TTV, BOW, WARP, le TIR li bolela'ng ho li-wafers?

Ha re hlahloba di-wafer tsa silicon tsa semiconductor kapa di-substrate tse entsweng ka thepa e nngwe, hangata re kopana le matshwao a botekgeniki a kang: TTV, BOW, WARP, mohlomong le TIR, STIR, LTV, hara tse ding. Ke diparamitha dife tse emetseng?

TTV — Phapang ea Botenya Bohle
Seqha — Seqha
WARP — Warp
TIR — Kakaretso ea ho Bala ho Bontšitsoeng
STIR — Sebaka Kakaretso ea ho Bala ho Bontšitsoeng
LTV — Phapang ea Botenya ba Sebaka

1. Phapang ea Botenya Bohle — TTV

Phapang pakeng tsa botenya bo boholo le bo bonyane ba wafer ha e bapisoa le sebaka sa referense ha wafer e khomaretsoe 'me e le haufi. Ka kakaretso e hlahisoa ka li-micrometer (μm), hangata e emetsoe e le: ≤15 μm.

2. Seqha — Seqha

Phapang pakeng tsa sebaka se senyenyane le se seholo ho tloha ntlheng e bohareng ea bokaholimo ba wafer ho ea sebakeng sa litšupiso ha wafer e le boemong bo lokolohileng (bo sa kobehang). Sena se kenyelletsa linyeoe tse kobehileng (seqha se seng kotsi) le tse kobehileng (seqha se setle). Hangata e hlahisoa ka li-micrometer (μm), hangata e emeloang e le: ≤40 μm.

3. Ho betla — HO betla

Phapang pakeng tsa sebaka se senyenyane le se phahameng ka ho fetisisa ho tloha holim'a wafer ho ea sebakeng sa litšupiso (hangata bokaholimo bo ka morao ba wafer) ha wafer e le boemong bo lokolohileng (bo sa koaheloang). Sena se kenyelletsa linyeoe tse kobehileng (negative warp) le convex (positive warp). Ka kakaretso e hlahisoa ka li-micrometer (μm), hangata e emeloang e le: ≤30 μm.

4. Kakaretso ea Palo e Bontšitsoeng — TIR

Ha wafer e tlamiloe 'me e le haufi, ho sebelisoa sefofane sa litšupiso se fokotsang kakaretso ea li-intercept tsa lintlha tsohle tse ka hare ho sebaka sa boleng kapa sebaka se boletsoeng sa lehae holim'a wafer, TIR ke ho kheloha pakeng tsa sebaka se phahameng le se fokolang ho tloha holim'a wafer ho ea sefofaneng sena sa litšupiso.

E thehiloe holim'a boiphihlelo bo tebileng ba litlhaloso tsa thepa ea semiconductor joalo ka TTV, BOW, WARP, le TIR, XKH e fana ka lits'ebeletso tsa ts'ebetso ea wafer e ikhethileng e etselitsoeng maemo a thata a indasteri. Re fana le ho tšehetsa mefuta e mengata ea lisebelisoa tse sebetsang hantle ho kenyeletsoa safire, silicon carbide (SiC), li-wafer tsa silicon, SOI, le quartz, ho netefatsa hore ho bataletse ka mokhoa o ikhethang, ho tsitsa ha botenya, le boleng ba bokaholimo bakeng sa lits'ebetso tse tsoetseng pele ho optoelectronics, lisebelisoa tsa motlakase le MEMS. Re tšepe hore re tla fana ka litharollo tse tšepahalang tsa thepa le ho sebetsa ka nepo ho fihlela litlhoko tsa hau tsa moralo tse hlokang tlhokomelo e kholo.