Thepa ea Wafer Thinning bakeng sa 4 Inch-12 Inch Sapphire/SiC/Si Wafers Processing

Tlhaloso e Khutšoanyane:

Wafer Thinning Equipment ke sesebelisoa sa bohlokoa tlhahisong ea semiconductor bakeng sa ho fokotsa botenya ba wafer ho ntlafatsa taolo ea mocheso, ts'ebetso ea motlakase le ts'ebetso ea ho paka. Sesebelisoa sena se sebelisa ho sila ka mochini, ho belisoa ha lik'hemik'hale (CMP), le mahlale a omileng / a metsi ho fihlela taolo e nepahetseng ea botenya (± 0.1 μm) le ho tsamaellana le li-wafers tsa 4-12-inch. Sistimi ea rona e ts'ehetsa sebopeho sa sefofane sa C/A mme se etselitsoe lits'ebetso tse tsoetseng pele joalo ka 3D ICs, lisebelisoa tsa motlakase (IGBT/MOSFETs), le lisensara tsa MEMS.

XKH e fana ka litharollo tse felletseng, ho kenyeletsoa lisebelisoa tse ikhethileng (2-12-inch wafer process), ts'ebetso ea ts'ebetso (bofokoli ba <100/cm²), le koetliso ea tekheniki.

Re romelle lengolo-tsoibila

Likaroloana

Molao-motheo oa ho Sebetsa

Ts'ebetso ea ho fokotsa li-wafer e sebetsa ka mekhahlelo e meraro:
Ho Sila ka Matla: Lebili la daemane (saese ea grit 200–500 μm) le tlosa 50-150 μm ea thepa ka 3000–5000 rpm ho fokotsa botenya ka potlako.
Ho Sila hamonate: Lebili le letle haholoanyane (boholo ba grit 1–50 μm) bo fokotsa botenya ho isa ho 20-50 μm ho <1 μm/s ho fokotsa tšenyo e ka tlas’a lefatše.
Ho hloekisoa (CMP): slurry ea lik'hemik'hale tsa lik'hemik'hale li felisa tšenyo e setseng, ho finyella Ra <0.1 nm.

Lintho Tse Lumellanang

Silicon (Si): E tloaelehileng bakeng sa li-wafers tsa CMOS, tse tšesaane ho isa ho 25 μm bakeng sa 3D stacking.
Silicon Carbide (SiC): E hloka mabili a khethehileng a daemane (80% ea daemane concentration) bakeng sa botsitso ba mocheso.
Sapphire (Al₂O₃): E tšesaane ho isa ho 50 μm bakeng sa lisebelisoa tsa UV LED.

Likarolo tsa Core System

1. Sistimi ea ho sila
Dual-Axis Grinder: E kopanya ho sila e mahoashe / e ntle sethaleng se le seng, ho fokotsa nako ea potoloho ka 40%.
Aerostatic Spindle: lebelo la lebelo la 0–6000 rpm le <0.5 μm radial runout.

2. Sistimi ea ho sebetsana le Wafer
Vacuum Chuck: > 50 N e ts'oereng matla a ± 0.1 μm ka nepo.
Robotic Arm: E tsamaisa liphaephe tse 4-12-inch ka 100 mm/s.

3. Sistimi ea taolo
Laser Interferometry: Tekolo ea botenya ba nako ea 'nete (qeto 0.01 μm).
AI-Driven Feedforward: E bolela esale pele ka ho roaloa ha mabili le ho fetola liparamente ka bo eona.

4. Ho Pholisa le ho Hloekisa
Ho hloekisa ka Ultrasonic: E tlosa likaroloana> 0.5 μm ka katleho ea 99.9%.
Metsi a Deionized: A pholisa sephaphatha ho fihla ho <5°C ka holim'a tikoloho.

Melemo ea Konokono

1. Ultra-High Precision: TTV (Total Thickness Variation) <0.5 μm, WTW (Kahare-Wafer Thickness Variation) <1 μm.

2. Multi-Process Integration: E kopanya ho sila, CMP, le plasma etching mochine o le mong.

3. Tšebelisano 'moho:
Silicon: Phokotso ea botenya ho tloha ho 775 μm ho isa ho 25 μm.
SiC: E fihlella <2 μm TTV bakeng sa lits'ebetso tsa RF.
Li-wafers tsa Doped: Li-wafers tsa phosphorus-doped InP tse nang le <5% resistivity drift.

