Tafole ea likateng
1. Bottleneck ea ho Hlakola ha Mocheso ho Li-chips tsa AI le Katleho ea Lisebelisoa tsa Silicon Carbide
2. Litšobotsi le Melemo ea Tekheniki ea Li-substrate tsa Silicon Carbide
3. Merero ea Maano le Nts'etsopele ea Tšebelisano-'moho ke NVIDIA le TSMC
4.Tsela ea ho Kena Ts'ebetsong le Liphephetso tsa Bohlokoa tsa Tekheniki
5.Menyetla ea 'Maraka le Katoloso ea Bokhoni
6. Tšusumetso ho Ketane ea Phepelo le Ts'ebetso ea Likhamphani tse Amanang
7.Likopo tse pharaletseng le boholo ba 'maraka ka kakaretso ba Silicon Carbide
8.Litharollo tse Ikhethileng tsa XKH le Tšehetso ea Lihlahisoa
Bothata ba ho qhala mocheso ba di-chip tsa AI tsa nakong e tlang bo ntse bo hlōloa ke thepa ea substrate ea silicon carbide (SiC).
Ho ya ka ditlaleho tsa mecha ya ditaba ya kantle ho naha, NVIDIA e rera ho nkela thepa ya substrate e mahareng sebaka tsamaisong e tswetseng pele ya CoWoS ya diprosesa tsa yona tsa moloko o latelang sebaka ka silicon carbide. TSMC e memile bahlahisi ba baholo ho ntshetsa pele mahlale a tlhahiso bakeng sa di-substrate tse mahareng tsa SiC mmoho.
Lebaka le ka sehloohong ke hore ntlafatso ea ts'ebetso ea li-chip tsa AI tsa hajoale e bile le mefokolo ea 'mele. Ha matla a GPU a ntse a eketseha, ho kopanya li-chip tse ngata ho li-interposer tsa silicon ho hlahisa litlhoko tse phahameng haholo tsa ho qhala mocheso. Mocheso o hlahisoang ka har'a li-chip o ntse o atamela moeli oa oona, 'me li-interposer tsa silicon tsa setso li ke ke tsa sebetsana le phephetso ena ka katleho.
Lisebelisoa tsa NVIDIA li Fetola Lisebelisoa tsa ho Hlakola Mocheso! Tlhoko ea Silicon Carbide Substrate e Loketse ho Phatloha!Silicon carbide ke semiconductor e pharaletseng ea lekhalo, 'me thepa ea eona e ikhethang ea' mele e e fa melemo e meholo libakeng tse feteletseng tse nang le matla a phahameng le phallo e phahameng ea mocheso. Ka har'a sephutheloana se tsoetseng pele sa GPU, e fana ka melemo e 'meli ea mantlha:
1. Bokhoni ba ho Hasanya Mocheso: Ho nkela li-interposer tsa silicon sebaka ka li-interposer tsa SiC sebaka ho ka fokotsa khanyetso ea mocheso ka hoo e ka bang 70%.
2. Meralo e Sebetsang ka Matla: SiC e nolofalletsa ho thehwa ha di-module tse nyane tse sebetsang hantle, tse sebetsang hantle, tse kgutsufatsang ditsela tsa ho tsamaisa motlakase haholo, e fokotsa tahlehelo ya potoloho, mme e fana ka dikarabelo tse potlakileng le tse tsitsitseng tsa hona jwale bakeng sa meroalo ya dikhomphutha tsa AI.
Phetoho ena e ikemiseditse ho sebetsana le diphephetso tsa ho qhala ha mocheso tse bakwang ke ho eketsa matla a GPU ka ho tswela pele, ho fana ka tharollo e sebetsang hantle bakeng sa di-chip tsa khomphutha tse sebetsang hantle.
Ho tsamaisa mocheso ha silicon carbide ho phahame ka makhetlo a 2-3 ho feta ha silicon, e leng se ntlafatsang katleho ea tsamaiso ea mocheso le ho rarolla mathata a ho qhala mocheso ka har'a li-chip tse matla haholo. Tshebetso ea eona e ntle ea mocheso e ka fokotsa mocheso oa li-chip tsa GPU ka 20-30°C, e leng se eketsang botsitso haholo maemong a khomphutha e phahameng.
