Tafole ea likateng
1.Lipakane tsa Bohlokoa le Bohlokoa ba ho Hloekisa Li-wafer
2. Tlhahlobo ea Tšilafalo le Mekhoa e Tsoetseng Pele ea Tlhahlobo
3. Mekhoa e Tsoetseng Pele ea ho Hloekisa le Melao-motheo ea Tekheniki
4. Lintho tsa bohlokoa tsa ho kenya tšebetsong theknoloji le taolo ea ts'ebetso
5. Mekhoa ea Nakong e Tlang le Litaelo tse Ncha
6.Litharollo tsa XKH tsa Qetello le Tikoloho ea Litšebeletso
Ho hlwekisa wafer ke ts'ebetso ea bohlokoa tlhahisong ea semiconductor, kaha esita le litšila tsa boemo ba athomo li ka senya ts'ebetso ea sesebelisoa kapa tlhahiso. Ts'ebetso ea ho hloekisa hangata e kenyelletsa mehato e mengata ea ho tlosa litšila tse fapaneng, joalo ka masala a lintho tse phelang, litšila tsa tšepe, likaroloana le li-oxide tsa tlhaho.
1. Maikemisetso a ho Hloekisa Wafer
- Tlosa litšila tse phelang (mohlala, masalla a photoresist, menwana).
- Felisa litšila tsa tšepe (mohlala, Fe, Cu, Ni).
- Tlosa tšilafalo ea likaroloana (mohlala, lerōle, likotoana tsa silicon).
- Tlosa di-oxide tsa tlhaho (mohlala, dikarolo tsa SiO₂ tse bopilweng nakong ya ho pepesehela moya).
2. Bohlokoa ba ho Hloekisa ka Botebo Li-wafer
- E netefatsa chai e phahameng ea ts'ebetso le ts'ebetso ea sesebelisoa.
- E fokotsa diphoso le sekgahla sa di-wafer scrap.
- E ntlafatsa boleng ba bokaholimo le botsitso.
Pele ho hlwekiso e matla, ho bohlokwa ho lekola tshilafatso e teng hodima bokahodimo. Ho utlwisisa mofuta, kabo ya boholo, le tlhophiso ya sebaka sa ditshila hodima bokahodimo ba wafer ho ntlafatsa k'hemistri ya ho hlwekisa le ho kenya matla a mechini.
3. Mekhoa e Tsoetseng Pele ea Tlhahlobo bakeng sa Tlhahlobo ea Tšilafalo
3.1 Tlhahlobo ea Likaroloana Tsa Bokaholimo
- Likhaontara tse khethehileng tsa likaroloana li sebelisa laser scattering kapa pono ea khomphutha ho bala, boholo le ho etsa 'mapa oa lithōle tsa bokaholimo.
- Matla a ho hasana ha leseli a amana le boholo ba likaroloana tse nyane joalo ka li-nanometer tse mashome le bongata bo tlase joalo ka likaroloana tse 0.1/cm².
- Ho lekanya ka maemo ho netefatsa botshepehi ba hardware. Diskena tsa pele le tsa kamora ho hlwekisa di netefatsa bokgoni ba ho tlosa, di ntlafatsa tshebetso.
3.2 Tlhahlobo ea Bokaholimo ba Lintho
- Mekhoa e amang bokaholimo e khetholla sebopeho sa metsoako.
- X-ray Photoelectron Spectroscopy (XPS/ESCA): E sekaseka maemo a lik'hemik'hale tse holim'a metsi ka ho bonesa wafer ka mahlaseli a X le ho lekanya lielektrone tse ntšitsoeng.
- Glow Discharge Optical Emission Spectroscopy (GD-OES): E ntsha dikarolwana tse tshesane haholo tsa bokahodimo ka tatellano ha e ntse e sekaseka di-spectra tse ntshitsweng ho fumana sebopeho sa dielemente se itshetlehileng botebong ba tsona.
- Meeli ea ho lemoha e fihla likarolo ka milione (ppm), e leng se tataisang khetho e ntle ka ho fetisisa ea k'hemistri ea ho hloekisa.
3.3 Tlhahlobo ea Tšilafalo ea Sebopeho
- Ho Scanning Electron Microscopy (SEM): E hapa litšoantšo tse nang le qeto e phahameng ho senola libopeho tsa litšila le likarolelano tsa ponahalo, e bontšang mekhoa ea ho khomarela (lik'hemik'hale khahlanong le ea mechine).
