Litaba
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Fetola Lisebelisoa tsa ho Fetola Mocheso! Tlhokahalo ea Silicon Carbide Substrate e Tla phatloha!
Lethathamo la Tse ka Hare 1. Heat Dissipation Bottleneck in AI Chips and the Breakthrough of Silicon Carbide Materials 2. Litšobotsi le Melemo ea Tekheniki ea Silicon Carbide Substrates, 3. Meralo ea Maano le Nts'etsopele ea Tšebelisano ka NVIDIA le TSMC 4. Mohato le Ts'ebetsongBala haholoanyane -
Katleho e kholo ho 12-Inch Silicon Carbide Wafer Laser Lift-Off Technology
Lethathamo la Tse ka Hare 1Bala haholoanyane -
Sehlooho: FOUP ke eng ho Chip Manufacturing?
Lethathamo la Tse ka Hare 1.Tlhahlobo le Mesebetsi ea Motheo ea FOUP 2.Sebopeho le Likarolo tsa Moralo tsa FOUP 3.Classification and Application Guidelines of FOUP4.Ts'ebetso le Bohlokoa ba FOUP in Semiconductor Manufacturing 5.Technical Challenges and Future Development TrendsX KH 6 Custo Development Trends.Bala haholoanyane -
Theknoloji ea ho Hloekisa Wafer ho Semiconductor Manufacturing
Theknoloji ea ho Hloekisa Wafer ho Semiconductor Manufacturing Wafer ke mohato oa bohlokoa ho pholletsa le ts'ebetso eohle ea tlhahiso ea semiconductor le e 'ngoe ea lintlha tsa bohlokoa tse amang ts'ebetso ea sesebelisoa ka kotloloho le tlhahiso ea tlhahiso. Nakong ea ho etsoa ha chip, esita le tšilafalo e nyane ...Bala haholoanyane -
Theknoloji ea ho Hloekisa Wafer le Litokomane tsa Tekheniki
Lethathamo la Tse ka HareBala haholoanyane -
Likristale tse sa Tsoa ho Hōlisoa tse Leng
Likristale tse le 'ngoe ha li fumanehe ka tlhaho, 'me le ha li etsahala, hangata li nyenyane haholo-hangata ka sekala sa millimeter (mm)' me ho thata ho li fumana. Litaemane tse tlalehiloeng, li-emerald, li-agate, joalo-joalo, ka kakaretso ha li kenelle ho potoloha 'marakeng, ho sa bue letho ka likopo tsa indasteri; bongata bo bontshwa...Bala haholoanyane -
Moreki e Moholo ka ho Fetisisa oa Alumina ea Phahameng ka ho Fetisisa: U Tseba Lintho Tse Kae Ka Sapphire?
Likristale tsa safire li lengoa ho tloha phofo ea alumina e hloekileng e nang le bohloeki ba> 99.995%, e leng se etsang hore e be sebaka se seholo ka ho fetisisa sa tlhokahalo ea alumina ea bohloeki bo phahameng. Li bonts'a matla a phahameng, boima bo phahameng, le thepa ea lik'hemik'hale e tsitsitseng, e ba nolofalletsang ho sebetsa libakeng tse thata joalo ka mocheso o phahameng ...Bala haholoanyane -
TTV, BOW, WARP, le TIR li Bolela'ng ho Wafers?
Ha re hlahloba li-wafers tsa silicon tsa semiconductor kapa li-substrates tse entsoeng ka lisebelisoa tse ling, hangata re kopana le matšoao a theknoloji a kang: TTV, BOW, WARP, mohlomong TIR, STIR, LTV, har'a tse ling. Lintho tsee li emela lintlha life? TTV — Total Thickness Variation BOW — Bow WARP — Warp TIR — ...Bala haholoanyane -
Lisebelisoa tsa bohlokoa tsa Raw bakeng sa Tlhahiso ea Semiconductor: Mefuta ea Li-Wafer Substrates
Li-Wafer Substrates e le Lisebelisoa tsa Bohlokoa ho Semiconductor Devices Wafer substrates ke bajari ba 'mele ba lisebelisoa tsa semiconductor, mme thepa ea bona ea thepa e supa ka kotloloho ts'ebetso ea sesebelisoa, litšenyehelo, le likarolo tsa ts'ebeliso. Ka tlase ke mefuta ea mantlha ea li-wafer substrates hammoho le advantag ea tsona ...Bala haholoanyane -
Thepa ea ho Slicing ea Laser e Phahameng ka ho Fetisisa bakeng sa Liphaephe tsa SiC tse 8-Inch: Theknoloji ea Motheo bakeng sa Ts'ebetso ea Bokamoso ea SiC Wafer
Silicon carbide (SiC) ha se feela theknoloji ea bohlokoa bakeng sa ts'ireletso ea naha empa hape ke thepa ea bohlokoa bakeng sa indasteri ea likoloi le matla a lefats'e. E le mohato oa pele oa bohlokoa ts'ebetsong ea kristale e le 'ngoe ea SiC, ho seha sephaephe ho supa ka kotloloho boleng ba ho sesa le ho belisoa. Tr...Bala haholoanyane -
Likhalase tsa AR tsa Optical-Grade Silicon Carbide Waveguide: Tokisetso ea High-Purity Semi-Insulating Substrates
Khahlanong le mokokotlo oa phetoho ea AI, likhalase tsa AR li ntse li kena butle-butle kelellong ea sechaba. Joalo ka paradigm e kopanyang ka mokhoa o sa reroang lefatše la sebele le la 'nete, likhalase tsa AR li fapana le lisebelisoa tsa VR ka ho lumella basebelisi ho bona litšoantšo tse hakanyetsoang ka dijithale le leseli le tikolohong ka nako e le ngoe...Bala haholoanyane -
Khōlo ea Heteroepitaxial ea 3C-SiC ho Li-Silicon Substrates tse nang le mekhoa e fapaneng.
1. Selelekela Ho sa tsotellehe lilemo tse mashome tsa lipatlisiso, heteroepitaxial 3C-SiC e hōlileng ka silicon substrates ha e e-s'o finyelle boleng bo lekaneng ba kristale bakeng sa lisebelisoa tsa elektronike tsa indasteri. Kholo hangata e etsoa ho li-substrates tsa Si(100) kapa Si(111), e 'ngoe le e 'ngoe e hlahisa liphephetso tse ikhethang: anti-phase ...Bala haholoanyane