HPSI SiCOI wafer 4 6inch Hydropholic Bonding

Setšoantšo se Hlahisitsoeng sa HPSI SiCOI wafer ea 4 6inch Hydropholic Bonding

Tlhaloso e Khutšoanyane:

Li-wafer tsa 4H-SiCOI tse nang le semi-insulating e phahameng (HPSI) li hlahisoa ka ho sebelisa mahlale a tsoetseng pele a ho kopanya le ho fokotsa. Li-wafer li etsoa ka li-substrate tsa 4H HPSI silicon carbide tse kopanyang holim'a likarolo tsa thermal oxide ka mekhoa e 'meli ea bohlokoa: ho kopanya ka hydrophilic (ka ho toba) le ho kopanya ka holim'a metsi. Ea morao e hlahisa lera le fetotsoeng lipakeng (joalo ka silicon e sa fetoheng, aluminium oxide, kapa titanium oxide) ho ntlafatsa boleng ba lera le ho fokotsa li-bubble, haholo-holo tse loketseng lits'ebetso tsa optical. Taolo ea botenya ba lera la silicon carbide e finyelloa ka SmartCut e thehiloeng ho ion implantation kapa lits'ebetso tsa ho sila le ho polishing tsa CMP. SmartCut e fana ka ho tšoana ho hoholo ha botenya (50nm–900nm ka ho tšoana ha ±20nm) empa e ka baka tšenyo e nyane ea kristale ka lebaka la ho kenngoa ha ion, e amang ts'ebetso ea sesebelisoa sa optical. Ho sila le ho polishing ea CMP ho qoba tšenyo ea thepa 'me li khethoa bakeng sa lifilimi tse teteaneng (350nm–500µm) le lits'ebetso tsa quantum kapa PIC, leha li na le ho tšoana ho fokolang ha botenya (±100nm). Li-wafer tse tloaelehileng tsa lisenthimithara tse 6 li na le lera la SiC la 1µm ±0.1µm holim'a lera la SiO2 la 3µm holim'a li-substrate tsa Si tsa 675µm tse nang le boreledi bo ikhethang ba bokaholimo (Rq < 0.2nm). Li-wafer tsena tsa HPSI SiCOI li sebeletsa tlhahiso ea MEMS, PIC, quantum, le lisebelisoa tsa optical ka boleng bo botle ba thepa le ho tenyetseha ha ts'ebetso.

Romella imeile ho rona

Likaroloana

Kakaretso ea Thepa ea SiCOI Wafer (Silicon Carbide-on-Insulator)

Li-wafer tsa SiCOI ke substrate ea moloko o mocha oa semiconductor e kopanyang Silicon Carbide (SiC) le lera le thibelang mocheso, hangata SiO₂ kapa safire, ho ntlafatsa ts'ebetso ea lisebelisoa tsa motlakase tsa elektroniki, RF le photonics. Ka tlase ke kakaretso e qaqileng ea thepa ea tsona e arotsoeng ka likarolo tsa bohlokoa:

Thepa	Tlhaloso
Sebopeho sa Thepa	Lera la Silicon Carbide (SiC) le hokahaneng holim'a substrate e sireletsang mocheso (hangata SiO₂ kapa safire)
Sebopeho sa kristale	Hangata li-polytype tsa SiC tsa 4H kapa 6H, tse tsejoang ka boleng bo phahameng ba kristale le ho tšoana.
Matlo a Motlakase	Tšimo ea motlakase e nang le tšenyo e kholo (~3 MV/cm), lekhalo le pharaletseng (~3.26 eV bakeng sa 4H-SiC), phallo e tlase ea ho lutla
Ho khanna ha mocheso	Ho tsamaisa mocheso ka potlako (~300 W/m·K), ho nolofalletsa ho qhala mocheso ka katleho
Lera la Dielectric	Lera la ho thibela ho ruruha (SiO₂ kapa safire) le fana ka karohano ea motlakase mme le fokotsa bokhoni ba likokoana-hloko
Matlotlo a Mekaniki	Ho thatafala ho hoholo (sekala sa ~ 9 Mohs), matla a babatsehang a mechini, le botsitso ba mocheso
Qetello ea Bokaholimo	Hangata e boreleli haholo ebile e na le sekoli se tlase, e loketse tlhahiso ea sesebelisoa
Likopo	Lisebelisoa tsa motlakase, lisebelisoa tsa MEMS, lisebelisoa tsa RF, li-sensor tse hlokang mamello ea mocheso o phahameng le motlakase

