thepa ea insulator, "dielectric constant" e ka bang 1/3 feela ea thepa ea silicon, 'me ntlha ea tahlehelo ke 2-3 ea boholo bo tlase ho feta ea thepa ea silicon, e etsang hore tahlehelo ea substrate le liphello tsa parasitic li fokotsehe haholo. mme e netefatsa botshepehi ba letshwao le fetisoang;
(2)boholo bo boholo le substrate ea khalase e tšesaane haholoho bonolo ho e fumana. Corning, Asahi le SCHOTT le bahlahisi ba bang ba likhalase ba ka fana ka boholo bo boholo bo boholo (> 2m × 2m) le khalase ea khalase e tšesaane haholo (<50µm) le lisebelisoa tsa khalase tse tenyetsehang haholo.
3) Theko e tlaase. Ho rua molemo ho tsoa ho phihlello e bonolo ea khalase ea boholo bo boholo bo tšesaane haholo, 'me ha e hloke hore ho behoe likarolo tsa insulating, theko ea tlhahiso ea poleiti ea adaptara ea khalase e ka ba 1/8 feela ea poleiti ea adaptara e thehiloeng ka silicon;
4) Mokhoa o bonolo. Ha ho na tlhokahalo ea ho kenya lera la insulating holim'a substrate le lebota le ka hare la TGV, 'me ha ho hlokahale hore ho fokotsehe ka har'a poleiti ea adapter e tšesaane haholo;
(5) Botsitso bo matla ba mechine. Le ha botenya ba poleiti ea adaptara bo ka tlase ho 100µm, warpage e ntse e le nyane;
(6) Mefuta e mengata ea likopo, ke theknoloji e ntseng e tsoela pele ea ho hokahanya ha nako e telele e sebelisoang tšimong ea liphutheloana tsa liphaephe, ho finyella sebaka se sekhutšoanyane ka ho fetisisa pakeng tsa sephaphatha-sephaphatha, tekanyo e fokolang ea ho hokahanya e fana ka tsela e ncha ea theknoloji, e nang le motlakase o babatsehang. , thepa ea mocheso, ea mechine, ka chip ea RF, li-sensor tsa MEMS tse phahameng, ho kopanya tsamaiso ea methapo e phahameng le libaka tse ling tse nang le melemo e ikhethang, ke moloko o latelang oa 5G, 6G high-frequency chip 3D Ke e 'ngoe ea likhetho tsa pele bakeng sa pakete ea 3D ea li-chips tsa 5G tsa moloko o latelang le 6G tse phahameng haholo.
Mokhoa oa ho bopa oa TGV haholo-holo o kenyelletsa sandblasting, ho cheka ka ultrasonic, etching e metsi, etching e tebileng ea ion e sebetsang, etching ea photosensitive, laser etching, laser-induced etching etching, le ho tsepamisa mohopolo oa lesoba la ho ntša metsi.
Liphetho tsa morao-rao tsa lipatlisiso le nts'etsopele li bonts'a hore thekenoloji e ka itokisetsa ka likoti le likoti tse foufetseng tsa 5: 1 tse nang le karo-karolelano ea botebo le bophara ba 20: 1, 'me e na le morphology e ntle. Laser induced deep etching, e fellang ka mahoashe a manyane a holim'a metsi, ke mokhoa o ithutoang ka ho fetisisa hajoale. Joalo ka ha ho bonts'itsoe ho Setšoantšo sa 1, ho na le mapetsong a hlakileng a pota-potileng ho cheka ka laser e tloaelehileng, ha mabota a pota-potileng le a mahlakoreng a etching e tebileng e bakoang ke laser a hloekile ebile a boreleli.
Mokhoa oa ho sebetsa oaTGVinterposer e bonts'itsoe ho Setšoantšo sa 2. Morero oa kakaretso ke ho phunya masoba holim'a karoloana ea khalase pele, ebe u kenya mokoallo oa mokoallo le lera la peo leboteng le lehlakoreng le holimo. The mokoallo lera thibela ho ajoa ha Cu ho substrate khalase, ha a ntse a eketsa adhesion tsa tse peli, ya e le hantle, lithutong tse ling o ile a boela a fumana hore mokoallo lera ha ho hlokahale. Ebe Cu e kenngoa ka electroplating, ebe e annealed, 'me Cu layer e tlosoa ke CMP. Qetellong, RDL rewiring layer e lokiselitsoe ke PVD coating lithography, 'me sekhahla sa passivation se thehoa ka mor'a hore sekhomaretsi se tlosoe.
(a) Ho lokisoa ha sephaphatha, (b) ho thehoa ha TGV, (c) electroplating ka mahlakoreng a mabeli - deposition ea koporo, (d) annealing le CMP chemical-mechanical polishing, ho tlosoa ha lesela la koporo holim'a metsi, (e) PVD coating le lithography , (f) ho behoa ha RDL rewiring layer, (g) degluing le Cu / Ti etching, (h) sebopeho sa passivation layer.
Ho phethela,khalase ka lesoba (TGV)tebello ea kopo e pharaletseng, 'me' maraka oa hona joale oa lehae o boemong bo ntseng bo phahama, ho tloha ho thepa ho ea ho moralo oa lihlahisoa le lipatlisiso le sekhahla sa kholo ea tsoelo-pele se phahame ho feta karolelano ea lefats'e.
Haeba ho na le tlolo ea molao, hlakola lebitso
Nako ea poso: Jul-16-2024