Lisebelisoa tsa semiconductor
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Mohala oa Boiketsetso oa Silicon / Silicon Carbide (SiC) Wafer oa Mehato e Mene o hokahantsoeng oa ho Polisa (Mohala o Kopaneng oa ho Tšoara oa Kamora ho Polish)
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Tharollo e Kopantsoeng ea SiC Peo ea ho Koahela–Ho Kopanya–Ho Sintering
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Sistimi ea Micromachining ea Laser e Nepahetseng ka ho Fetisisa
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Taemane ea terata ea terata ea Multi-Wire bakeng sa ho seha ka nepo thepa e thata le e tetemang
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Mochini oa ho Sibolla Laser o Tataisoang ke Micro Waterjet
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Mochini oa ho sakha oa Taemane oa Mefuta e Mengata o Fetotsoeng oa ho Fetoha ka Lebelo le Phahameng ka ho Sebetsa ka Botlalo
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Saw ea Taemane ea Lithapo tse Ngata TJ3000 12″ Inverted Downward Swing
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Lisebelisoa tsa Saw ea terata bakeng sa Lisebelisoa tsa Sapphire/Ceramics/Marble ka ho Seha ka ho Otloloha/Horizontal/Mehala e mengata
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Likarolo tsa Puisano ea Laser e Potlakileng le Li-terminal
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Taemane terata e mengata e nang le terata e phahameng e nang le lebelo le phahameng e nang le ho nepahala ho tlase ho Swing Cutting Machine
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Lisebelisoa tsa ho bentša tse nang le tšibollo e phahameng
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Mochini oa ho Sila o Mahlakore a Mabeli ka ho Sebetsa bakeng sa SiC Sapphire Si wafer