SiC substrate 3inch 350um botenya HPSI mofuta Prime Grade Dummy grade

Tlhaloso e Khutšoanyane:

Li-wafers tsa 3-inch High Purity Silicon Carbide (SiC) li entsoe ka ho khetheha bakeng sa ho batla lits'ebetso tsa motlakase oa motlakase, optoelectronics le lipatlisiso tse tsoetseng pele. E fumaneha ho Tlhahiso, Lipatlisiso, le Lihlopheng tsa Dummy, li-wafers tsena li fana ka boits'oaro bo ikhethang, bofokoli bo tlase, le boleng bo holimo bo holimo. Ka thepa e sa koaloang ea semi-insulating, e fana ka sethala se loketseng bakeng sa ho etsa lisebelisoa tse phahameng tse sebetsang tlas'a maemo a feteletseng a mocheso le motlakase.

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Thepa

Paramethara	Kereiti ya Tlhahiso	Sehlopha sa lipatlisiso	Sehlopha sa Dummy	Yuniti
Kereiti	Kereiti ya Tlhahiso	Sehlopha sa lipatlisiso	Sehlopha sa Dummy
Diameter	76.2 ± 0.5	76.2 ± 0.5	76.2 ± 0.5	mm
Botenya	500 ± 25	500 ± 25	500 ± 25	µm
Wafer Orientation	On-axis: <0001> ± 0.5°	On-axis: <0001> ± 2.0°	On-axis: <0001> ± 2.0°	tekanyo
Boima ba Micropipe (MPD)	≤1	≤5	≤ 10	cm−2^-2−2
Ho hanyetsa Motlakase	≥ 1E10	≥ 1E5	≥ 1E5	Ω·cm
Dopant	E butsoe	E butsoe	E butsoe
Maemo a Motheo a Flat	{1-100} ± 5.0°	{1-100} ± 5.0°	{1-100} ± 5.0°	tekanyo
Bolelele ba Phatlalatso ba Pele	32.5 ± 3.0	32.5 ± 3.0	32.5 ± 3.0	mm
Bolelele ba Bokhabane ba Bobeli	18.0 ± 2.0	18.0 ± 2.0	18.0 ± 2.0	mm
Boemo ba Bobeli ba Flat	90 ° CW ho tloha foleteng ea mantlha ± 5.0 °	90 ° CW ho tloha foleteng ea mantlha ± 5.0 °	90 ° CW ho tloha foleteng ea mantlha ± 5.0 °	tekanyo
Kenyelletso ea Edge	3	3	3	mm
LTV/TTV/Bow/Warp	3/10/±30/40	3/10/±30/40	5/15/±40/45	µm
Bokhopo ba Sekaho	Si-sefahleho: CMP, C-sefahleho: e hloekisitsoe	Si-sefahleho: CMP, C-sefahleho: e hloekisitsoe	Si-sefahleho: CMP, C-sefahleho: e hloekisitsoe
Cracks (Leseli le Phahameng ka ho Fetisisa)	Ha ho letho	Ha ho letho	Ha ho letho
Hex Plates (Leseli le Phahameng ka ho Fetisisa)	Ha ho letho	Ha ho letho	Sebaka sa Koketso 10%	%
Libaka tsa Polytype (Leseli le Phahameng ka ho Fetisisa)	Sebaka sa Koketso 5%	Sebaka sa Koketso 20%	Sebaka sa Koketso 30%	%
Mekhoro (Leseli le Matla a Phahameng)	≤ Mengoallo e 5, bolelele bo akaretsang ≤ 150	≤ Mengoallo e 10, bolelele bo akaretsang ≤ 200	≤ Mengoallo e 10, bolelele bo akaretsang ≤ 200	mm
Edge Chipping	Ha ho na ≥ 0.5 mm bophara / botebo	2 e lumelletsoe ≤ 1 mm bophara / botebo	5 e lumelletsoe ≤ 5 mm bophara / botebo	mm
Tšilafalo ea Bokaholimo	Ha ho letho	Ha ho letho	Ha ho letho

