6 Inch / 8 Inch POD / FOSB Fiber Optic Splice Box Delivery Box Storage Box RSP Remote Service Platform RSP Remote Opening FOUP Front Unified Pod

Tlhaloso e Khutšoanyane:

TheFOSB (Lebokose la Thomello la ho Bula ka Pele)ke setshelo se entsweng ka nepo, se bulang ka pele se etseditsweng ka ho kgetheha ho tsamaisa le ho boloka di-wafer tsa semiconductor tsa 300mm ka polokeho. Se bapala karolo ya bohlokwa ho sireletseng di-wafer nakong ya phetiso ya di-inter-fab le ho romela dibakeng tse telele ha ka nako e le nngwe se netefatsa hore maemo a hodimo a bohloeki le botsitso ba mechini di a bolokwa.

Romella imeile ho rona

Likaroloana

Setšoantšo se qaqileng

Kakaretso ea FOSB

E entsoe ka thepa e hloekileng haholo, e sa fetoheng 'me e entsoe ho latela maemo a SEMI, FOSB e fana ka tšireletso e ikhethang khahlanong le tšilafalo ea likaroloana, ho ntšoa ha lintho ka mokhoa o sa fetoheng le ho tšoha 'meleng. E sebelisoa haholo ho pholletsa le tlhahiso ea semiconductor ea lefats'e, thepa ea thepa, le likamano tsa OEM/OSAT, haholo-holo mefuteng ea tlhahiso e iketsang ea 300mm wafer fabs.

Sebopeho le Lisebelisoa tsa FOSB

Lebokose le tloaelehileng la FOSB le entsoe ka likarolo tse 'maloa tse nepahetseng, kaofela li etselitsoe ho sebetsa hantle ka boiketsetso ba fektheri le ho netefatsa polokeho ea wafer:

'Mele o ka Sehloohong: E bōpiloe ka polasetiki ea boenjiniere e hloekileng haholo joalo ka PC (polycarbonate) kapa PEEK, e fanang ka matla a phahameng a mechini, tlhahiso e tlase ea likaroloana, le ho hanyetsa lik'hemik'hale.
Monyako o Buloang ka Pele: E etselitsoe ho tsamaisana ka botlalo le othomathiki; e na le digasket tse tiileng tse tiisang phapanyetsano e fokolang ya moya nakong ya dipalangwang.
Terei ea ka Hare ea Reticle/Wafer: E tšoara li-wafer tse fihlang ho tse 25 ka mokhoa o sireletsehileng. Terei ha e fetohe 'me e na le mosamo ho thibela li-wafer ho sisinyeha, ho qhetsoha ka mathoko, kapa ho ngoapa.
Mokhoa oa Latch: Sistimi ea ho notlela ka polokeho e etsa bonnete ba hore lemati le lula le koetsoe nakong ea lipalangoang le tsamaiso.
Likarolo tsa ho Latela Moralo: Mefuta e mengata e kenyelletsa li-tag tsa RFID tse kentsoeng, li-barcode, kapa likhoutu tsa QR bakeng sa kopanyo e felletseng ea MES le ho latela ho pholletsa le ketane ea thepa.
Taolo ea ESD: Thepa ena ha e fetohe ka mokhoa o sa fetoheng, hangata e na le ho hanyetsa bokaholimo pakeng tsa 10⁶ le 10⁹ ohms, e thusang ho sireletsa li-wafer ho tsoa ha motlakase o sa fetoheng.

Likarolo tsena li etsoa libakeng tsa kamore e hloekileng 'me li fihlela kapa li feta maemo a machaba a SEMI joalo ka E10, E47, E62, le E83.

Melemo ea Bohlokoa

● Tšireletso ea Wafer ea Boemo bo Holimo

Li-FOSB li hahiloe ho sireletsa li-wafer tšenyo ea 'mele le litšila tsa tikoloho:

Sistimi e koetsoeng ka botlalo, e koetsoeng ka mokhoa o sa keneleng moea e thibela mongobo, mosi oa lik'hemik'hale le likaroloana tse fofang moeeng.
Karolo e ka hare e thibelang ho thothomela e fokotsa kotsi ea ho phatloha ha mechine kapa ho petsoha ha mapetso a manyenyane.
Khetla e tiileng ea kantle e mamella litšitiso tsa ho theoha le khatello ea ho bokellana nakong ea thepa.

