Sefate sa TTV, Seqha, Warp, le Li Lekanngoa Joang?

.Bukana

1. Mehopolo ea Bohlokoa le Litekanyo​​

2. Mekhoa ea ho Lekanya​​

3.​​Ts'ebetso ea Lintlha le Liphoso​​

4. Litlamorao tsa Ts'ebetso​

Tlhahisong ea semiconductor, ho tšoana ha botenya le ho batalla ha bokaholimo ba li-wafer ke lintlha tsa bohlokoa tse amang chai ea ts'ebetso. Liparamente tsa bohlokoa tse kang Total Thickness Variation (TTV), Bow (arcuate warpage), Warp (global warpage), le Microwarp (nano-topography) li ama ka kotloloho ho nepahala le botsitso ba lits'ebetso tsa mantlha joalo ka ho tsepamisa maikutlo ho photolithography, chemical mechanical polishing (CMP), le thin-film deposition.

 

Mehopolo ea Motheo le Litekanyo

TTV (Phetoho e Felletseng ea Botenya)​

TTV e bua ka phapang e kholo ka ho fetisisa ea botenya ho pholletsa le bokaholimo bohle ba wafer ka har'a sebaka se hlalositsoeng sa tekanyo ea Ω (hangata ho sa kenyeletsoe libaka tsa ho tlosa moeli le libaka tse haufi le li-notches kapa li-flat). Ho ea ka lipalo, TTV = max(t(x,y)) – min(t(x,y)). E shebana le ho tšoana ha botenya ba ka hare ba substrate ea wafer, e fapaneng le ho ba thata ha bokaholimo kapa ho tšoana ha filimi e tšesaane.
Seqha

Seqha se hlalosa ho kheloha ho otlolohileng ha ntlha e bohareng ea wafer ho tloha sefofaneng sa litšupiso se nang le lisekoere tse nyane. Litekanyetso tse ntle kapa tse mpe li bontša ho kobeha ho holimo kapa ho theoha ka bophara.

Koahela

Warp e lekanya phapang e phahameng ka ho fetisisa pakeng tsa tlhoro le phula ho pholletsa le dintlha tsohle tsa bokaholimo ha ho bapisoa le sefofane sa referense, e lekola ho batalla ha wafer ka kakaretso boemong bo lokolohileng.

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Microwarp
Microwarp (kapa nanotopography) e hlahloba di-micro-undulations tse ka hodima bokaholimo ka hara mefuta e ikgethang ya maqhubu a sebaka (mohlala, 0.5–20 mm). Ho sa tsotellehe amplitudes e nyane, diphetoho tsena di ama botebo ba ho tsepamisa maikutlo ba lithography (DOF) le ho tshwana ha CMP.
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Moralo oa Litšupiso tsa Tekanyo​​
Methati eohle e baloa ho sebelisoa motheo oa jeometri, hangata sefofane se nang le lisekoere tse nyane (sefofane sa LSQ). Litekanyo tsa botenya li hloka ho lekola data ea bokaholimo bo ka pele le bo ka morao ka mathoko a wafer, li-notches, kapa matšoao a ho lekola. Tlhahlobo ea microwarp e kenyelletsa ho sefa sebaka ho ntša likarolo tse ikhethileng tsa bolelele ba leqhubu.

 

Mekhoa ea ho lekanya

1. Mekhoa ea ho Lekanya TTV​​

  • Profilometry ea Bokaholimo bo habeli
  • Fizeau Interferometry:E sebelisa likhoele tsa tšitiso pakeng tsa sefofane sa litšupiso le bokaholimo ba wafer. E loketse libaka tse boreleli empa e lekanyelitsoe ke li-wafer tse kobehileng haholo.
  • Interferometry ea ho Sekena Leseli le Lesoeu (SWLI):E lekanya bophahamo bo felletseng ka lienfelopo tsa leseli tse sa utloahaleng hantle. E sebetsa hantle bakeng sa libaka tse kang mehato empa e thibetsoe ke lebelo la ho skena ka mechine.
  • Mekhoa ea ho Koalla:Finyella qeto ea sub-micron ka melao-motheo ea pinhole kapa ea ho hasana. E loketse libaka tse thata kapa tse bonaletsang empa e lieha ka lebaka la ho skena ntlha ka ntlha.
  • Triangulation ea Laser:Karabelo e potlakileng empa e sekametse tahlehelong ea ho nepahala ho tsoa ho liphetoho tsa ho bonahatsa bokaholimo.