Li-wafer tsa SiCOI (Silicon Carbide-on-Insulator) li emela sebopeho se tsoetseng pele sa substrate ea semiconductor, se nang le lera le lesesaane la boleng bo holimo la silicon carbide (SiC) le hokahaneng le lera le thibelang mocheso, hangata silicon dioxide (SiO₂) kapa safire. Silicon carbide ke semiconductor se nang le lekhalo le leholo se tsejoang ka bokhoni ba sona ba ho mamella motlakase o phahameng le mocheso o phahameng, hammoho le ho tsamaisa mocheso hantle le ho thatafala ha mechini ho phahameng, ho etsa hore e be e loketseng lits'ebetso tsa elektroniki tse nang le matla a phahameng, maqhubu a phahameng le mocheso o phahameng.

Lera le sireletsang mocheso ka har'a li-wafer tsa SiCOI le fana ka karohano e sebetsang ea motlakase, e fokotsang haholo bokhoni ba likokoana-hloko le maqhubu a ho lutla pakeng tsa lisebelisoa, ka hona e ntlafatsa ts'ebetso ea sesebelisoa ka kakaretso le ts'epo. Bokaholimo ba li-wafer bo bentšitsoe hantle ho fihlela boreleli bo phahameng ka ho fetisisa bo nang le liphoso tse fokolang, bo fihlela litlhoko tse thata tsa tlhahiso ea lisebelisoa tse nyane le tse nyane.

Sebopeho sena sa thepa ha se ntlafatse feela litšobotsi tsa motlakase tsa lisebelisoa tsa SiC empa hape se ntlafatsa haholo tsamaiso ea mocheso le botsitso ba mechini. Ka lebaka leo, li-wafer tsa SiCOI li sebelisoa haholo li-elektroniki tsa motlakase, likarolo tsa maqhubu a seea-le-moea (RF), li-sensor tsa litsamaiso tsa microelectromechanical (MEMS), le li-elektroniki tsa mocheso o phahameng. Ka kakaretso, li-wafer tsa SiCOI li kopanya thepa e ikhethang ea 'mele ea silicon carbide le melemo ea ho itšehla thajana ea lera la insulator, e leng se fanang ka motheo o motle bakeng sa moloko o latelang oa lisebelisoa tsa semiconductor tse sebetsang hantle.

Tšebeliso ea wafer ea SiCOI

Lisebelisoa tsa Elektroniki tsa Matla

Li-switch tse nang le motlakase o phahameng le tse nang le matla a phahameng, li-MOSFET le li-diode

Rua molemo ho tsoa sekheong se seholo sa SiC, motlakase o phahameng oa ho senyeha, le botsitso ba mocheso

Ho fokotseha ha tahlehelo ea motlakase le katleho e ntlafetseng lits'ebetsong tsa phetoho ea motlakase

Likarolo tsa Maqhubu a Radio (RF)

Li-transistors le li-amplifier tse nang le maqhubu a phahameng

Bokgoni bo tlase ba likokoana-hloko ka lebaka la lera la ho thibela mocheso bo ntlafatsa ts'ebetso ea RF

E loketse litsamaiso tsa puisano tsa 5G le radar

Mekhoa ea Microelectromechanical (MEMS)

Li-sensor le li-actuator tse sebetsang libakeng tse thata

Ho tiea ha mechine le ho se sebetse ha lik'hemik'hale ho eketsa nako ea bophelo ba sesebelisoa

E kenyelletsa li-sensor tsa khatello, li-accelerometer le li-gyroscope

Lisebelisoa tsa Elektroniki tsa Mocheso o Phahameng

Lisebelisoa tsa elektroniki bakeng sa likoloi, lifofane le lits'ebetso tsa indasteri

Sebetsa ka botšepehi mochesong o phahameng moo silicon e sa sebetseng hantle

Lisebelisoa tsa Photonic

Ho kopanngoa le likarolo tsa optoelectronic holim'a li-substrate tsa insulator

E nolofalletsa li-photonics tse ho-chip ka taolo e ntlafalitsoeng ea mocheso

Lipotso le Likarabo tsa SiCOI wafer

P:Sejana sa SiCOI ke eng

A:Wafer ea SiCOI e emetse wafer ea Silicon Carbide-on-Insulator. Ke mofuta oa substrate ea semiconductor moo lera le lesesaane la silicon carbide (SiC) le hokahanngoang holim'a lera le thibelang mocheso, hangata silicon dioxide (SiO₂) kapa ka linako tse ling safire. Sebopeho sena se tšoana ka mohopolo le li-wafer tse tsebahalang tsa Silicon-on-Insulator (SOI) empa li sebelisa SiC ho fapana le silicon.