Diamond Wire Cutting Machine bakeng sa SiC | Safira | Quartz | Khalase

Tlhaloso e Khutšoanyane:

Diamond Wire Single-Line Cutting System ke tharollo e tsoetseng pele e etselitsoeng ho seha li-substrate tse thata haholo le tse brittle. Ho sebelisa terata e koahetsoeng ke daemane e le mokhoa oa ho seha, thepa e fana ka lebelo le phahameng, tšenyo e fokolang, le ts'ebetso e baballang chelete e ngata. E loketse lits'ebetso tse joalo ka liphaephe tsa safire, li-boules tsa SiC, lipoleiti tsa quartz, lirafshoa, likhalase tsa optical, lithupa tsa silicon le mahakoe.

Re romelle lengolo-tsoibila

Likaroloana

Setšoantšo se qaqileng sa Diamond Wire Cutting Machine

Kakaretso ea Mochini oa ho Seha oa Diamond Wire

Ha ho bapisoa le li-blade tsa khale tsa sakha kapa lithapo tsa abrasive, theknoloji ena e fana ka ho nepahala ha maemo a holimo, tahlehelo e tlase ea kerf, le ho ntlafala ha holimo. E sebelisoa haholo ho pholletsa le li-semiconductors, photovoltaics, lisebelisoa tsa LED, optics, le ho sebetsa ka mokhoa o nepahetseng oa majoe, 'me ha e tšehetse feela ho seha ka mokhoa o otlolohileng empa hape le ho khaola ka mokhoa o khethehileng oa thepa e bōpehileng ka ho fetisisa kapa e sa tloaelehang.

diamond_wire_single_line_cutting_machine_for_sic_sapphire_quartz_ceramic_material

Molao-motheo oa Ts'ebetso

Mochini o sebetsa ka ho khanna aterata ea daemane ka lebelo le phahameng haholo (ho fihla ho 1500 m/min). Likaroloana tsa abrasive tse kentsoeng ka terata li tlosa lintho tse bonahalang ka ho sila ha micro, ha litsamaiso tse thusang li netefatsa ho ts'epahala le ho nepahala:

Precision Feeding:Motsamao o tsamaisoang ke servo o nang le mehala e tataisang li-linear o fihlela seha se tsitsitseng le boemo ba boemo ba micron.
Ho Pholisa le ho Hloekisa:Ho phalla ha metsi ho sa khaotseng ho fokotsa tšusumetso ea mocheso, ho thibela li-micro-cracks, le ho tlosa litšila ka katleho.
Taolo ea Tension ea Wire:Tokiso e iketsang e boloka matla a sa khaotseng holim'a terata (± 0.5 N), e fokotsa ho kheloha le ho robeha.
Mekhoa ea boikhethelo:Mekhahlelo ea ho potoloha bakeng sa li-angled kapa cylindrical workpieces, litsamaiso tse phahameng tsa tsitsipano bakeng sa lisebelisoa tse thata, le ho lokisoa ha pono bakeng sa lijeometri tse rarahaneng.

Litlhaloso tsa Tekheniki

Ntho	Paramethara	Ntho	Paramethara
Boholo ba Mosebetsi	600×500 limilimithara	Lebelo la ho Matha	1500 m/min
Swing Angle	0~±12.5°	Ho potlakisa	5 m/s²
Khafetsa ea Swing	6-30	Ho poma Lebelo	<3 hrs (6-inch SiC)
Phahamisa Stroke	650 limilimithara	Ho nepahala	<3 μm (6-inch SiC)
Sliding Stroke	≤500 limilimithara	Wire Diameter	φ0.12 ~ φ0.45 limilimithara
Phahamisa Lebelo	0~9.99 limilimithara/mots	Tšebeliso ea Matla	44.4 kW
Lebelo le Potlakileng la Maeto	200 mm/min	Boholo ba Mochini	2680×1500×2150 limilimithara
Khatello e sa khaotseng	15.0N~130.0N	Boima ba 'mele	3600 lik'hilograma
Ho Nepaha ha Tension	±0.5 N	Lerata	≤75 dB(A)
Bohole ba Bohareng ba Mabili a Tataiso	680-825 limilimithara	Phepelo ea Khase	> 0.5 MPa
Tanka e Phodileng	30 L	Mohala oa Motlakase	4×16+1×10 limilimithara tse ²
Mortar Motor	0.2 kW	-	-

Melemo ea Bohlokoa

Katleho e Phahameng & Kerf e Fokotsoeng

Mohala o lebelo ho fihla ho 1500 m/min bakeng sa ho feta ka potlako.

