Sethaleng sa ho Bea Moea sa SiC se Nepahetseng ka ho Fetisisa

Tlhaloso e Khutšoanyane:

Ka phetoho e tswelang pele ya indasteri ya di-semiconductor, disebediswa tsa ho sebetsana le ho hlahloba di hloka tshebetso e phahameng le ho feta. Ha re haha hodima boiphihlelo bo pharaletseng ba taolo ya motsamao le boemo ba nanometer, re thehile sethala sa H-type dual-axis ultra-precision air-bearing stage.

Romella imeile ho rona

Likaroloana

Setšoantšo se qaqileng

Kakaretso

E entsoe ka sebopeho sa letsopa sa silicon carbide (SiC) se ntlafalitsoeng ka finite-element-optimized electrode le theknoloji e lefelloang ea ho jara moea, sethala sena se fana ka ho nepahala ho ikhethang, ho tiea le karabelo e matla. E loketse hantle bakeng sa:

Ts'ebetso le tlhahlobo ea semiconductor
Tlhahiso ea micro/nano le metrology
Ho seha le ho bentša ka tekanyo ea nanometer
Ho hlahloba ka nepo ka lebelo le phahameng

Likarolo tsa Bohlokoa

Tsela e tsamaisang moea e nang le SiCbakeng sa ho thatafala le ho nepahala ho phahameng haholo
Matla a phahameng: lebelo ho fihlela ho 1 m/s, ho potlakisa ho fihla ho 4 g, ho tsitsisa ka potlako
Mokhahlelo oa Y oa gantry o nang le li-drive tse pelie netefatsa bokgoni bo phahameng ba mojaro le botsitso
Likhetho tsa encoder: grating ea optical kapa interferometer ea laser
Ho nepahala ha sebaka: ± 0.15 μm;ho pheta-pheta: ± 75 nm
Tsela e ntlafalitsoeng ea cablebakeng sa moralo o hloekileng le botšepehi ba nako e telele
Litlhophiso tse ka fetoloangbakeng sa litlhoko tse ikhethileng tsa kopo

Moralo o Nepahetseng ka ho Fetisisa le Meralo e Tsamaiswang ka ho Otloloha, e sa Amaneng le Batho

Foreimi ea Ceramic ea SiC: ~5 × ho tiea ha motsoako oa aluminium le ~5 × katoloso e tlase ea mocheso, ho netefatsa botsitso ba lebelo le phahameng le ho tiea ha mocheso.
Ho Bea Moeeng ho Lefelloang: Moralo oa thepa o ntlafatsa ho satalla, bokhoni ba mojaro, le botsitso ba motsamao.
Tshebetso e Matla: E tšehetsa lebelo la 1 m/s le ho potlakisa ha 4 g, e loketse lits'ebetso tse nang le phallo e phahameng.
Kopanyo e se nang seamless: E lumellana le litsamaiso tsa ho itšehla thajana ka ho thothomela, mekhahlelo e potolohang, li-module tse sekametseng, le li-platform tsa ho sebetsana le li-wafer.
Tsamaiso ea Likheibole: Radius e kobehileng e laoloang e fokotsa khatello ea maikutlo bakeng sa bophelo bo bolelele ba tšebeletso.

Motlakase o se nang Coreless Linear: Motsamao o boreleli o se nang matla a ho kobeha.
Koloi ea Lienjene tse ngata: Ho beoa ha enjene ka sefofaneng ho ntlafatsa ho otloloha, ho ba bataletse, le ho nepahala ha angular.
Ho itšehla thajana ka mocheso: Li-motor li arotsoe ho tloha sebopehong sa sethala; ho pholisa moea kapa metsi ka boikhethelo bakeng sa lipotoloho tse sebetsang haholo.