● Ho lumellana ka botlalo ha othomathike

Li-FOSB li entsoe bakeng sa tšebeliso ho AMHS (Mekhoa ea ho Tšoara Lintho ka Boiketsetso):

E lumellana le matsoho a roboto a lumellanang le SEMI, likou tsa mojaro, li-stocker le li-openers.
Mokgwa wa ho bula ka pele o tsamaellana le ditsamaiso tse tlwaelehileng tsa FOUP le tsa kou ya mojaro bakeng sa othomathiki ya fektheri e se nang moedi.

● Moralo o Loketseng ho Hloekisa

E entsoe ka thepa e hloekileng haholo, e sa ntšeng khase haholo.
Ho bonolo ho e hlwekisa le ho e sebedisa hape; e loketse dibaka tsa bohloeki tsa Sehlopha sa 1 kapa ho feta.
Ha e na li-ion tse boima tsa tšepe, e netefatsa hore ha ho na tšilafalo nakong ea phetisetso ea wafer.

● Ho Latela ka Bohlale le Kopanyo ea MES

Mekhoa ea khetho ea RFID/NFC/barcode e lumella ho sala morao ka botlalo ho tloha ho fab ho ea ho fab.
FOSB ka 'ngoe e ka khetholloa ka mokhoa o ikhethang le ho lateloa ka har'a sistimi ea MES kapa WMS.
E tšehetsa ponaletso ea ts'ebetso, tlhahlobo ea sehlopha, le taolo ea thepa.

Lebokose la FOSB - Tafole ea Litlhaloso tse Kopantsoeng

Sehlopha	Ntho	Boleng
Lisebelisoa	Ikopanye le Wafer	Polycarbonate
Lisebelisoa	Khetla, Monyako, Mosamo oa Monyako	Polycarbonate
Lisebelisoa	Sekoahelo sa Ka morao	Polybutylene Terephthalate
Lisebelisoa	Mehele, Li-flange tse Iketsang, Li-pad tsa Tlhahisoleseling	Polycarbonate
Lisebelisoa	Gasket	Elastomer ea Thermoplastic
Lisebelisoa	Poleiti ea KC	Polycarbonate
Litlhaloso	Bokgoni	Li-wafer tse 25
Litlhaloso	Botebo	332.77 mm ±0.1 mm (13.10" ±0.005")
Litlhaloso	Bophara	389.52 mm ±0.1 mm (15.33" ±0.005")
Litlhaloso	Bolelele	336.93 mm ±0.1 mm (13.26" ±0.005")
Litlhaloso	Bolelele ba Lipakete tse 2	680 mm (26.77")
Litlhaloso	Bophara ba Lipakete tse 2	415 mm (16.34")
Litlhaloso	Bolelele ba Lipakete tse 2	365 mm (14.37")
Litlhaloso	Boima (Ha bo na letho)	4.6 kg (10.1 lb)
Litlhaloso	Boima (Bo Felletseng)	7.8 kg (17.2 lb)
Ho lumellana ha Wafer	Boholo ba Wafer	300 mm
Ho lumellana ha Wafer	Selallo sa lentsoe	10.0 mm (0.39")
Ho lumellana ha Wafer	Lifofane	± 0.5 mm (0.02") ho tloha ho lebitso la boswaswi

Maemo a Kopo

Li-FOSB ke lisebelisoa tsa bohlokoa bakeng sa thepa le polokelo ea li-wafer tsa 300mm. Li sebelisoa haholo maemong a latelang:

Liphetisetso tsa Fab-ho-Fab: Bakeng sa ho tsamaisa di-wafer pakeng tsa dibaka tse fapaneng tsa tlhahiso ya di-semiconductor.
Ho Romelloa ha Foundry: Ho tsamaisa di-wafer tse fedisitsweng ho tloha ho tse ntle ho ya ho moreki kapa setsing sa ho paka.
Lisebelisoa tsa OEM/OSAT: Mekhoeng ea ho paka le ho etsa liteko e tsoang kantle.
Polokelo le Polokelo ea Mokha oa Boraro: Boloka di-wafer tsa bohlokwa nako e telele kapa ya nakwana.
Liphetisetso tsa Wafer tsa ka Hare: Dikhamphaseng tse kgolo tse majabajaba moo di-module tsa tlhahiso tse hole di hokahantsweng ka AMHS kapa dipalangwang tsa letsoho.

