Tafole e nyane ea laser punching mochini 1000W-6000W bonyane aperture 0.1MM e ka sebelisoa bakeng sa lisebelisoa tsa tšepe tsa khalase tsa ceramic.
Lisebelisoa tse sebetsang
1. Lisebelisoa tsa tšepe: tse kang aluminium, koporo, alloy ea titanium, tšepe e sa hloekang, joalo-joalo.
2. Lisebelisoa tse se nang tšepe: tse kang polasetiki (ho kenyeletsoa polyethylene PE, polypropylene PP, polyester PET le lifilimi tse ling tsa polasetiki), khalase (ho kenyeletsoa khalase e tloaelehileng, khalase e khethehileng e kang khalase e tšoeu ea ultra-white, khalase ea K9, khalase e phahameng ea borosilicate, khalase ea quartz, joalo-joalo, empa khalase e halefileng ka lebaka la thepa ea eona e khethehileng, 'mele oa ho phunya le pampiri ha o sa tšoanelehe bakeng sa thepa ea eona ea 'mele, ho phunya lesela la ceramic ka lebaka la thepa ea eona e khethehileng le pampiri ea ho phunya. ho.
3. Thepa e kopantsoeng: e entsoe ka lisebelisoa tse peli kapa ho feta tse nang le thepa e fapaneng ka mekhoa ea 'mele kapa ea lik'hemik'hale, e nang le thepa e phethahetseng.
4.Lisebelisoa tse khethehileng: Libakeng tse khethehileng, mechine ea laser punching e ka boela ea sebelisoa ho sebetsana le lisebelisoa tse khethehileng.
Litlhaloso tsa paramente
| Lebitso | Lintlha |
| Matla a Laser: | 1000W-6000W |
| Ho seha ho nepahala: | ±0.03MM |
| Botlaaseng ba aperture: | 0.1MM |
| Bolelele ba ho seha: | 650MM×800MM |
| Ho nepahala ha maemo: | ≤±0.008MM |
| Ho nepahala ho phetoa: | 0.008MM |
| Ho khaola khase: | Moea |
| Mohlala o tsitsitseng: | Pneumatic edge clamping, tšehetso ea fixture |
| Sistimi ea ho khanna: | Magnetic suspension linear motor |
| Ho khaola botenya | 0.01MM-3MM |
Melemo ea tekheniki
1.Ho cheka ka mokhoa o nepahetseng: Tšebeliso ea mahlaseli a laser a matla a matla bakeng sa ts'ebetso e sa amaneng le batho, ka potlako, motsotsoana oa 1 ho qeta ho sebetsa ha likoti tse nyenyane.
2.Ho nepahala ho phahameng: Ka ho laola ka mokhoa o nepahetseng matla, maqhubu a pulse le boemo bo lebisang tlhokomelo ea laser, ts'ebetso ea ho phunya ka ho nepahala ha micron e ka finyelloa.
3. E sebetsa ka ho pharaletseng: e ka sebetsana le mefuta e sa tšoaneng ea brittle, e thata ho sebetsa le lisebelisoa tse khethehileng, tse kang polasetiki, rabara, tšepe (tšepe e sa hloekang, aluminium, koporo, alloy ea titanium, joalo-joalo), khalase, li-ceramics joalo-joalo.
4. Ts'ebetso e bohlale: Mochini oa laser punching o na le tsamaiso e tsoetseng pele ea ho laola lipalo, e bohlale haholo ebile e bonolo ho e kopanya le moralo o thusoang ke k'homphieutha le tsamaiso ea tlhahiso ea k'homphieutha ho hlokomela lenaneo le potlakileng le ho ntlafatsa tsela e rarahaneng ea ho feta le ho sebetsa.
Maemo a mosebetsi
1.Diversity: e ka etsa mefuta e fapaneng ea ts'ebetso ea lesoba la sebopeho se rarahaneng, joalo ka masoba a chitja, masoba a lisekoere, masoba a likhutlo li tharo le masoba a mang a sebopeho se ikhethileng.
2.Boleng bo phahameng: Boleng ba sekoti bo phahame, moeli o boreleli, ha o na maikutlo a mabe, 'me deformation e nyenyane.
3.Automation: E ka phethela ts'ebetso ea micro-hole ka boholo bo lekanang ba aperture le kabo ea junifomo ka nako e le 'ngoe,' me e tšehetsa ts'ebetso ea lesoba la sehlopha ntle le ho kenella ka letsoho.
Likarolo tsa lisebelisoa
■ Boholo bo nyane ba lisebelisoa, ho rarolla bothata ba sebaka se moqotetsane.
■ Ho nepahala ho phahameng, sekoti se phahameng se ka fihla ho 0.005mm.
■ Thepa e sebetsa habonolo ebile e bonolo ho e sebelisa.
■ Mohloli oa leseli o ka nkeloa sebaka ho ea ka lisebelisoa tse fapaneng, 'me ho lumellana ho matlafala.
■ Sebaka se senyane se anngoeng ke mocheso, se na le oxidation e nyane ho potoloha masoba.