Litlhaloso

Mohlala	400-400	500-500	600-600
Lilepe	X (skena) / Y (mohato)	X (skena) / Y (mohato)	X (skena) / Y (mohato)
Maeto (mm)	400/400	500/500	600/600
Ho nepahala (μm)	± 0.15	± 0.2	± 0.2
Ho pheta-pheta (nm)	±75	± 100	± 100
Qeto (nm)	0.3	0.3	0.3
Lebelo le Phahameng (m/s)	1	1	1
Ho potlaka (g)	4	4	4
Ho otloloha (μm)	± 0.2	± 0.3	± 0.4
Botsitso (nm)	± 5	± 5	± 5
Moroalo o Moholo (kg)	20	20	20
Sekontiri/Moqolo/Ho hlaba (arc-sec)	± 1	± 1	± 1

Maemo a Teko:

Phepelo ea moea: e hloekile, e omme; ntlha ea phoka ≤ 0°F; ho sefa ha likaroloana ≤ 0.25 μm; kapa naetrojene ea 99.99%.
Ho nepahala ho lekantsoeng 25 mm ka holimo ho setsi sa sethala ho 20±1 °C, 40–60% RH.

Likopo

Lithography ea semiconductor, tlhahlobo le ts'ebetso ea wafer
Tlhahiso ea micro/nano le metrology e nepahetseng
Tlhahiso ea optics ea maemo a holimo le interferometry
Lifofane le lipatlisiso tse tsoetseng pele tsa saense

Lipotso Tse Botsoang Khafetsa - Sethaleng sa ho Bea Moea sa Silicon Carbide

1. Sethaleng se jereng moya ke eng?

Sethala se jereng moea se sebelisa filimi e tšesaane ea moea o hatelletsoeng pakeng tsa sethala le tsela e tataisang ho fana kaha e na khohlano, ha e senyehe, 'me e tsamaea hantle haholoHo fapana le dibering tsa metjhini tse tlwaelehileng, e tlosa ho thella ha stick-slip, e fana ka ho nepahala ha nanometer, mme e tshehetsa ho tshepahala ha nako e telele.

2. Ke hobane'ng ha ho sebelisoa silicon carbide (SiC) bakeng sa sebopeho sa sethala?

Ho satalla ho hoholo: ~5× ea motsoako oa aluminium, e fokotsang phetoho nakong ea motsamao o matla.
Katoloso e tlase ea mocheso: ~5× tlase ho feta aluminium, ho boloka ho nepahala tlasa diphetoho tsa mocheso.
E bobebe: Boima bo tlase ha bo bapisoa le tšepe, e leng se nolofalletsang ts'ebetso ea lebelo le phahameng le e potlakileng haholo.
Botsitso bo babatsehang: Ho damping le ho tiea ho hoholo bakeng sa ho beha sebaka ka nepo haholo.

3. Na sethala se hloka setlolo kapa tlhokomelo?

Ha ho hlokahale setlolo sa setso kaha ho na leha ho na ho kopana ha mechineTlhokomelo e khothaletsoang e kenyeletsa:

Ho fana ka thepamoea o hloekileng, o omileng o hatelletsoeng kapa naetrojene
Tlhahlobo ea nako le nako ea li-filters le li-dryer
Ho beha leihlo likhoele le litsamaiso tsa ho pholisa

4. Litlhoko tsa phepelo ea moea ke life?

Ntlha ea phoka: ≤ 0 °F (≈ –18 °C)
Ho sefa ha likaroloana: ≤ 0.25 μm
Moea o hloekileng, o omileng kapa naetrojene e hloekileng ea 99.99%
Khatello e tsitsitseng e nang le phetoho e fokolang

Mabapi le rona

XKH e ikhethile ka nts'etsopele ea theknoloji e phahameng, tlhahiso le thekiso ea khalase e khethehileng ea mahlo le thepa e ncha ea kristale. Lihlahisoa tsa rona li sebeletsa lisebelisoa tsa elektroniki tsa mahlo, lisebelisoa tsa elektroniki tsa bareki le sesole. Re fana ka likarolo tsa mahlo tsa Sapphire, likoahelo tsa lense ea mohala oa thekeng, Ceramics, LT, Silicon Carbide SIC, Quartz, le li-wafer tsa kristale tsa semiconductor. Ka boiphihlelo bo nang le boiphihlelo le lisebelisoa tsa sejoale-joale, re ipabola ts'ebetsong ea lihlahisoa tse seng tsa maemo a holimo, re ikemiselitse ho ba khoebo e etellang pele ea theknoloji e phahameng ea lisebelisoa tsa optoelectronic.