Lihlahisoa
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LiNbO₃ Wafers 2inch-8inch Botenya 0.1 ~ 0.5mm TTV 3µm Tloaelo
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Sebōpi sa Khōlo sa SiC Ingot bakeng sa Mekhoa e Meholo ea SiC Crystal TSSG/LPE
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Thepa ea Infrared Picosecond Dual-Platform Laser Cutting bakeng sa Optical Glass/Quartz/Sapphire Processing
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Synthetic Colored Gemstone White Sapphire lehakoe bakeng sa mabenyane Free-Size Cutting
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SiC ceramic end effector e fanang ka letsoho bakeng sa ho jara liphaphatha
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4inch 6inch 8inch SiC Sebōpi sa Khōlo ea Crystal bakeng sa Ts'ebetso ea CVD
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6 Inch 4H SEMI Type SiC composite substrate Thickness 500μm TTV≤5μm MOS grade
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Likarolo tsa Sapphire tse Hlophisitsoeng tsa Shaped Shaped Optical Windows tse nang le Precision Polishing
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SiC ceramic plate/tray bakeng sa 4inch 6inch wafer holder bakeng sa ICP
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Fensetere ea Sapphire e Sebeletsoeng ka Mokhoa o Tloaelehileng e Thata haholo bakeng sa Lits'oants'o tsa Smartphone
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Thepa ea Infrared Nanosecond Laser Drilling bakeng sa Botenya ba Khalase ea ho Cheka≤20mm
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Microjet tham mong bang laser thekenoloji thepa sephaha seha SiC thepa sebetsa