Lihlahisoa
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Seed SiC Seed Crystal Substrates tsa Customized Dia 205/203/208 4H-N Mofuta oa Optical Communications
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Sapphire Optical Windows Single Crystal Al₂O₃ Wear Resistant Bespoke Dimensions Kapa Sebopeho
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12inch Fully Automatic Precision Dicing Saw Equipment Wafer Dedicated Cutting System bakeng sa Si/SiC & HBM (Al)
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Synthetic Colored Sapphire Rough Violet Purple Makhase a Mahakoe a Boleng bo Phahameng bakeng sa mabenyane a Tloaelehileng
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Sapphire Optical e Khethehileng ea Windows High Purity Transmittance ≥90%
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Thepa e Ikemetseng ka ho Fetisisa ea Wafer Ring-Cutting Size e sebetsang ka boholo ba 8inch/12inch Wafer Ring Cutting
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Mg-Doped LiNbO₃Ingots 45°Z-Cut 64°Y-Cut Orientations For 5G/6G Communications Systems
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6 Inch Conductive SiC Composite Substrate 4H Diameter 150mm Ra≤0.2nm Warp≤35μm
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Sapphire Optical Windows Single Crystal Al₂O₃ e Hanela ho Wear
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Sesebelisoa sa ho Tšoaea sa Laser Anti-Counterfeiting Sapphire Wafer Marking
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LiTaO₃ Ingots 50mm - 150mm Diameter X/Y/Z-Cut Orientation ±0.5° Mamello
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6 inch-8 inch LN-on-Si Composite Substrate Teckness 0.3-50 μm Si/SiC/Sapphire of Materials