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TSMC e notlela ka Silicon Carbide ea lisenthimithara tse 12 bakeng sa New Frontier, Ts'ebetso ea Maano ho Lisebelisoa tsa Taolo ea Thermal ea Bohlokoa ea AI Era​

Lethathamo la Dikahare

1. Phetoho ea Theknoloji: Ho Phahama ha Silicon Carbide le Liphephetso tsa Eona​

2. Phetoho ea Leano la TSMC: Ho Tsoa ho GaN le ho Becha ho SiC

3. Tlholisano ea Lintho tse bonahalang: Ho se nke sebaka ha SiC

4. Maemo a Ts'ebeliso: Phetohelo ea Tsamaiso ea Thermal ho Li-chip tsa AI le Lisebelisoa tsa Elektroniki tsa Next-Gen​

5. Liphephetso tsa Nakong e Tlang: Litšitiso tsa Tekheniki le Tlholisano ea Indasteri

Ho ea ka TechNews, indasteri ea lefats'e ea li-semiconductor e kene nakong e khannoang ke bohlale ba maiketsetso (AI) le k'homphieutha e sebetsang hantle (HPC), moo tsamaiso ea mocheso e hlahileng e le bothata ba mantlha bo amang moralo oa li-chip le tsoelo-pele ea ts'ebetso. Ha meralo e tsoetseng pele ea liphutheloana joalo ka ho bokella li-chip tsa 3D le kopanyo ea 2.5D e ntse e tsoela pele ho eketsa bongata ba li-chip le tšebeliso ea matla, li-substrate tsa setso tsa ceramic ha li sa khona ho fihlela litlhoko tsa phallo ea mocheso. TSMC, feme e etellang pele ea wafer lefatšeng, e arabela phephetso ena ka phetoho e matla ea thepa: e amohela ka botlalo li-substrate tsa silicon carbide (SiC) tsa lisenthimithara tse 12 ha butle-butle e ntse e tsoa khoebong ea gallium nitride (GaN). Ketso ena ha e bontše feela ho leka-lekanya bocha leano la thepa la TSMC empa hape e totobatsa kamoo tsamaiso ea mocheso e fetohileng ho tloha "theknolojing e tšehetsang" ho ea "molemong oa tlholisano ea mantlha."

 

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Silicon Carbide: Ka Nģ'ane ho Matla a Elektronike​​

Silicon carbide, e tsebahalang ka thepa ea eona e pharaletseng ea semiconductor ea bandgap, e 'nile ea sebelisoa ka tloaelo lisebelisoa tsa motlakase tse sebetsang hantle joalo ka li-inverter tsa likoloi tsa motlakase, litsamaiso tsa motlakase tsa indasteri, le meralo ea motheo ea matla a nchafatsoang. Leha ho le joalo, bokhoni ba SiC bo fetela hole haholo ho feta sena. Ka motlakase o ikhethang oa hoo e ka bang 500 W/mK—o fetang haholo li-substrate tsa ceramic tse tloaelehileng joalo ka aluminium oxide (Al₂O₃) kapa safire—SiC joale e se e loketse ho sebetsana le liphephetso tse ntseng li eketseha tsa mocheso oa lits'ebetso tsa bongata bo phahameng.

 https://www.xkh-semitech.com/sic-substrate-epi-wafer-conductivesemi-type-4-6-8-inch-product/

 

Li-Accelerator tsa AI le Mathata a Thermal​

Ho ata ha li-accelerator tsa AI, li-processor tsa setsi sa data, le likhalase tse bohlale tsa AR ho ekelitse lithibelo tsa sebaka le mathata a taolo ea mocheso. Lisebelisoang tse aparoang, mohlala, likarolo tsa microchip tse behiloeng haufi le leihlo li hloka taolo e nepahetseng ea mocheso ho netefatsa polokeho le botsitso. Ka ho sebelisa boiphihlelo ba eona ba lilemo tse mashome tlhahisong ea wafer ea lisenthimithara tse 12, TSMC e ntse e ntšetsa pele li-substrate tsa SiC tsa sebaka se seholo ho nkela li-ceramic tsa setso sebaka. Leano lena le nolofalletsa ho kopanngoa ho se nang sekoli meleng e teng ea tlhahiso, ho leka-lekanya chai le melemo ea litšenyehelo ntle le ho hloka phetoho e felletseng ea tlhahiso.

 

Liphephetso tsa Botekgeniki le Mekhoa e Mecha.

Leha di-substrate tsa SiC bakeng sa taolo ya mocheso di sa hloke maemo a thata a diphoso tsa motlakase tse hlokoang ke disebediswa tsa motlakase, botšepehi ba kristale bo ntse bo le bohlokwa. Mabaka a kantle a kang ditshila kapa kgatello ya maikutlo a ka sitisa phetiso ya phonon, a senya tsamaiso ya mocheso, mme a baka ho chesa haholo sebakeng seo, qetellong a ama matla a mechini le ho batalla ha bokahodimo. Bakeng sa di-wafer tsa di-inch tse 12, warpage le deformation ke dintho tsa bohlokwa, kaha di ama ka ho toba bond ya chip le dihlahiswa tse tswetseng pele tsa ho paka. Ka hona, tlhokomelo ya indasteri e fetohile ho tloha ho fediseng diphoso tsa motlakase ho ya ho netefatseng bongata bo tshwanang, ho ba le masoba a tlase, le ho ba le planarity e phahameng ya bokahodimo - ditlhoko tsa tlhahiso ya bongata ba substrate ya mocheso ya SiC e nang le chai e ngata.

