Substrate ea SiC 3inch 350um botenya ba HPSI mofuta oa Prime Kereiti ea Dummy
Matlo
| Paramethara | Kereiti ea Tlhahiso | Kereiti ea Lipatlisiso | Sehlopha sa Mashano | Yuniti |
| Sehlopha | Kereiti ea Tlhahiso | Kereiti ea Lipatlisiso | Sehlopha sa Mashano | |
| Bophara | 76.2 ± 0.5 | 76.2 ± 0.5 | 76.2 ± 0.5 | mm |
| Botenya | 500 ± 25 | 500 ± 25 | 500 ± 25 | µm |
| Boikutlo ba Wafer | Mokhahlelo o sebetsang: <0001> ± 0.5° | Mokhahlelo o sebetsang: <0001> ± 2.0° | Mokhahlelo o sebetsang: <0001> ± 2.0° | tekanyo |
| Boima ba Micropipe (MPD) | ≤ 1 | ≤ 5 | ≤ 10 | cm−2^-2−2 |
| Ho hanyetsa motlakase | ≥ 1E10 | ≥ 1E5 | ≥ 1E5 | Ω·cm |
| Dopant | E phutholotsoe | E phutholotsoe | E phutholotsoe | |
| Boikutlo ba Motheo bo bataletseng | {1-100} ± 5.0° | {1-100} ± 5.0° | {1-100} ± 5.0° | tekanyo |
| Bolelele ba Sephara ba Motheo | 32.5 ± 3.0 | 32.5 ± 3.0 | 32.5 ± 3.0 | mm |
| Bolelele ba Bobedi bo Sephara | 18.0 ± 2.0 | 18.0 ± 2.0 | 18.0 ± 2.0 | mm |
| Boikutlo bo Bobedi bo bataletseng | 90° CW ho tloha foleteng ea mantlha ± 5.0° | 90° CW ho tloha foleteng ea mantlha ± 5.0° | 90° CW ho tloha foleteng ea mantlha ± 5.0° | tekanyo |
| Ho se kenyeletsoe ha Moeli | 3 | 3 | 3 | mm |
| LTV/TTV/Seqha/Koba | 3 / 10 / ±30 / 40 | 3 / 10 / ±30 / 40 | 5 / 15 / ±40 / 45 | µm |
| Bokahare bo Bobebe | Sefahleho sa Si: CMP, sefahleho sa C: Se bentšitsoeng | Sefahleho sa Si: CMP, sefahleho sa C: Se bentšitsoeng | Sefahleho sa Si: CMP, sefahleho sa C: Se bentšitsoeng | |
| Mapetso (Leseli le Matla a Phahameng) | Ha ho letho | Ha ho letho | Ha ho letho | |
| Lipoleiti tsa Hex (Leseli le Matla a Phahameng) | Ha ho letho | Ha ho letho | Sebaka se kopaneng 10% | % |
| Libaka tsa Mefuta e Mengata (Leseli le Matla a Phahameng) | Sebaka se kopaneng 5% | Sebaka se kopaneng 20% | Sebaka se kopaneng 30% | % |
| Mengoapo (Leseli le Matla a Phahameng) | ≤ ho ngoatheloa ha 5, bolelele bo kopaneng ≤ 150 | ≤ mengoapo e 10, bolelele bo kopaneng ≤ 200 | ≤ mengoapo e 10, bolelele bo kopaneng ≤ 200 | mm |
| Ho qhaqha Edge | Ha ho letho ≥ bophara/botebo ba 0.5 mm | 2 e lumelletsoe bophara/botebo ba ≤ 1 mm | 5 e lumelletsoe bophara/botebo ba ≤ 5 mm | mm |
| Tšilafalo ea Bokaholimo | Ha ho letho | Ha ho letho | Ha ho letho |
Likopo
1. Lisebelisoa tsa Elektroniki tse Matla a Phahameng
Ho tsamaisa mocheso hantle le lekhalo le leholo la li-wafer tsa SiC li etsa hore li be ntle bakeng sa lisebelisoa tse matla haholo, tse nang le maqhubu a phahameng:
●MOSFET le IGBT bakeng sa phetoho ea matla.
