Lisebelisoa tsa ho Fokotsa Wafer bakeng sa Ts'ebetso ea Sapphire/SiC/Si Wafers ea lisenthimithara tse 4-12

Tlhaloso e Khutšoanyane:

Sesebelisoa sa ho Thibela Wafer ke sesebelisoa sa bohlokoa tlhahisong ea semiconductor bakeng sa ho fokotsa botenya ba wafer ho ntlafatsa tsamaiso ea mocheso, ts'ebetso ea motlakase le katleho ea ho paka. Sesebelisoa sena se sebelisa ho sila ka mechine, ho polishing ka mechine ea lik'hemik'hale (CMP), le mahlale a ho fata a omileng/a metsi ho fihlela taolo ea botenya bo nepahetseng haholo (± 0.1 μm) le ho lumellana le li-wafer tsa lisenthimithara tse 4–12. Litsamaiso tsa rona li tšehetsa tataiso ea C/A-plane 'me li etselitsoe lits'ebetso tse tsoetseng pele joalo ka li-IC tsa 3D, lisebelisoa tsa motlakase (IGBT/MOSFET), le li-sensor tsa MEMS.

XKH e fana ka ditharollo tse feletseng, ho kenyeletswa le disebediswa tse ikgethileng (tshebetso ya wafer ya di-inch tse 2–12), ntlafatso ya tshebetso (botenya ba diphoso <100/cm²), le thupelo ya botekgeniki.

Romella imeile ho rona

Likaroloana

Molao-motheo oa ho Sebetsa

Mokhoa oa ho fokotsa mafura a khoho o sebetsa ka mekhahlelo e meraro:
Ho Sila ka Bohlasoa: Lebili la taemane (boholo ba lehlohlojane 200–500 μm) le tlosa 50–150 μm ea thepa ka lebelo la 3000–5000 rpm ho fokotsa botenya ka potlako.
Ho Sila Hantle: Lebili le lesesaane (boholo ba lehlohlojane 1–50 μm) le fokotsa botenya ho 20–50 μm ka <1 μm/s ho fokotsa tshenyo e ka tlase ho bokaholimo.
Ho bentsha (CMP): Lerotholi la lik'hemik'hale le mechine le felisa tšenyo e setseng, le fihlella Ra <0.1 nm.

Lisebelisoa tse lumellanang

Silicon (Si): E tloaelehileng bakeng sa li-wafer tsa CMOS, tse fokolitsoeng ho fihlela ho 25 μm bakeng sa ho bokellana ka 3D.
Silicon Carbide (SiC): E hloka mabili a khethehileng a taemane (matla a 80% a taemane) bakeng sa botsitso ba mocheso.
Sapphire (Al₂O₃): E fokoditswe ho fihlela ho 50 μm bakeng sa ditshebediso tsa LED tsa UV.

Likarolo tsa Sistimi ea Motheo

1. Sistimi ea ho Sila
Sesebelisoa sa ho sila se nang le mekhahlelo e 'meli: Se kopanya ho sila ho hoholo/ho honyenyane sethaleng se le seng, se fokotsa nako ea potoloho ka 40%.
Sekotwana sa Aerostatic Spindle: lebelo la 0–6000 rpm le nang le lebelo la radial la <0.5 μm.

2. Sistimi ea ho Tšoara Wafer
Vacuum Chuck: Matla a ho tshwara a >50 N a nang le ho nepahala ha ho beha sebaka sa ±0.1 μm.
Letsoho la Robotic: E tsamaisa di-wafer tsa di-inch tse 4–12 ka lebelo la 100 mm/s.

3. Sistimi ea Taolo
Interferometry ea Laser: Tlhokomelo ea botenya ba nako ea sebele (resolution 0.01 μm).
Tlhahiso-pele e Tsamaiswang ke AI: E bolela esale pele ho senyeha ha mabili mme e fetola diparamitha ka bohona.

4. Ho Pholisa le ho Hloekisa
Ho Hloekisa ka Ultrasonic: Ho tlosa dikarolwana tse >0.5 μm ka bokgoni ba 99.9%.
Metsi a hloekisitsoeng: A pholisa wafer ho fihlela ho <5°C ka holim'a tikoloho.

Melemo ea Bohlokoa

1. Ho nepahala ho Phahameng ka ho Fetisisa: TTV (Phetoho e Felletseng ea Botenya) <0.5 μm, WTW (Phetoho e ka Hare ho Botenya ba Wafer) <1 μm.

