Terei ea Ceramic ea SiC bakeng sa Mochini oa Wafer o nang le Khanyetso e Phahameng ea Mocheso
Terei ea Ceramic ea Silicon Carbide (Terei ea SiC)
Karolo ea letsopa e sebetsang hantle e thehiloeng holim'a thepa ea silicon carbide (SiC), e entsoe bakeng sa lits'ebetso tse tsoetseng pele tsa indasteri joalo ka tlhahiso ea semiconductor le tlhahiso ea LED. Mesebetsi ea eona ea mantlha e kenyelletsa ho sebeletsa e le mojari oa wafer, sethala sa ts'ebetso ea ho fata, kapa tšehetso ea ts'ebetso ea mocheso o phahameng, ho sebelisa conductivity e ikhethang ea mocheso, khanyetso ea mocheso o phahameng, le botsitso ba lik'hemik'hale ho netefatsa ho tšoana ha ts'ebetso le chai ea sehlahisoa.
Likarolo tsa Bohlokoa
1. Tshebetso ea Thermal
- Ho Tsamaisa Mocheso o Phahameng: 140–300 W/m·K, e fetang graphite ya setso haholo (85 W/m·K), e nolofalletsang ho qhalana ha mocheso ka potlako le ho fokotsa kgatello ya mocheso.
- Kakaretso e Tlase ea Thempereichara: 4.0×10⁻⁶/℃ (25–1000℃), silicon e tšoanang haufi-ufi (2.6×10⁻⁶/℃), e fokotsa likotsi tsa ho fetoha ha thempereichara.
2. Thepa ea Mekaniki
- Matla a Phahameng: Matla a ho kokobela ≥320 MPa (20℃), e hanela kgatello le ho tshwarwa.
- Bothata bo Holimo: Bothata ba Mohs ke 9.5, bo latelang daemane feela, bo fanang ka ho hanyetsa ho tsofala ho hoholo.
3. Ho Tsitsisa Lik'hemik'hale
- Ho Hanela Tshenyo: E hanela di-acid tse matla (mohlala, HF, H₂SO₄), e loketse ditikoloho tsa tshebetso ya ho tjhesa.
- E seng ea makenete: Ho ba le matla a makenete a ka hare ho <1×10⁻⁶ emu/g, ho qoba tšitiso ea lisebelisoa tse nepahetseng.
4. Mamello e Feteletseng ea Tikoloho
- Ho Tšoarella ha Mocheso o Phahameng: Mocheso oa ts'ebetso oa nako e telele ho fihlela ho 1600–1900℃; khanyetso ea nako e khuts'oane ho fihlela ho 2200℃ (tikoloho e se nang oksijene).
- Ho Hanela ho Shoa ke Thermal: E mamella liphetoho tse sa lebelloang tsa mocheso (ΔT >1000℃) ntle le ho petsoha.
Likopo
| Sebaka sa Kopo | Maemo a Ikhethang | Boleng ba Tekheniki |
| Tlhahiso ea Semiconductor | Ho tjhesa ka wafer (ICP), ho betla filimi e tshesane (MOCVD), ho bentsha CMP | Ho tsamaisa mocheso ka matla ho netefatsa hore masimo a mocheso a lekana; katoloso e tlase ea mocheso e fokotsa ho thiba ha wafer. |
| Tlhahiso ea LED | Kgolo ea Epitaxial (mohlala, GaN), ho arola ka wafer, ho paka | E thibela diphoso tsa mefuta e mengata, e ntlafatsa bokgoni ba khanya ya LED le nako ya bophelo. |
| Indasteri ea Photovoltaic | Liforo tsa ho sila tsa silicon wafer, litšehetso tsa lisebelisoa tsa PECVD | Ho hanyetsa ho tshoha ha mocheso o phahameng le mocheso ho eketsa nako ya bophelo ba sesebediswa. |
| Laser le Optics | Lisebelisoa tse pholileng tsa laser tse matla haholo, litšehetso tsa sistimi ea optical | Ho khanna mocheso o phahameng ho nolofalletsa ho qhalana ha mocheso ka potlako, ho tsitsisa likarolo tsa optical. |
| Lisebelisoa tsa Tlhahlobo | Litšoare tsa sampole tsa TGA/DSC | Bokgoni bo tlase ba mocheso le karabelo e potlakileng ya mocheso di ntlafatsa ho nepahala ha tekanyo. |
Melemo ea Lihlahisoa
- Tshebetso e Felletseng: Ho tsamaisa mocheso, matla le khanyetso ya mafome di feta haholo diseramike tsa alumina le silicon nitride, di fihlela ditlhoko tse feteletseng tsa tshebetso.
- Moralo o Bobebe: Boima ba 3.1–3.2 g/cm³ (40% ea tšepe), e fokotsang mojaro o sa sebetseng le ho ntlafatsa ho nepahala ha motsamao.