Mesebetsing ea ketane ea phepelo ea lefats'e, li-FOSB li fetohile tekanyetso ea lipalangoang tsa wafer tsa boleng bo holimo, li netefatsa hore li tsamaisoa ntle le tšilafalo lik'honthinenteng tsohle.

FOSB khahlanong le FOUP – Phapang ke efe?

Tšobotsi	FOSB (Lebokose la Thomello la ho Bula ka Pele)	FOUP (Podo e Kopaneng e Buloang ka Pele)
Tšebeliso ea mantlha	Thomello ea li-wafer tse entsoeng ka masela a fapaneng le thepa ea thepa	Phetisetso ea wafer ka hare ho fab le ts'ebetso e iketsang
Sebopeho	Setshelo se tiileng, se koetsoeng se nang le tšireletso e eketsehileng	Pod e ka sebelisoang hape e ntlafalitsoe bakeng sa boiketsetso ba kahare
Ho se kene moea	Tshebetso e phahameng ea ho tiisa	E etselitsoe ho fihlella habonolo, ha ho kene moea o mongata haholo
Khafetsa ea Tšebeliso	Bohareng (bo shebane le lipalangoang tse sireletsehileng tsa maeto a malelele)	Maqhubu a phahameng meleng ea tlhahiso e iketsang
Bokhoni ba Wafer	Hangata li-wafer tse 25 ka lebokose	Hangata li-wafer tse 25 ka pod
Tšehetso ea Boiketsetso	E lumellana le li-openers tsa FOSB	E kopantsoe le likou tsa mojaro tsa FOUP
Ho latela melao	SEMI E47, E62	SEMI E47, E62, E84, le tse ling

Leha ka bobedi di phetha karolo ya bohlokwa ho tsa thepa ya wafer, di-FOSB di hahilwe ka sepheo sa ho romela thepa ka matla pakeng tsa di-fab kapa ho bareki ba kantle, athe di-FOUP di shebane haholo le bokgoni ba tlhahiso bo iketsahallang.

Lipotso Tse Botsoang Khafetsa (Lipotso Tse Botsoang Khafetsa)

P1: Na di-FOSB di ka sebediswa hape?
E. Li-FOSB tsa boleng bo holimo li etselitsoe ho sebelisoa khafetsa 'me li ka mamella linako tse ngata tsa ho hloekisa le ho sebetsana le tsona haeba li hlokomeloa hantle. Ho khothaletsoa ho hloekisa kamehla ka lisebelisoa tse nang le setifikeiti.

P2: Na di-FOSB di ka etsetswa ho iketsetsa lebitso la kgwebo kapa ho latela?
Ehlile. Li-FOSB li ka fetoloa ka matšoao a bareki, li-tag tse itseng tsa RFID, ho tiisa mongobo, esita le ho ngola mebala e fapaneng bakeng sa taolo e bonolo ea thepa.

P3: Na di-FOSB di loketse dibaka tsa ho hlwekisa?
E. Li-FOSB li etsoa ka polasetiki ea boleng bo hloekileng 'me li koetsoe ho thibela ho hlahisoa ha likaroloana. Li loketse libaka tsa kamore e hloekileng tsa Sehlopha sa 1 ho isa ho Sehlopha sa 1000 le libaka tsa bohlokoa tsa semiconductor.

P4: Li-FOSB li buloa joang nakong ea boiketsetso?
Li-FOSB lia lumellana le li-openers tse khethehileng tsa FOSB tse tlosang lemati le ka pele ntle le ho ama ka letsoho, li boloka botsitso ba maemo a kamore e hloekileng.

Mabapi le rona

XKH e ikhethile ka nts'etsopele ea theknoloji e phahameng, tlhahiso le thekiso ea khalase e khethehileng ea mahlo le thepa e ncha ea kristale. Lihlahisoa tsa rona li sebeletsa lisebelisoa tsa elektroniki tsa mahlo, lisebelisoa tsa elektroniki tsa bareki le sesole. Re fana ka likarolo tsa mahlo tsa Sapphire, likoahelo tsa lense ea mohala oa thekeng, Ceramics, LT, Silicon Carbide SIC, Quartz, le li-wafer tsa kristale tsa semiconductor. Ka boiphihlelo bo nang le boiphihlelo le lisebelisoa tsa sejoale-joale, re ipabola ts'ebetsong ea lihlahisoa tse seng tsa maemo a holimo, re ikemiselitse ho ba khoebo e etellang pele ea theknoloji e phahameng ea lisebelisoa tsa optoelectronic.