2. Ho Kopanya Mekhoa e Mengata: Ho kopanya ho sila, CMP, le ho hlaba ha plasma mochining o le mong.

3. Ho Tsamaellana ha Lintho:
Silicone: Phokotso ea botenya ho tloha ho 775 μm ho isa ho 25 μm.
SiC: E fihlella <2 μm TTV bakeng sa lits'ebetso tsa RF.
Li-wafer tse nang le Doped: Li-wafer tsa InP tse nang le Phosphorus tse nang le resistivity drift e ka tlase ho 5%.

4. Smart Automation: Ho kopanngoa ha MES ho fokotsa liphoso tsa batho ka 70%.

5. Tshebetso e Botle ya Matla: Tshebediso ya matla e tlase ka 30% ka ho brake e ntjhafatsang.

Litšebeliso tsa Bohlokoa

1. Sephutheloana se Tsoetseng Pele
• Li-IC tsa 3D: Ho fokotsa Wafer ho nolofalletsa ho bokellana ka ho otloloha ha li-chip tsa logic/memori (mohlala, li-stack tsa HBM), ho fihlella bandwidth e phahameng ea 10× le tšebeliso ea matla e fokotsehileng ka 50% ha ho bapisoa le litharollo tsa 2.5D. Lisebelisoa li tšehetsa ho kopanya ha hybrid le kopanyo ea TSV (Through-Silicon Via), ea bohlokoa bakeng sa li-processor tsa AI/ML tse hlokang ho hokela ha <10 μm. Mohlala, li-wafer tsa lisenthimithara tse 12 tse fokolitsoeng ho fihlela ho 25 μm li lumella ho bokellana ha likarolo tse 8+ ha li ntse li boloka <1.5% ea warpage, ea bohlokoa bakeng sa litsamaiso tsa LiDAR tsa likoloi.

• Sephutheloana sa Fan-Out: Ka ho fokotsa botenya ba wafer ho 30 μm, bolelele ba kgokelo bo kgutsufatswa ka 50%, ho fokotsa tieho ya letshwao (<0.2 ps/mm) le ho nolofalletsa di-chiplets tse tshesane haholo tsa 0.4 mm bakeng sa di-SoC tsa mehala. Tshebetso ena e sebedisa di-algorithms tsa ho sila tse lefellwang ke kgatello ya maikutlo ho thibela warpage (taolo ya TTV ya >50 μm), ho netefatsa botshepehi ditshebedisong tsa RF tse nang le maqhubu a hodimo.

2. Lisebelisoa tsa Elektroniki tsa Matla
• Dimojule tsa IGBT: Ho fokotsa mocheso ho fihlela ho 50 μm ho fokotsa ho hanyetsa mocheso ho <0.5°C/W, ho nolofalletsa di-MOSFET tsa SiC tsa 1200V ho sebetsa mochesong wa 200°C. Disebediswa tsa rona di sebedisa ho sila ka mekhahlelo e mengata (hoashe: 46 μm grit → fine: 4 μm grit) ho fedisa tshenyo e ka tlase ho bokahodimo, ho fihlella dipotoloho tse fetang 10,000 tsa tshepahalo ya potoloho ya mocheso. Sena se bohlokwa bakeng sa di-inverter tsa EV, moo di-wafer tsa SiC tse teteaneng ka 10 μm di ntlafatsang lebelo la ho tjhentjha ka 30%.
• Disebediswa tsa Matla tsa GaN-on-SiC: Ho fokotsa motlakase ka wafer ho fihlela ho 80 μm ho ntlafatsa motsamao wa dielektrone (μ > 2000 cm²/V·s) bakeng sa 650V GaN HEMTs, ho fokotsa tahlehelo ya conduction ka 18%. Tshebetso ena e sebedisa dicing tse thuswang ke laser ho thibela ho petsoha nakong ya ho fokotsa motlakase, ho fihlella <5 μm edge chipping bakeng sa di-amplifiers tsa matla a RF.

3. Lisebelisoa tsa Optoelectronic
• Di-LED tsa GaN-on-SiC: Di-substrate tsa safire tsa 50 μm di ntlafatsa bokgoni ba ho ntsha lesedi (LEE) ho isa ho 85% (ha ho bapiswa le 65% bakeng sa di-wafer tsa 150 μm) ka ho fokotsa ho tshwasa ha photon. Taolo ya TTV e tlase haholo ya disebediswa tsa rona (<0.3 μm) e netefatsa ho ntshwa ha LED ka ho tshwana ho pholletsa le di-wafer tsa 12-inch, e leng sa bohlokwa bakeng sa dipontsho tsa Micro-LED tse hlokang ho tshwana ha bolelele ba leqhubu ba <100nm.
• Silicon Photonics: Li-wafer tsa silicon tse teteaneng ba 25μm li nolofalletsa tahlehelo ea ho ata ha 3 dB/cm tlase ho li-waveguide, e leng ea bohlokoa bakeng sa li-transceiver tsa optical tsa 1.6 Tbps. Ts'ebetso ena e kopanya CMP e boreleli ho fokotsa ho rarahana ha bokaholimo ho Ra <0.1 nm, e ntlafatsang katleho ea ho kopanya ka 40%.