Lisebelisoa

1. Lisebelisoa tsa Elektronike tse Matla a Phahameng
Ts'ebetso e phahameng ea mocheso le lekhalo le pharaletseng la liphaephe tsa SiC li li etsa hore li tšoanelehe bakeng sa lisebelisoa tsa matla a phahameng, tse phahameng haholo:
● MOSFETs le IGBTs bakeng sa ho fetola matla.
● Sistimi e tsoetseng pele ea motlakase ea koloi, ho kenyeletsoa li-inverters le li-charger.
● Mehaho ea marang-rang e bohlale le lisebelisoa tsa motlakase tse tsosolositsoeng.
2. RF le Microwave Systems
Li-substrates tsa SiC li thusa lits'ebetso tse phahameng tsa RF le microwave tse nang le tahlehelo e nyane ea lets'oao:
● Mehala ea puisano le ea sathelaete.
● Mekhoa ea radar ea sepakapaka.
● Likarolo tsa marang-rang tsa 5G tse tsoetseng pele.
3. Optoelectronics le li-sensor
Thepa e ikhethang ea SiC e tšehetsa mefuta e fapaneng ea likopo tsa optoelectronic:
● Lisebelisoa tsa UV bakeng sa ho hlahloba tikoloho le ho lemoha indasteri.
● LED le laser substrates bakeng sa mabone a tiileng-state le lisebelisoa tse nepahetseng.
● Li-sensor tsa mocheso o phahameng bakeng sa liindasteri tsa sefofane le likoloi.
4. Lipatlisiso le Ntlafatso
Phapang ea limaraka (Tlhahiso, Lipatlisiso, Dummy) e thusa liteko tsa maemo a holimo le prototyping ea lisebelisoa lithutong tsa thuto le indastering.

Melemo

● Ho tšepahala:Excellent resistivity le botsitso ho pholletsa le limaraka.
●Ho ikhethela:Maemo a ikamahanyang le botenya ho lumellana le litlhoko tse fapaneng.
● Bohloeki bo Phahameng:Sebopeho se sa koaheloang se tiisa hore ho na le phapang e fokolang e amanang le litšila.
●Scalability:E kopana le litlhoko tsa tlhahiso ea bongata le lipatlisiso tsa liteko.
Li-wafers tse 3-inch tse phahameng tsa SiC ke tsela ea hau ea ho isa lisebelisoa tse sebetsang hantle le tsoelopele ea mahlale a mahlale. Bakeng sa lipotso le lintlha tse qaqileng, ikopanye le rona kajeno.

Kakaretso

Li-wafers tsa 3-inch High Purity Silicon Carbide (SiC), tse fumanehang ho Tlhahiso, Lipatlisiso, le Li-Grades tsa Dummy, ke li-substrates tsa premium tse etselitsoeng lisebelisoa tsa motlakase tse matla, RF/microwave systems, optoelectronics, le R&D e tsoetseng pele. Li-wafers tsena li na le thepa e sa phutholohang, e sireletsang halofo e nang le resistivity e babatsehang (≥1E10 Ω·cm bakeng sa Kereiti ea Tlhahiso), boima bo tlaase ba micropipe (≤1 cm−2 ^ -2−2), le boleng bo ikhethang ba holim'a metsi. Li ntlafalitsoe bakeng sa lits'ebetso tse sebetsang hantle haholo, ho kenyelletsa phetolo ea motlakase, likhokahano tsa mehala, temoso ea UV, le mahlale a LED. Ka mekhoa e ka tloahelehang, ts'ebetso e phahameng ea mocheso, le lisebelisoa tse matla tsa mochini, liphaephe tsena tsa SiC li thusa ho etsa lisebelisoa tse sebetsang hantle, tse tšepahalang le mahlale a morao-rao liindastering tsohle.