- Nako e Telele le Botšepehi: Bophelo ba tšebeletso bo feta lilemo tse 5 mochesong oa 1600℃, bo fokotsa nako ea ho sebetsa le ho fokotsa litšenyehelo tsa ts'ebetso ka 30%.
- Ho iketsetsa: E tšehetsa li-geometri tse rarahaneng (mohlala, likopi tsa ho hula tse nang le masoba, literei tse nang le mekhahlelo e mengata) ka phoso ea ho ba bataletse <15 μm bakeng sa lits'ebetso tse nepahetseng.
Litlhaloso tsa Tekheniki
| Sehlopha sa liparamente | Sesupo |
| Thepa ea 'Mele | |
| Botenya | ≥3.10 g/cm³ |
| Matla a ho Tenyetseha (20℃) | 320–410 MPa |
| Ho Tsamaisa Mocheso (20℃) | 140–300 W/(m·K) |
| Coefficient ea Katoloso ea Thermal (25–1000℃) | 4.0×10⁻⁶/℃ |
| Thepa ea Lik'hemik'hale | |
| Khanyetso ea Asiti (HF/H₂SO₄) | Ha ho na ho bola kamora ho qoelisoa lihora tse 24 |
| Ho nepahala ha Machining | |
| Bophara | ≤15 μm (300×300 mm) |
| Bokgoni ba Bokaholimo (Ra) | ≤0.4 μm |
Litšebeletso tsa XKH
XKH e fana ka ditharollo tse felletseng tsa indasteri tse akaretsang ntshetsopele e ikgethileng, ho sebetsa ka nepo, le taolo e matla ya boleng. Bakeng sa ntshetsopele e ikgethileng, e fana ka ditharollo tsa thepa tse hlwekileng haholo (>99.999%) le tse nang le masoba (30–50%), tse kopantsweng le mohlala wa 3D le ketsiso ho ntlafatsa dijiometri tse rarahaneng bakeng sa ditshebediso tse kang di-semiconductor le sefofane. Ho sebetsa ka nepo ho latela tshebetso e nolofaditsweng: ts'ebetso ya phofo → ho tobetsa ka isostatic/dry → 2200°C sintering → CNC/daemane grinding → tlhahlobo, ho netefatsa ho bentsha ha nanometer le mamello ya ±0.01 mm. Taolo ya boleng e kenyeletsa teko ya tshebetso e felletseng (mokgwa wa XRD, sebopeho sa SEM microstructure, ho kobeha ha dintlha tse 3) le tshehetso ya botekgeniki (ntlafatso ya tshebetso, puisano ya 24/7, ho fana ka sampole ya dihora tse 48), ho fana ka dikarolo tse tshepahalang, tse sebetsang hantle bakeng sa ditlhoko tse tswetseng pele tsa indasteri.
Lipotso Tse Botsoang Khafetsa (Lipotso Tse Botsoang Khafetsa)
1. P: Ke liindasteri life tse sebelisang literei tsa ceramic tsa silicon carbide?
A: E sebelisoa haholo tlhahisong ea semiconductor (ho sebetsana le wafer), matla a letsatsi (mekhoa ea PECVD), lisebelisoa tsa bongaka (likarolo tsa MRI), le sebaka sa moea (likarolo tse nang le mocheso o phahameng) ka lebaka la ho hanyetsa mocheso o feteletseng le botsitso ba lik'hemik'hale.
2. P: Carbide ea silicon e sebetsa hantle ho feta literei tsa quartz/khalase joang?
A: Ho hanyetsa mocheso ka ho fetisisa (ho fihlela ho 1800°C ha ho bapisoa le quartz's 1100°C), ho se be le tšitiso ea makenete, le nako e telele ea bophelo (lilemo tse 5+ ha ho bapisoa le quartz's likhoeli tse 6-12).
3. P: Na diterei tsa silicon carbide di ka sebetsana le dibaka tse nang le asiti?
K: E. E hanela HF, H2SO4, le NaOH ka ho bola ho <0.01mm/selemo, e leng se etsang hore e be ntle bakeng sa ho tjhesa ka dikhemikhale le ho hlwekisa wafer.
4. P: Na diterei tsa silicon carbide di tsamaellana le boiketsetso?
K: E. E etselitsoe ho nkuwa ha vacuum le ho sebetsana le roboto, e nang le bokaholimo bo bataletseng <0.01mm ho thibela tšilafalo ea likaroloana ka har'a lintho tse iketsang.
5. P: Papiso ea litšenyehelo ke efe ha e bapisoa le thepa ea setso?
A: Litšenyehelo tse holimo tsa pele (3-5x quartz) empa TCO e tlase ka 30-50% ka lebaka la nako e telele ea bophelo, nako e fokotsehileng ea ho se sebetse, le poloko ea matla ka lebaka la ho tsamaisa mocheso ka mokhoa o phahameng.