 

https://www.xkh-semitech.com/silicon-carbide-sic-single-crystal-substrate-10x10mm-wafer-product/

.Karolo ea SiC ho Paketeng e Tsoetseng Pele

Motsoako oa SiC oa ho tsamaisa mocheso o phahameng, ho tiea ha mechini, le ho hanyetsa ho thothomela ha mocheso li e beha boemong ba phetoho ea papali liphuthelong tsa 2.5D le 3D:

 
  • Kopanyo ea 2.5D​​:Li-chip li kentsoe holim'a li-interposer tsa silicon kapa tsa organic tse nang le litsela tse khutšoane le tse sebetsang hantle tsa matšoao. Liphephetso tsa ho qhala mocheso mona li shebane haholo-holo le ho rapama.
  • Kopanyo ea 3D:Li-chip tse kopantsoeng ka ho otloloha ka li-via tsa through-silicon (TSVs) kapa bonding ea hybrid li fihlella bongata bo phahameng ba khokahano empa li tobana le khatello ea mocheso e matla. SiC ha e sebetse feela e le thepa ea mocheso e sa sebetseng empa e boetse e sebelisana le litharollo tse tsoetseng pele joalo ka taemane kapa tšepe e metsi ho theha litsamaiso tsa "ho pholisa ha hybrid".

 

.Tsoa ka Leano ho tsoa GaN​​

TSMC e phatlalalitse merero ea ho felisa ts'ebetso ea GaN ka 2027, ho fetisetsa mehloli ho SiC. Qeto ena e bonts'a phetoho ea maano: leha GaN e ipabola lits'ebetsong tse sebelisoang khafetsa, bokhoni bo felletseng ba taolo ea mocheso le bokhoni ba ho hola ba SiC bo tsamaellana hamolemo le pono ea nako e telele ea TSMC. Phetoho ho ea ho li-wafer tsa lisenthimithara tse 12 e tšepisa phokotso ea litšenyehelo le ho tšoana ho ntlafetseng ha ts'ebetso, ho sa tsotelehe liphephetso tsa ho seha, ho bentša le ho hlophisa.

 

Ka Nģ'ane ho Likoloi: Meeli e Mecha ea SiC

Ho tloha khale, SiC e 'nile ea amahanngoa le lisebelisoa tsa motlakase tsa likoloi. Joale, TSMC e ntse e nahana bocha ka lits'ebetso tsa eona:

 
  • SiC ea mofuta oa N e tsamaisang motlakase:E sebetsa e le li-spreader tsa mocheso ho li-accelerator tsa AI le li-processor tse sebetsang hantle.
  • SiC e sireletsang mocheso:E sebetsa e le di-interposer meralong ya di-chiplet, e leka-lekanya ho ikarola ha motlakase le ho tsamaisa mocheso.

Mekhoa ena e mecha e beha SiC e le thepa ea motheo bakeng sa taolo ea mocheso ho AI le li-chip tsa setsi sa data.

 

https://www.xkh-semitech.com/4h-n6h-n-sic-wafer-reasearch-production-dummy-grade-dia150mm-silicon-carbide-substrate-product/

 

​​​​​​Sebaka sa Lintho tse bonahalang​​

Leha daemane (1,000–2,200 W/mK) le graphene (3,000–5,000 W/mK) li fana ka phallo e phahameng ea mocheso, litšenyehelo tsa tsona tse phahameng le meeli ea ho pharalla li sitisa ho amoheloa ke batho ba bangata. Mekhoa e meng e kang ho kopanngoa ha sefahleho sa tšepe e metsi kapa microfluidic cooling le lithibelo tsa litšenyehelo. "Sebaka se monate" sa SiC—ho kopanya ts'ebetso, matla a mechini le bokhoni ba tlhahiso—se etsa hore e be tharollo e sebetsang ka ho fetisisa.
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Phehisano ea TSMC

Bokgoni ba TSMC ba ho kenya di-wafer tsa di-inch tse 12 bo e kgetholla ho bahlodisani, bo nolofalletsa ho kenngwa tshebetsong ha di-platform tsa SiC ka potlako. Ka ho sebedisa meralo ya motheo e teng le mahlale a tswetseng pele a ho paka jwalo ka CoWoS, TSMC e ikemiseditse ho fetola melemo ya thepa hore e be ditharollo tsa mocheso tsa boemo ba sistimi. Ka nako e ts'oanang, dinatla tsa indasteri tse kang Intel di beha pele phano ya motlakase ka morao le moralo mmoho wa motlakase, e leng se totobatsang phetoho ya lefatshe ho ya boqapi bo shebaneng le mocheso.

Nako ea poso: Loetse-28-2025
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