Tsela ea ho Kena Ts'ebetsong le Liphephetso
Ho ea ka mehloli ea ketane ea phepelo, NVIDIA e tla kenya tšebetsong phetoho ena ea thepa ka mehato e 'meli:
•2025-2026: Rubin GPU ea moloko oa pele e tla ntse e sebelisa li-interposer tsa silicon. TSMC e memile bahlahisi ba baholo ho nts'etsapele theknoloji ea tlhahiso ea li-interposer tsa SiC hammoho.
•2027: Li-interposer tsa SiC li tla kenyelletsoa ka molao ts'ebetsong e tsoetseng pele ea ho paka.
Leha ho le jwalo, morero ona o tobane le diphephetso tse ngata, haholo-holo ditshebetsong tsa tlhahiso. Bothata ba silicon carbide bo tshwana le ba daemane, bo hlokang theknoloji e phahameng haholo ya ho seha. Haeba theknoloji ya ho seha e sa lekana, bokahodimo ba SiC bo ka fetoha leqhubu, e leng se etsang hore bo se ke ba sebediswa bakeng sa diphutheloana tse tswetseng pele. Bahlahisi ba disebediswa tse kang DISCO ya Japane ba ntse ba sebetsa ho ntshetsa pele disebediswa tse ntjha tsa ho seha ka laser ho rarolla phephetso ena.
Litebello tsa nakong e tlang
Hona jwale, theknoloji ya SiC interposer e tla sebediswa pele ho di-chip tsa AI tse tswetseng pele ka ho fetisisa. TSMC e rera ho qala CoWoS ya 7x reticle ka 2027 ho kopanya di-processor le memori tse ngata, ho eketsa sebaka sa interposer ho 14,400 mm², e leng se tla kganna tlhokeho e kgolo ya di-substrate.
Morgan Stanley o bolela esale pele hore bokgoni ba ho paka ba kgwedi le kgwedi ba CoWoS lefatsheng ka bophara bo tla eketseha ho tloha ho di-wafer tse 38,000 tsa di-inch tse 12 ka 2024 ho ya ho tse 83,000 ka 2025 le tse 112,000 ka 2026. Kgolo ena e tla eketsa ka ho toba tlhokeho ya di-interposer tsa SiC.
Leha di-substrate tsa SiC tsa di-inch tse 12 di le theko e boima hajwale, ditheko di lebelletswe ho theohela maemong a utlwahalang ha tlhahiso ya bongata e ntse e eketseha mme theknoloji e ntse e hola, e leng se etsang hore ho be le maemo a tshebediso e kgolo.
Li-interposer tsa SiC ha li rarolle mathata a ho qhala mocheso feela empa hape li ntlafatsa haholo bongata ba kopanyo. Sebaka sa li-substrates tsa SiC tsa lisenthimithara tse 12 se batla se le seholo ka 90% ho feta sa li-substrates tsa lisenthimithara tse 8, e leng se lumellang interposer e le 'ngoe ho kopanya li-module tse ngata tsa Chiplet, tse tšehetsang ka kotloloho litlhoko tsa ho paka tsa NVIDIA tsa 7x reticle CoWoS.
TSMC e sebelisana le lik'hamphani tsa Majapane tse kang DISCO ho nts'etsapele theknoloji ea tlhahiso ea li-interposer tsa SiC. Hang ha lisebelisoa tse ncha li se li le teng, tlhahiso ea li-interposer tsa SiC e tla tsoela pele hantle haholoanyane, 'me ho lebelletsoe hore ho kenoe pele ho liphutheloana tse tsoetseng pele ka 2027.
Ka lebaka la litaba tsena, di-stock tse amanang le SiC di sebelitse hantle ka la 5 Loetse, mme index e nyolohile ka 5.76%. Dikhamphani tse kang Tianyue Advanced, Luxshare Precision, le Tiantong Co. di fihlile moeding wa letsatsi le letsatsi, ha Jingsheng Mechanical & Electrical le Yintang Intelligent Control di nyolohetse ho feta 10%.