Narrow kerf bophara e theola tahlehelo ea thepa ka 30%, e eketsa chai.

Flexible & User-Friendly

HMI ea "touchscreen" e nang le risepe ea polokelo.

E ts'ehetsa ts'ebetso e otlolohileng, ea curve, le ea li-multi-slice synchronous.

Mesebetsi e Atolositsoeng

Mokhahlelo oa rotary bakeng sa likhahla tsa bevel le selikalikoe.

Li-module tsa tsitsipano e phahameng bakeng sa SiC e tsitsitseng le ho itšeha ka safire.

Lisebelisoa tsa Optical alignment bakeng sa likarolo tse sa tloaelehang.

Moralo o tšoarellang oa Mechini

Foreimi e boima e hanyetsanang le ho thothomela mme e netefatsa ho nepahala ha nako e telele.

Likarolo tsa bohlokoa tsa ho roala li sebelisa liphahlo tsa ceramic kapa tungsten carbide bakeng sa> lihora tse 5000 tsa bophelo ba ts'ebeletso.

Mochini oa Diamond Wire Setting bakeng sa SiC Sapphire Quartz Glass 3

Liindasteri tsa Kopo

Li-semiconductors:SiC ingot slicing e sebetsang hantle ka tahlehelo ea kerf <100 μm.

LED & Optics:Ho sebetsa ka mokhoa o nepahetseng haholo oa sapphire wafer bakeng sa lifoto le lisebelisoa tsa elektroniki.

Indasteri ea letsatsi:Ho lema lithupa tsa silicon le ho seha liphaephe bakeng sa lisele tsa PV.

Optical & jewelry:Seha se setle sa quartz le mahakoe a nang le Ra <0.5 μm qetellong.

Aerospace & Ceramics:Ho sebetsa AlN, zirconia, le li-ceramics tse tsoetseng pele bakeng sa lits'ebetso tsa mocheso o phahameng.

Mochini o Sehang oa Diamond Wire bakeng sa SiC Sapphire Quartz Glass 4

FAQ ea Likhalase tsa Quartz

Q1: Ke lisebelisoa life tseo mochini o ka li khaolang?
A1:E etselitsoe SiC, safire, quartz, silicon, ceramics, optical glass le mahakoe.

Q2: Mokhoa oa ho itšeha o nepahetse hakae?
A2:Bakeng sa li-wafers tsa SiC tse 6-inch, ho nepahala ha botenya ho ka fihla <3 μm, ka boleng bo holimo ba boleng bo holimo.

Q3: Ke hobane'ng ha seha sa terata ea daemane se phahametse mekhoa ea setso?
A3:E fana ka lebelo le potlakileng, tahlehelo e fokotsehileng ea kerf, tšenyo e nyane ea mocheso, le likarolo tse boreleli ha li bapisoa le lithapo tse hlabang kapa laser cut.

Q4: Na e ka sebetsana le libopeho tsa cylindrical kapa tse sa tloaelehang?
A4:Ee. Ka mokhahlelo oa boikhethelo oa rotary, e ka etsa selikalikoe, bevel, le angled slicing holim'a melamu kapa liprofaele tse khethehileng.

Q5: Khohlano ea terata e laoloa joang?
A5:Sistimi e sebelisa phetoho ea tsitsipano e koetsoeng ka boiketsetso e nang le ± 0.5 N ho nepahala ho thibela ho robeha ha terata le ho netefatsa ho itšeha ho tsitsitseng.

Q6: Ke liindasteri life tse sebelisang theknoloji ee haholo?
A6:Ho etsa semiconductor, matla a letsatsi, LED & photonics, lisebelisoa tsa optical component, mabenyane, le lirafshoa tsa aerospace.

Mabapi le rona

XKH e sebetsa ka ho khetheha ho nts'etsopele ea theknoloji e phahameng, tlhahiso, le thekiso ea likhalase tse khethehileng tsa optical le lisebelisoa tse ncha tsa kristale. Lihlahisoa tsa rona li fana ka lisebelisoa tsa elektroniki tsa optical, lisebelisoa tsa elektroniki tsa bareki le sesole. Re fana ka lisebelisoa tsa mahlo tsa Sapphire, likoahelo tsa lense tsa mohala oa thekeng, Ceramics, LT, Silicon Carbide SIC, Quartz, le liphaphatha tsa kristale tsa semiconductor. Ka boitseanape bo nang le boiphihlelo le lisebelisoa tse tsoetseng pele, re ipabola ts'ebetsong ea lihlahisoa tse sa tloaelehang, ka sepheo sa ho ba khoebo e etelletseng pele ea theknoloji e phahameng ea optoelectronic.