4. Smart Automation: Ho kopanya MES ho fokotsa liphoso tsa batho ka 70%.

5. Tšebeliso ea Matla a Matla: 30% ea tšebeliso e tlase ea matla ka braking e nchafatsang.

Lisebelisoa tsa Bohlokoa

1. Packaging e tsoetseng pele
• 3D ICs: Wafer thinning e thusa ho bokellana ka ho otloloha ha logic/memory chips (mohlala, HBM stacks), ho fihlella 10× high bandwidth le 50% e fokotsehileng tšebeliso ea matla ha e bapisoa le tharollo ea 2.5D. Thepa e ts'ehetsa bonding ba hybrid bonding le TSV (Through-Silicon Via) kopanyo, e bohlokoa bakeng sa li-processor tsa AI/ML tse hlokang <10 μm interconnect pitch. Mohlala, li-wafers tse 12-inch tse tšesaane ho isa ho 25 μm li lumella ho bokella likarolo tse 8+ ha li ntse li boloka <1.5% warpage, e bohlokoa bakeng sa litsamaiso tsa likoloi tsa LiDAR.

• Sephutheloana sa Fan-Out: Ka ho fokotsa botenya ba wafer ho 30 μm, bolelele ba khokahanyo bo khutsufatsoa ka 50%, ho fokotsa tieho ea matšoao (<0.2 ps/mm) le ho nolofalletsa 0.4 mm li-chiplets tse tšesaane haholo bakeng sa li-SoC tse tsamaeang. Ts'ebetso e phahamisa li-algorithms tsa ho sila tse lefelloang ke khatello ea maikutlo ho thibela warpage (> 50 μm TTV control), ho netefatsa ts'epahalo lits'ebetsong tse phahameng tsa RF.

2. Motlakase oa elektroniki
• IGBT Modules: Ho tšesaane ho 50 μm ho fokotsa ho hanyetsa mocheso ho <0.5 ° C / W, ho nolofalletsa 1200V SiC MOSFETs ho sebetsa mocheso oa 200 ° C. Lisebelisoa tsa rona li sebelisa ho sila ka mekhahlelo e mengata(mahoashe: 46 μm grit → e ntle: 4 μm grit) ho felisa tšenyo e ka tlas'a lefatše, ho fihlela> 10,000 cycles ea ho tšepahala ha libaesekele tse futhumetseng. Sena se bohlokoa bakeng sa li-inverters tsa EV, moo li-wafers tsa SiC tse 10 μm tse teteaneng li ntlafatsang lebelo la ho fetoha ka 30%.
• Lisebelisoa tsa Matla a GaN-on-SiC: Wafer e tšesaane ho isa ho 80 μm e ntlafatsa ho tsamaea ha elektronike (μ > 2000 cm²/V·s) bakeng sa 650V GaN HEMTs, ho fokotsa tahlehelo ea conduction ka 18%. Ts'ebetso ena e sebelisa "laser-assisted dicing" ho thibela ho phatloha nakong ea ho ota, ho fihlela <5 μm edge chipping bakeng sa liamplifi tsa matla tsa RF.

3. Optoelectronics
• Li-LED tsa GaN-on-SiC: Li-substrates tsa 50 μm tsa safire li ntlafatsa bokhoni ba ho ntša leseli (LEE) ho ea ho 85% (vs. 65% bakeng sa li-wafers tsa 150 μm) ka ho fokotsa ho tšoasoa ha photon. Taolo ea rona ea TTV e tlase haholo (<0.3 μm) e netefatsa tlhahiso e ts'oanang ea LED ho pholletsa le li-wafers tse 12-inch, e leng ea bohlokoa bakeng sa lipontšo tsa Micro-LED tse hlokang <100nm wavelength ho ts'oana.
• Silicon Photonics: Li-wafers tsa silicon tse teteaneng tsa 25μm li nolofalletsa 3 dB / cm tahlehelo e fokolang ea ho phatlalatsoa ho li-waveguides, tse hlokahalang bakeng sa 1.6 Tbps transceivers optical. Ts'ebetso e kopanya CMP boreleli ho fokotsa ho hlaba holimo ho Ra <0.1 nm, ho ntlafatsa katleho ea ho kopanya ka 40%.

