Semi-Insulating SiC Composite Substrates Dia2inch 4inch 6inch 8inch HPSI
| Lintho | Tlhaloso | Lintho | Tlhaloso |
| Diameter | 150±0.2mm | Boka pele (si-face) /si-fahleng | Ra≤0.2nm (5μm*5μm) |
| Polytype | 4H | Edge Chip, Scratch, Crack (tlhahlobo ea pono) | Ha ho letho |
| Ho hanyetsa | ≥1E8ohm·cm | TTV | ≤5μm |
| Fetisetsa lera Botenya | ≥0.4μm | Warp | ≤35μm |
| Lefeela | ≤5ea/wafer (2mm>D>0.5mm) | Botenya | 500±25μm |
Melemo ea li-semi-insulating SiC composite substrates e kenyelletsa:
High resistivity: Semi-insulating SiC thepa e na le resistivity e phahameng, ho etsa hore ka tsela e itseng e khona ho thibela phallo ea hona joale le e loketseng mefuta e itseng ea lisebelisoa tsa elektronike.
Ts'ebetso e phahameng ea mocheso: Lisebelisoa tsa SiC li khona ho sebetsa libakeng tse phahameng tsa mocheso, li etsa hore li tšoanelehe bakeng sa lisebelisoa tsa elektronike tse matla le tse phahameng.
High Breakdown Voltage: Lisebelisoa tsa SiC li na le matla a phahameng a ho senya 'me li khona ho mamella masimo a phahameng a motlakase ntle le ho senyeha ha motlakase.
Khanyetso ea Lik'hemik'hale le Tikoloho: SiC e hanana le ho bola ha lik'hemik'hale 'me e khona ho mamella maemo a thata a tikoloho bakeng sa lits'ebetso tse batloang haholo.
Tahlehelo e fokotsehileng ea matla: Li-substrates tsa SiC li lumella phetoho ea matla e sebetsang hantle le tahlehelo e tlase ea matla ho lisebelisoa tsa elektroniki ha li bapisoa le lisebelisoa tsa setso tse thehiloeng ka silicon.
Ka kakaretso, li-semi-insulating SiC composite substrates li fana ka melemo e mengata ho nts'etsopele ea lisebelisoa tsa elektronike tse sebetsang hantle, haholo-holo lits'ebetsong tse hlokang ts'ebetso ea mocheso o phahameng, matla a phahameng a matla le ho fetola matla ka katleho.
Thekiso & Tšebeletso ea Bareki
Thepa ea Lintho
Lefapha la ho reka thepa le ikarabella ho bokella lisebelisoa tsohle tse hlokahalang ho hlahisa sehlahisoa sa hau. Ho fumaneha ka botlalo ha lihlahisoa le lisebelisoa, ho kenyelletsa tlhahlobo ea lik'hemik'hale le 'mele li lula li le teng.
Boleng
Nakong le ka mor'a ho etsoa kapa ho etsoa ha lihlahisoa tsa hau, lefapha la taolo ea boleng le kenya letsoho ho netefatsa hore lisebelisoa tsohle le mamello li kopana kapa li feta seo u se batlang.
Tshebeletso
Re motlotlo ka ho ba le basebetsi ba boenjiniere ba thekiso ba nang le boiphihlelo ba lilemo tse fetang 5 indastering ea semiconductor. Ba koetliselitsoe ho araba lipotso tsa tekheniki le ho fana ka mantsoe a qotsitsoeng ka nako bakeng sa litlhoko tsa hau.
re ka lehlakoreng la hau ka nako efe kapa efe ha u na le bothata, 'me u bo rarolle ka mor'a lihora tse 10.
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