Sebaka sa kopo
1. Indasteri ea elektronike
● Printed Circuit Board (PCB) ho otla:
Microhole machining: E sebelisoa bakeng sa ho lokisa li-microholes tse bophara bo ka tlase ho 0.1mm ho PCBS ho fihlela litlhoko tsa liboto tsa high-density interconnect (HDI).
Likoti tse foufetseng le tse patiloeng: Ho sebetsa likoti tse foufetseng le tse patiloeng ka har'a PCBS tse ngata ho ntlafatsa ts'ebetso le kopanyo ea boto.
● Sephutheloana sa semiconductor:
Ho cheka foreimi e etellang pele: Likoti tse nepahetseng li entsoe ka foreimi e etellang pele ea semiconductor bakeng sa ho hokahanya chip ho potoloho ea kantle.
Wafer cutting aid: Phunya masoba ka har'a sephaphatha ho thusa lits'ebetsong tse latelang tsa ho seha le ho paka.
2. Mechini e nepahetseng
● Ho sebetsa ka likarolo tse nyane:
Ho cheka lisebelisuoa tse nepahetseng: Ho cheka masoba a phahameng ka ho fetesisa holim'a likere tse nyane bakeng sa sistimi ea phetisetso e nepahetseng.
Ho cheka karolo ea sensor: Ho etsa li-microholes ho likarolo tsa sensor ho ntlafatsa kutlo le lebelo la karabo ea kutlo.
●Ho Etsa Mold:
Sekoti se futhumatsang hlobo: Ho lokisa lesoba le pholileng holim'a hlobo ea ente kapa hlobo ea ho lahla mocheso ho ntlafatsa ts'ebetso ea ho qhala mocheso oa hlobo.
Ts'ebetso ea Vent: Ho lokisa masoba a manyane holim'a hlobo ho fokotsa mefokolo.
3. Lisebelisoa tsa bongaka
●Lisebelisoa tsa ho Buoa tse sa hlaselehang habonolo:
Catheter perforation: Li-microholes li sebetsoa ka har'a li-catheter tsa opereishene tse hlaselang haholo bakeng sa ho fana ka lithethefatsi kapa ho ntša metsi.
Likarolo tsa Endoscope: Likoti tse nepahetseng li entsoe ka lense kapa hlooho ea sesebelisoa ea endoscope ho ntlafatsa ts'ebetso ea sesebelisoa.
●Sistimi ea ho fana ka lithethefatsi:
Microneedle array drilling: Ho cheka li-microholes holim'a patch ea lithethefatsi kapa li-microneedle array ho laola sekhahla sa ho lokolloa ha lithethefatsi.
Ho cheka li-biochip: Li-microholes li sebetsoa ho li-biochips bakeng sa setso sa lisele kapa ho lemoha.
4. Lisebelisoa tsa Optical
● Sehokelo sa Fiber optic:
Ho cheka lesoba la optical fiber: Ho cheka li-microholes sefahlehong sa ho qetela sa sehokelo sa optical ho ntlafatsa katleho ea phetiso ea lets'oao la optical.
Fiber array machining: Ho lokisa masoba a nepahetseng haholo holim'a poleiti ea fiber array bakeng sa puisano ea likanale tse ngata.
●Sesefa sa Optical:
Filter drilling: Ho cheka li-microholes holim'a filthara ea optical ho fihlela khetho ea maqhubu a ikhethang.
Diffractive element machining: Ho cheka li-microholes holim'a lintho tse fapaneng tsa mahlo bakeng sa ho petsoha kapa ho bōptjoa ha lebone la laser.
5. Ho etsa likoloi
●Sistimi ea ente ea mafura:
Ho phunya nozzle ea ente: Ho sebetsa likoti tse nyane ka har'a molomo oa ente ho ntlafatsa phello ea athomo ea mafura le ho ntlafatsa ts'ebetso ea ho tuka.
●Moetso oa sensor:
Ho phunya sensor ea khatello: Ho sebetsa li-microholes ho diaphragm ea sensor ea khatello ho ntlafatsa kutlo le ho nepahala ha kutlo.
●Betri e matla:
Ho chekoa ha betri poleiti: Ho cheka li-microholes ho lithium betri pole chips ho ntlafatsa ho kenella ha electrolyte le lipalangoang tsa ion.
XKH e fana ka mefuta e mengata ea lits'ebeletso tsa setopong se le seng bakeng sa li-perforators tse nyane tsa litafole, ho kenyeletsoa empa ho sa felle feela ho: Boeletsi ba thekiso ea profeshenale, moralo o hlophisitsoeng oa lenaneo, phepelo ea lisebelisoa tsa boleng bo holimo, ts'ebetso e ntle ea ts'ebetso, koetliso e felletseng ea ts'ebetso, ho netefatsa hore bareki ba fumana boiphihlelo bo nepahetseng ka ho fetesisa, bo nepahetseng le bo sa tsotelleng ts'ebetsong ea ho otla.
Setšoantšo se qaqileng