Ho ya ka Daily Economic News, ho ntlafatsa tshebetso, NVIDIA e rera ho nkela sebaka sa thepa ya substrate e mahareng tshebetsong e tswetseng pele ya ho paka ya CoWoS ka silicon carbide morerong wa yona o latelang wa ntshetsopele ya processor ya Rubin.
Tlhahisoleseding ya setjhaba e bontsha hore carbide ya silicon e na le thepa e ntle haholo ya mmele. Ha e bapiswa le disebediswa tsa silicon, disebediswa tsa SiC di fana ka melemo e kang matla a mangata, tahlehelo e tlase ya matla, le botsitso bo ikgethang ba mocheso o phahameng. Ho ya ka Tianfeng Securities, ketane ya indasteri ya SiC e hodimo e kenyeletsa ho lokiswa ha di-substrate tsa SiC le di-wafer tsa epitaxial; karolo e bohareng e kenyeletsa moralo, tlhahiso, le ho paka/teko ya disebediswa tsa matla tsa SiC le disebediswa tsa RF.
Tlase ho moo, lits'ebetso tsa SiC li pharaletse, li akaretsa liindasteri tse fetang leshome, ho kenyeletsoa likoloi tse ncha tsa matla, li-photovoltaic, tlhahiso ea liindasteri, lipalangoang, liteishene tsa motheo tsa puisano le radar. Har'a tsena, likoloi e tla ba tšimo ea mantlha ea ts'ebeliso bakeng sa SiC. Ho ea ka Aijian Securities, ka 2028, lekala la likoloi le tla ikarabella bakeng sa 74% ea 'maraka oa lefats'e oa lisebelisoa tsa matla tsa SiC.
Mabapi le boholo ba mmaraka ka kakaretso, ho ya ka Yole Intelligence, boholo ba mmaraka wa lefatshe ka bophara wa SiC substrate o tsamaisang motlakase le o thibelang motlakase hanyane e ne e le dimilione tse 512 le dimilione tse 242, ka ho latellana, ka 2022. Ho hakanngwa hore ka 2026, boholo ba mmaraka wa SiC wa lefatshe bo tla fihla ho dimilione tse 2.053, ka boholo ba mmaraka wa SiC substrate o tsamaisang motlakase le o thibelang motlakase hanyane o fihlang ho dimilione tse 1.62 le $433 milione, ka ho latellana. Sekgahla sa kgolo ya selemo le selemo se kopaneng (CAGRs) bakeng sa substrate tsa SiC tse tsamaisang motlakase le tse thibelang motlakase hanyane ho tloha ka 2022 ho isa ho 2026 se lebelletswe ho ba 33.37% le 15.66%, ka ho latellana.
XKH e Ikhethile ka ho Fetisisa Nts'etsopele e Ikhethileng le Thekiso ea Lefatše ea Lihlahisoa tsa Silicon Carbide (SiC), e fanang ka mefuta e felletseng ea lisenthimithara tse 2 ho isa ho tse 12 bakeng sa li-substrate tsa carbide tsa silicon tse tsamaisang motlakase le tse thibelang mocheso ka halofo. Re tšehetsa ho iketsetsa liparamente tse kang kristale, resistivity (10⁻³–10¹⁰ Ω·cm), le botenya (350–2000μm). Lihlahisoa tsa rona li sebelisoa haholo masimong a maemo a holimo ho kenyeletsoa likoloi tse ncha tsa matla, li-inverter tsa photovoltaic, le lienjene tsa indasteri. Re sebelisa sistimi e matla ea phepelo le sehlopha sa tšehetso ea tekheniki, re netefatsa karabelo e potlakileng le phano e nepahetseng, re thusa bareki ho ntlafatsa ts'ebetso ea sesebelisoa le ho ntlafatsa litšenyehelo tsa sistimi.
Nako ea poso: Loetse-12-2025