 

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  • Sehokelo sa Phetiso/Pontšo
  • Disensor tsa Bokgoni ba Dihlooho tse pedi: Sebaka se lekanang sa disensor mahlakoreng ka bobedi se lekanya botenya jwalo ka T = L – d₁ – d₂ (L = sebaka sa motheo). E potlakile empa e na le kutlwisiso e tebileng hodima thepa ya thepa.
  • Ellipsometry/Spectroscopic Reflectometry: E sekaseka dikamano tsa matter tse bobebe bakeng sa botenya ba filimi e tshesane empa e sa lokela TTV e kgolo.

 

2. Tekanyo ea Seqha le ho Koba

  • Li-Array tsa Capacitance tsa Multi-Probe: Tšoara data ea bophahamo ba tšimo e felletseng sethaleng se jereng moea bakeng sa kaho e potlakileng ea 3D.
  • Ponelopele ea Leseli le Hahiloeng​​: Ho etsa profiling ea 3D ka lebelo le phahameng ho sebelisoa sebopeho sa optical.
  • Interferometry e Tlase ea NA: 'Mapa oa bokaholimo o nang le qeto e phahameng empa o ama ho thothomela.

 

3. Tekanyo ea Microwarp

  • Tlhahlobo ea Maqhubu a Sebaka:
  1. Fumana topography ea bokaholimo bo nang le qeto e phahameng.
  2. Bongata ba matla a spectral a ho bala (PSD) ka 2D FFT.
  3. Kenya difilthara tsa bandpass (mohlala, 0.5–20 mm) ho arola maqhubu a bohlokwa.
  4. Bala boleng ba RMS kapa PV ho tsoa ho data e sefiloeng.
  • Ketsiso ea Vacuum Chuck​:Litlamorao tsa ho tiisa tsa lefatše la sebele nakong ea lithography.

 

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Ts'ebetso ea Lintlha le Mehloli ea Liphoso

Tsamaiso ea Mosebetsi​​

  • TV:Lokisa likhokahano tsa bokaholimo bo ka pele/bo ka morao, bala phapang ea botenya, 'me u tlose liphoso tsa tsamaiso (mohlala, ho kheloha ha mocheso).
  • .Seqha/Sekoahelo:Kenya sebaka sa LSQ ho data ya bophahamo; Seqha = masalla a ntlha e bohareng, Warp = masalla a tlhoro ho ya phuleng.
  • .Microwarp:Sefa maqhubu a sebaka, bala lipalo-palo (RMS/PV).

Mehloli ea Liphoso tsa Bohlokoa

  • Mabaka a Tikoloho:Ho thothomela (ho bohlokoa bakeng sa interferometry), pherekano ea moea, ho kheloha ha mocheso.
  • Meeli ea Sensor:Lerata la mokhahlelo (interferometry), liphoso tsa ho lekanya bolelele ba maqhubu (confocal), likarabo tse itšetlehileng ka thepa (capacitance).
  • Ho Tšoara Wafer:Ho se tsamaisane hantle ha lehlakore le ka thoko, ho se nepahale ha sethala sa motsamao ha ho rokelloa.

 

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Tšusumetso ho Bohlokoa ba Ts'ebetso​​​​

  • Lithography:Microwarp ea lehae e fokotsa DOF, e leng se bakang phetoho ea CD le liphoso tsa overlay.
  • CMP​​:Ho se leka-lekane ha TTV qalong ho lebisa kgatellong e sa lekanang ya ho bentsha.
  • Tlhahlobo ea Khatello ea Kelello:Phetoho ea Seqha/Warp e senola boitšoaro ba khatello ea mocheso/mechanical.
  • Sephutheloana:TTV e feteletseng e baka likheo lihokelong tsa ho kopanya.

 

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Nako ea poso: Loetse-28-2025