4. Li-Sensors tsa MEMS
• Accelerometers: 25 μm silicon wafers finyella SNR > 85 dB (vs. 75 dB bakeng sa 50 μm wafers) ka ho eketsa bopaki-boima ba displacement kutlo. Sistimi ea rona ea li-axis tse peli e lefella likhatello tsa khatello ea maikutlo, e netefatsa hore <0.5% ea kutlo e hoholeha ho feta -40°C ho isa ho 125°C. Lisebelisoa li kenyelletsa ho lemoha ha likoloi li soahlamane le ho latedisa motsamao wa AR/VR.

• Li-Sensors tsa Khatello: Ho tšesaane ho isa ho 40 μm ho nolofaletsa 0–300 methapo ea ho metha ka <0.1% FS hysteresis. U sebelisa li-bonding tsa nakoana (lijari tsa khalase), ts'ebetso e qoba ho robeha ha sephaephe nakong ea etching e ka morao, ho fihlela <1 μm ho mamella khatello e feteletseng bakeng sa li-sensor tsa IoT tsa indasteri.

• Tekheniki Synergy: Thepa ea rona e tšesaane e kopanya ho sila ka mochini, CMP, le plasma etching ho rarolla mathata a fapaneng a thepa (Si, SiC, Sapphire). Mohlala, GaN-on-SiC e hloka ho sila ka lebasetere (mabili a daemane + plasma) ho leka-lekanya ho thatafala le ho atolosoa ha mocheso, ha li-sensor tsa MEMS li batla bokhopo ba bokaholimo ba 5 nm ka ho belisoa ha CMP.

• Phello ea Indasteri: Ka ho nolofalletsa li-wafers tse tšesaane, tse sebetsang hantle haholo, theknoloji ena e khanna mekhoa e mecha ho li-chips tsa AI, 5G mmWave modules, le lisebelisoa tsa motlakase tse feto-fetohang, tse nang le mamello ea TTV <0.1 μm bakeng sa lipontšo tse phuthoang le <0.5 μm bakeng sa lisensara tsa LiDAR tsa likoloi.

Litšebeletso tsa XKH

1. Customized Solutions
Litlhophiso tse Scalable: meralo ea kamore ea 4-12-inch e kenyang / ho laolla.
Tšehetso ea Doping: Litlolo tse tloaelehileng tsa likristale tsa Er/Yb-doped le li-wafers tsa InP/GaAs.

2. Tšehetso ea ho qetela
Nts'etsopele ea Ts'ebetso: Teko ea mahala e sebetsa ka optimization.
Koetliso ea Lefatše: Lithupelo tsa tekheniki selemo le selemo mabapi le tlhokomelo le ho rarolla mathata.

3. Multi-Material Processing
SiC: Wafer e tšesaane ho isa ho 100 μm ka Ra <0.1 nm.
Sapphire: botenya ba 50μm bakeng sa lifensetere tsa laser tsa UV (transmittance>92%@200 nm).

4. Litšebeletso tsa Keketso ea Boleng
Phepelo e ka jeoang: Mabili a daemane (li-wafers tse 2000+ / bophelo) le li-slurries tsa CMP.

Qetello

Sesebediswa sena sa wafer thinning se fana ka ts'ebetso e etelletseng pele indastering, ho sebetsa ka mefuta e mengata ea lintho tse ngata, le automation e bohlale, e etsa hore e be ea bohlokoa bakeng sa ho kopanya 3D le lisebelisoa tsa elektroniki tsa motlakase. Lits'ebeletso tse felletseng tsa XKH - ho tloha ho tlhophiso ho isa ho ts'ebetso ea morao-rao - etsa bonnete ba hore bareki ba fihlella katleho ea litšenyehelo le bokhabane ba ts'ebetso molemong oa tlhahiso ea semiconductor.