Sesebelisoa sa ho sireletsa SOI wafer hodima di-wafer tsa silicon tsa SOI (Silicon-On-Insulator) tsa lisenthimithara tse 8 le tse 6

E na le lera le ka hodimo la silicon, lera la oxide le sireletsang mocheso, le substrate ya silicon e ka tlase, wafer ya SOI ya mekhahlelo e meraro e fana ka melemo e ke keng ya lekanngwa dibakeng tsa di-microelectronic le RF. Lera le ka hodimo la silicon, le nang le silicon ya boleng bo hodimo ya kristale, le thusa ho kopanya dikarolo tse rarahaneng tsa elektroniki ka ho nepahala le bokgoni. Lera la oxide le sireletsang mocheso, le entsweng ka hloko ho fokotsa bokgoni ba dikokonyana, le ntlafatsa tshebetso ya sesebediswa ka ho fokotsa tshitiso e sa batleheng ya motlakase. Substrate ya silicon e ka tlase e fana ka tshehetso ya mechini mme e netefatsa hore e tsamaellana le mahlale a teng a ho sebetsana le silicon.

Ka har'a di-microelectronic, wafer ya SOI e sebetsa e le motheo wa tlhahiso ya dipotoloho tse hokahaneng tse tswetseng pele (di-IC) ka lebelo le phahameng, bokgoni ba motlakase le botshepehi. Moralo wa yona wa mekhahlelo e meraro o thusa ntshetsopele ya disebediswa tse rarahaneng tsa semiconductor tse kang di-IC tsa CMOS (Complementary Metal-Oxide-Semiconductor), MEMS (Micro-Electro-Mechanical Systems), le disebediswa tsa motlakase.

Sebakeng sa RF, wafer ea SOI e bonts'a ts'ebetso e ikhethang moralong le ts'ebetsong ea lisebelisoa le litsamaiso tsa RF. Bokhoni ba eona bo tlase ba likokoana-hloko, motlakase o phahameng oa ho phatloha, le thepa e ntle ea ho itšehla thajana li etsa hore e be substrate e ntle bakeng sa li-switch tsa RF, li-amplifier, li-filter le likarolo tse ling tsa RF. Ho feta moo, mamello ea mahlaseli a tlhaho ea wafer ea SOI e etsa hore e lokele lits'ebetso tsa lifofane le tsa ts'ireletso moo ho tšepahala libakeng tse thata ho leng bohlokoa haholo.

Ho feta moo, ho tenyetseha ha SOI wafer ho atoloha ho ea ho mahlale a macha a kang li-photonic integrated circuits (PICs), moo ho kopanngoa ha likarolo tsa optical le elektroniki holim'a substrate e le 'ngoe ho nang le tšepiso bakeng sa litsamaiso tsa puisano tsa mohala le tsa data tsa moloko o latelang.

Ka bokhutšoanyane, wafer ea Silicon-On-Insulator (SOI) ea mekhahlelo e meraro e eme ka pele ho boqapi lits'ebetsong tsa microelectronics le RF. Meralo ea eona e ikhethang le litšobotsi tse ikhethang tsa ts'ebetso li bula tsela bakeng sa tsoelo-pele indastering e fapaneng, e khanna tsoelo-pele le ho bopa bokamoso ba theknoloji.