Ts'ebetso ea TVG ho quartz sapphire BF33 wafer Glass wafer e punching

Ts'ebetso ea TVG ho quartz sapphire BF33 wafer Glass wafer punching Setšoantšo se hlahang

Tlhaloso e Khutšoanyane:

Ts'ebetso ea TGV (Ka Glass Via), ka mokhoa oa laser induction le corrosion process ho fihlela lesoba le lenyane (Min10μm) ka karoloana ea khalase, kalafo ea lesoba le foufetseng.

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Melemo ea TGV(Ka Glass Via) e bonahala haholo ho:

1) Litšobotsi tse ntle tsa motlakase tse phahameng haholo. Lisebelisoa tsa khalase ke lisebelisoa tsa insulator, kamehla dielectric e ka bang 1/3 feela ea thepa ea silicon, ntlha ea tahlehelo ke litaelo tse 2-3 tsa boholo bo tlase ho feta thepa ea silicon, e leng se etsang hore tahlehelo ea substrate le liphello tsa likokoana-hloko li fokotsehe haholo ho netefatsa hore botšepehi ba pontšo e fetisitsoeng;

(2) Boholo bo boholo le karolo e nyane ea khalase e tšesaane ho bonolo ho e fumana. Re ka fana ka Sapphire, Quartz, Corning, le SCHOTT le bahlahisi ba bang ba likhalase ba ka fana ka boholo bo boholo (> 2m × 2m) le khalase e tšesaane haholo (<50µm) le lisebelisoa tsa khalase tse tšesaane haholo.

3) Theko e tlaase. Ho rua molemo ho tsoa ho phihlello e bonolo ea khalase ea boholo bo boholo bo tšesaane haholo, 'me ha e hloke hore ho behoe likarolo tsa insulating, theko ea tlhahiso ea poleiti ea adaptara ea khalase e ka ba 1/8 feela ea poleiti ea adaptara e thehiloeng ka silicon;

4) Mokhoa o bonolo. Ha ho na tlhoko ea ho kenya lera le sireletsang holim'a karolo e ka tlaase ea lerako le lebota le ka hare la TGV(Ka Glass Via), 'me ha ho hlokahale hore ho be le ho sesa ho pate ea adaptara e tšesaane haholo;

(5) Botsitso bo matla ba mechine. Le ha botenya ba poleiti ea adaptara bo ka tlase ho 100µm, warpage e ntse e le nyane;

6) Mefuta e mengata ea lisebelisoa. Ho phaella ho tebello e ntle ea kopo tšimong ea maqhubu a phahameng, e le ntho e bonahalang, e ka boela ea sebelisoa tšimong ea ho kopanya tsamaiso ea optoelectronic, airtightness le melemo ea ho hanyetsa kutu ho etsa hore khalase ea khalase tšimong ea MEMS encapsulation e be le bokhoni bo boholo.

Hajoale, k'hamphani ea rona e fana ka khalase ea TGV (Ka Glass Via) ka theknoloji ea lesoba, e ka hlophisa ts'ebetso ea lisebelisoa tse kenang le ho fana ka sehlahisoa ka kotloloho. Re ka fana ka Sapphire, Quartz, Corning, le SCHOTT, BF33 le likhalase tse ling. Haeba u na le tlhoko, u ka ikopanya le rona ka ho toba neng kapa neng! Rea u amohela ho botsa!