4. Li-sensor tsa MEMS
• Li-accelerometer: Li-wafer tsa silicon tsa 25 μm li fihlella SNR >85 dB (ha li bapisoa le 75 dB bakeng sa li-wafer tsa 50 μm) ka ho eketsa kutloisiso ea ho falla ha bopaki. Sistimi ea rona ea ho sila ea dual-axis e lefella mekhahlelo ea khatello, e netefatsa hore <0.5% ea kutloisiso e tsamaea ho feta -40°C ho isa ho 125°C. Lisebelisoa li kenyelletsa ho lemoha likotsi tsa likoloi le ho latela motsamao oa AR/VR.

• Disensor tsa Kgatelelo: Ho fokotsa ho fihla ho 40 μm ho nolofalletsa maemo a tekanyo ya di-bar a 0–300 ka <0.1% FS hysteresis. Ka ho sebedisa bonding ya nakwana (dijari tsa khalase), tshebetso ena e qoba ho robeha ha wafer nakong ya ho tjhesa ka morao, e fihlella mamello ya kgatello e feteletseng ya <1 μm bakeng sa disensor tsa IoT tsa diindasteri.

• Tšebelisano-'moho ea Tekheniki: Sesebelisoa sa rona sa ho fokotsa li-wafer se kopanya ho sila ka mechine, CMP, le ho hlaba ka plasma ho sebetsana le liphephetso tse fapaneng tsa thepa (Si, SiC, Sapphire). Mohlala, GaN-on-SiC e hloka ho sila ka motsoako (mabili a taemane + plasma) ho leka-lekanya thatafalo le katoloso ea mocheso, ha li-sensor tsa MEMS li hloka ho ba thata ha bokaholimo ba sub-5 nm ka ho bentša CMP.

• Tšusumetso ea Indasteri: Ka ho nolofalletsa li-wafer tse tšesaane, tse sebetsang hantle, theknoloji ena e khanna boqapi ho li-chip tsa AI, li-module tsa 5G mmWave, le lisebelisoa tsa elektroniki tse tenyetsehang, ka mamello ea TTV <0.1 μm bakeng sa lipontšo tse menoang le <0.5 μm bakeng sa li-sensor tsa LiDAR tsa likoloi.

Litšebeletso tsa XKH

1. Litharollo tse Ikhethileng
Litlhophiso tse ka Atolosoang: Meralo ea kamore ea lisenthimithara tse 4–12 e nang le ho kenya/ho jarolla ka boiketsetso.
Tšehetso ea ho sebelisa lithethefatsi: Liresepe tse ikhethileng bakeng sa likristale tse entsoeng ka Er/Yb le li-wafer tsa InP/GaAs.

2. Tšehetso ea ho tloha qetellong ho isa qetellong
Ntlafatso ea Ts'ebetso: Teko ea mahala e sebetsa ka ntlafatso.
Koetliso ea Lefatše ka Bophara: Lithupelo tsa botekgeniki selemo le selemo mabapi le tlhokomelo le ho rarolla mathata.

3. Ts'ebetso ea Lintho tse Ngata
SiC: Ho fokotseha ha wafer ho fihlela ho 100 μm ka Ra <0.1 nm.
Safire: Botenya ba 50μm bakeng sa lifensetere tsa laser tsa UV (transmittance >92%@200 nm).

4. Litšebeletso tse Ekelitsoeng Boleng
Phepelo e ka sebediswang: Mabili a taemane (di-wafer tse fetang 2000/bophelo) le di-slurry tsa CMP.

Qetello

Sesebelisoa sena sa ho fokotsa wafer se fana ka ho nepahala ho etellang pele indastering, ho tenyetseha ha thepa e mengata, le boiketsetso bo bohlale, e leng se etsang hore e be ea bohlokoa bakeng sa kopanyo ea 3D le lisebelisoa tsa motlakase. Litšebeletso tse felletseng tsa XKH—ho tloha ho khetho ho isa ho ts'ebetsong ea kamora ho sebetsa—li netefatsa hore bareki ba fihlella katleho ea litšenyehelo le bokhabane ba ts'ebetso tlhahisong ea li-semiconductor.