Botenya ba Substrate ea LN-on-Si Composite ea lisenthimithara tse 6-8 0.3-50 μm Si/SiC/Sapphire ea Lisebelisoa
Likarolo tsa Bohlokoa
Karolo e kopaneng ea LN-on-Si ea lisenthimithara tse 6 ho isa ho tse 8 e khetholloa ka thepa ea eona e ikhethang ea thepa le liparamente tse ka fetoloang, e nolofalletsang ts'ebeliso e pharaletseng indastering ea semiconductor le optoelectronic:
1. Ho lumellana ha Wafer e Kholo: Boholo ba wafer ba lisenthimithara tse 6 ho isa ho tse 8 bo netefatsa kopanyo e se nang sekoli le mela e seng e ntse e le teng ea tlhahiso ea semiconductor (mohlala, lits'ebetso tsa CMOS), ho fokotsa litšenyehelo tsa tlhahiso le ho nolofalletsa tlhahiso ea bongata.
2. Boleng bo Phahameng ba Crystalline: Mekhoa e ntlafalitsoeng ea epitaxial kapa ea ho kopanya e netefatsa hore ho na le sekoli se tlase filiming e tšesaane ea LN, e leng se etsang hore e be ntle bakeng sa li-modulator tsa optical tse sebetsang hantle, li-filter tsa surface acoustic wave (SAW), le lisebelisoa tse ling tse nepahetseng.
3. Botenya bo Lokisoang (0.3–50 μm): Mealo e mesesaane ea LN (<1 μm) e loketse li-chip tse kopantsoeng tsa photonic, ha mealo e metenya (10–50 μm) e tšehetsa lisebelisoa tsa RF tse matla haholo kapa li-sensor tsa piezoelectric.
4. Dikgetho tse ngata tsa Substrate: Ntle le Si, SiC (mocheso o phahameng wa ho tsamaisa mocheso) kapa safire (ho thibela mocheso o phahameng) di ka kgethwa e le thepa ya motheo ho fihlela ditlhoko tsa ditshebediso tse nang le maqhubu a phahameng, mocheso o phahameng, kapa matla a phahameng.
5. Ho Tsitsisa mocheso le mechine: Karoloana ea silicon e fana ka tšehetso e matla ea mechine, e fokotsa ho sotha kapa ho petsoha nakong ea ts'ebetso le ho ntlafatsa chai ea sesebelisoa.
Litšobotsi tsena li beha substrate ea LN-on-Si e kopaneng ea lisenthimithara tse 6 ho isa ho tse 8 e le thepa e ratoang bakeng sa mahlale a morao-rao a kang puisano ea 5G, LiDAR, le quantum optics.
Likopo tse ka Sehloohong
Karolo e kopaneng ea LN-on-Si ea lisenthimithara tse 6 ho isa ho tse 8 e amoheloa haholo liindastering tsa theknoloji e phahameng ka lebaka la thepa ea eona e ikhethang ea electro-optic, piezoelectric, le acoustic:
1. Puisano ea Optical le Photonics e Kopantsoeng: E nolofalletsa li-modulator tsa electro-optic tse lebelo le phahameng, li-waveguides, le lipotoloho tse kopantsoeng tsa photonic (li-PIC), tse sebetsanang le litlhoko tsa bandwidth tsa litsi tsa data le marangrang a fiber-optic.
Lisebelisoa tsa RF tsa 2.5G/6G: Palo e phahameng ea LN e etsang hore e be ntle bakeng sa li-filter tsa maqhubu a molumo a holimo (SAW) le maqhubu a molumo a mangata (BAW), e leng se ntlafatsang ts'ebetso ea matšoao liteisheneng tsa motheo tsa 5G le lisebelisoa tsa mohala.
3.MEMS le Disensor: Tshusumetso ya piezoelectric ya LN-on-Si e nolofatsa di-accelerometer tse nang le kutlwisiso e phahameng, di-biosensor, le di-transducer tsa ultrasonic bakeng sa ditshebediso tsa bongaka le tsa indasteri.
4. Litheknoloji tsa Quantum: Jwalo ka thepa ya optical e seng mola, difilimi tse tshesane tsa LN di sebediswa mehloding ya mabone a quantum (mohlala, dipara tsa photon tse kopantsweng) le di-chip tse kopaneng tsa quantum.
5. Li-Laser le Li-Optic tse sa Tšoaneng: Mealo e menyenyane ea LN e nolofalletsa lisebelisoa tse sebetsang hantle tsa tlhahiso ea bobeli ea harmonic (SHG) le optical parametric oscillation (OPO) bakeng sa ts'ebetso ea laser le tlhahlobo ea spectroscopic.
Karolo e tloaelehileng ea LN-on-Si e kopaneng ea lisenthimithara tse 6 ho isa ho tse 8 e lumella lisebelisoa tsena ho etsoa ka li-wafer fab tse kholo, e leng se fokotsang litšenyehelo tsa tlhahiso haholo.
Ho iketsetsa le Litšebeletso
Re fana ka tšehetso e felletseng ea tekheniki le lits'ebeletso tsa ho iketsetsa bakeng sa substrate ea LN-on-Si ea lisenthimithara tse 6 ho isa ho tse 8 ho fihlela litlhoko tse fapaneng tsa R&D le tlhahiso:
1. Tlhahiso e Ikhethileng: Botenya ba filimi ea LN (0.3–50 μm), tataiso ea kristale (X-cut/Y-cut), le thepa ea substrate (Si/SiC/safire) li ka etsoa ho ntlafatsa ts'ebetso ea sesebelisoa.
2.Ts'ebetso ea Boemo ba Wafer: Phepelo e kholo ea li-wafer tsa lisenthimithara tse 6 le lisenthimithara tse 8, ho kenyeletsoa le lits'ebeletso tsa morao tse kang ho seha, ho polisha le ho koahela, ho netefatsa hore li-substrate li se li loketse ho kopanngoa le lisebelisoa.
3. Boeletsi le Teko ea Botekgeniki: Tlhaloso ea thepa (mohlala, XRD, AFM), teko ea ts'ebetso ea electro-optic, le tšehetso ea ketsiso ea sesebelisoa ho potlakisa netefatso ea moralo.
Sepheo sa rona ke ho theha substrate e kopaneng ea LN-on-Si ea lisenthimithara tse 6 ho isa ho tse 8 e le tharollo ea mantlha ea thepa bakeng sa lits'ebetso tsa optoelectronic le semiconductor, e fanang ka tšehetso ea ho tloha qalong ho isa qetellong ho tloha ho R&D ho isa tlhahisong ea bongata.
Qetello
Substrate e kopaneng ea LN-on-Si ea lisenthimithara tse 6 ho isa ho tse 8, e nang le boholo ba eona bo boholo ba wafer, boleng bo phahameng ba thepa, le ho tenyetseha ha eona, e khanna tsoelo-pele puisanong ea optical, 5G RF, le theknoloji ea quantum. Ebang ke bakeng sa tlhahiso ea bongata bo phahameng kapa litharollo tse ikhethileng, re fana ka substrate tse tšepahalang le lits'ebeletso tse tlatsetsang ho matlafatsa boqapi ba theknoloji.










