Semi-Insulating SiC ho Si Composite Substrates

Tlhaloso e Khutšoanyane:

Semi-insulated SiC holim'a Si composite substrate ke thepa ea semiconductor e nang le ho beha lesela le sirelelitsoeng la silicon carbide (SiC) holim'a silicon substrate.

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Lintho	Tlhaloso	Lintho	Tlhaloso
Diameter	150±0.2mm	Boitloaelo	<111>/<100>/<110> joalo-joalo
Polytype	4H	Mofuta	P/N
Ho hanyetsa	≥1E8ohm·cm	Bophatlalatsi	Sephara/Notch
Fetisetsa lera Botenya	≥0.1μm	Edge Chip, Scratch, Crack (tlhahlobo ea pono)	Ha ho letho
Lefeela	≤5ea/wafer (2mm>D>0.5mm)	TTV	≤5μm
Bokhopo bo ka pele	Ra≤0.2nm (5μm*5μm)	Botenya	500/625/675±25μm

Motsoako ona o fana ka menyetla e mengata ea ho etsa lisebelisoa tsa elektroniki:

Tšebelisano: Tšebeliso ea silicon substrate e etsa hore e lumellane le mekhoa e tloaelehileng ea ho sebetsa ka silicon 'me e lumella ho kopanngoa le mekhoa e teng ea tlhahiso ea semiconductor.

Ts'ebetso e phahameng ea mocheso: SiC e na le conductivity e ntle ea mocheso 'me e khona ho sebetsa ka mocheso o phahameng, e etsa hore e tšoanelehe bakeng sa matla a phahameng le lisebelisoa tsa elektronike tse phahameng.

High Breakdown Voltage: Lisebelisoa tsa SiC li na le matla a phahameng a ho senya 'me li khona ho mamella masimo a phahameng a motlakase ntle le ho senyeha ha motlakase.

Tahlehelo ea Matla e Fokotseng: Li-substrates tsa SiC li lumella ho fetola matla ka katleho le ho fokotsa matla a ho lahleheloa ke matla ho lisebelisoa tsa elektronike ha li bapisoa le lisebelisoa tse tloaelehileng tsa silicon.

Wide bandwidth: SiC e na le bandwidth e pharaletseng, e lumellang nts'etsopele ea lisebelisoa tsa elektroniki tse ka sebetsang ka mocheso o phahameng le matla a phahameng a matla.

Kahoo SiC e thibelang metsi ho Sic composite substrates e kopanya ho lumellana ha silicon le thepa e phahameng ea motlakase le ea mocheso ea SiC, e etsa hore e tšoanelehe bakeng sa lisebelisoa tsa elektronike tse sebetsang hantle.

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