●Mekhoa e tsoetseng pele ea motlakase ea likoloi tsa motlakase, ho kenyeletsoa li-inverter le li-charger.
●Meralo ea motheo ea gridi e bohlale le litsamaiso tsa matla a nchafatsoang.
2. RF le Sistimi ea Microwave
Li-substrate tsa SiC li nolofalletsa lits'ebetso tsa RF le microwave tse nang le maqhubu a phahameng ka tahlehelo e nyane ea lets'oao:
●Mekhoa ea puisano le litsamaiso tsa sathelaete.
●Mekhoa ea radar ea sebaka sa lifofane.
●Likarolo tse tsoetseng pele tsa marang-rang a 5G.
3. Lisebelisoa tsa Optoelectronics le Sensor
Thepa e ikhethang ea SiC e tšehetsa mefuta e fapaneng ea lits'ebetso tsa optoelectronic:
●Li-UV detector bakeng sa ho lekola tikoloho le ho lemoha liindasteri.
●Lisebelisoa tsa LED le tsa laser bakeng sa mabone a boemo bo tiileng le lisebelisoa tse nepahetseng.
●Lisensara tsa mocheso o phahameng bakeng sa liindasteri tsa lifofane le tsa likoloi.
4. Patlisiso le Nts'etsopele
Mefuta e fapaneng ea limaraka (Tlhahiso, Lipatlisiso, Dummy) e nolofalletsa liteko tsa sejoale-joale le ho etsa mohlala oa lisebelisoa lithutong tsa thuto le indastering.
Melemo
●Tšepahala:Ho hanyetsa hantle le botsitso ho pholletsa le dikereiti.
●Ho iketsetsa:Mekhoa le botenya bo ikhethileng ho latela litlhoko tse fapaneng.
●Bohloeki bo Phahameng:Motsoako o sa phutholohang o netefatsa hore ho na le diphetoho tse fokolang tse amanang le ditshila.
●Ho ka hola:E fihlela litlhoko tsa tlhahiso ea bongata le lipatlisiso tsa liteko.
Li-wafer tsa SiC tse hloekileng haholo tsa lisenthimithara tse 3 ke tsela ea hau ea ho fumana lisebelisoa tse sebetsang hantle le tsoelo-pele ea theknoloji e ncha. Bakeng sa lipotso le litlhaloso tse qaqileng, ikopanye le rona kajeno.
Kakaretso
Li-Wafer tsa High Purity Silicon Carbide (SiC) tsa lisenthimithara tse 3, tse fumanehang ho Tlhahiso, Lipatlisiso, le Li-Dummy Grades, ke li-substrate tsa boleng bo holimo tse etselitsoeng lisebelisoa tsa elektroniki tse matla haholo, litsamaiso tsa RF/microwave, optoelectronics, le R&D e tsoetseng pele. Li-wafer tsena li na le thepa e sa koaheloang, e thibelang mocheso e nang le resistivity e ntle haholo (≥1E10 Ω·cm bakeng sa Tlhahiso ea Kereiti), tekanyo e tlase ea micropipe (≤1 cm−2^-2−2), le boleng bo ikhethang ba bokaholimo. Li ntlafalitsoe bakeng sa lits'ebetso tse sebetsang hantle, ho kenyeletsoa phetoho ea matla, likhokahano tsa mohala, kutlo ea UV, le mahlale a LED. Ka li-orientation tse ka fetoloang, conductivity e phahameng ea mocheso, le thepa e matla ea mechini, li-wafer tsena tsa SiC li nolofalletsa tlhahiso ea lisebelisoa tse sebetsang hantle le tse tšepahalang le boqapi bo qalang liindastering.
Setšoantšo se qaqileng