- Microscopy ea Matla a Atomiki (AFM): E etsa 'mapa oa nanoscale topography ho lekanya bolelele ba likaroloana le thepa ea mechini.
- Microscopy ea Ion Beam e Tsepamisitsoeng (FIB) ea ho Sila + ea Phetiso ea Electron (TEM): E fana ka maikutlo a ka hare a litšila tse patiloeng.
4. Mekhoa e Tsoetseng Pele ea ho Hloekisa
Leha ho hlwekisa dikhemikhale ho tlosa ditshila tsa tlhaho ka katleho, ho hlokahala mekgwa e meng e tswetseng pele bakeng sa dikarolwana tse sa pheleng, masalla a tshepe le ditshila tsa ionic:
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4.1 Ho Hloekisa RCA
- Mokhoa ona o ntshetswa pele ke RCA Laboratories, o sebedisa mokgwa wa ho hlapa ka dibate tse pedi ho tlosa ditshila tse polar.
- SC-1 (Standard Clean-1): E tlosa litšila le likaroloana tsa tlhaho ka ho sebelisa motsoako oa NH₄OH, H₂O₂, le H₂O (mohlala, karolelano ea 1:1:5 ho ~20°C). E etsa lera le lesesaane la silicon dioxide.
- SC-2 (Standard Clean-2): E tlosa litšila tsa tšepe ka ho sebelisa HCl, H₂O₂, le H₂O (mohlala, karolelano ea 1:1:6 ho ~80°C). E siea bokaholimo bo sa sebetseng.
- E leka-lekanya bohloeki le tšireletso ea bokaholimo.
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4.2 Tlhoekiso ea Ozone
- E qoelisa di-wafer ka metsing a nang le oli e ngata a sa tlatswang ka ozone (O₃/H₂O).
- E oxidation le ho tlosa lintho tse phelang ka katleho ntle le ho senya wafer, e siea bokaholimo bo sa sebetseng ka lik'hemik'hale.
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4.3 Ho Hloekisa Megasonic.
- E sebelisa matla a ultrasound a maqhubu a phahameng (hangata 750–900 kHz) hammoho le litharollo tsa ho hloekisa.
- E hlahisa lipululana tsa cavitation tse tlosang litšila. E kenella ka har'a li-geometri tse rarahaneng ha e ntse e fokotsa tšenyo meahong e bonolo.
4.4 Ho Hloekisa Cryogenic
- E pholisa li-wafer ka potlako ho fihlela mochesong o batang haholo, e senya litšila.
- Ho hlatswa kapa ho borashe butle ka mora moo ho tlosa dikarolwana tse hlephileng. Ho thibela ho kgutlela ha letlalo le ho hasana hodima lona.
- Mokhoa o potlakileng, o omileng o nang le tšebeliso e fokolang ea lik'hemik'hale.
Qetello:
Jwalo ka mofani wa ditharollo tsa semiconductor tse nang le ketane e felletseng, XKH e kgannwa ke boqapi ba theknoloji mme ditlhoko tsa bareki di fana ka tshebeletso ya tikoloho e akaretsang phepelo ya disebediswa tse phahameng, tlhahiso ya wafer, le tlhoekiso e nepahetseng. Ha re fe feela disebediswa tsa semiconductor tse tsebahalang matjhabeng (mohlala, mechini ya lithography, ditsamaiso tsa ho tjhesa) ka ditharollo tse ikgethileng empa hape re fana ka mahlale a boqapi—ho kenyeletswa le tlhoekiso ya RCA, tlhoekiso ya ozone, le tlhoekiso e kgolo—ho netefatsa bohloeki ba athomo bakeng sa tlhahiso ya wafer, ho ntlafatsa haholo tlhahiso ya bareki le bokgoni ba tlhahiso. Re sebedisa dihlopha tsa karabelo e potlakileng tsa lehae le marangrang a ditshebeletso a bohlale, re fana ka tshehetso e felletseng ho tloha ho kenyeng disebediswa le ntlafatso ya tshebetso ho isa tlhokomelong ya ho bolela esale pele, ho matlafatsa bareki ho hlola diphephetso tsa tekheniki le ho hatela pele ho ya ntshetsopeleng e phahameng ya semiconductor e tsitsitseng. Re kgethe bakeng sa tshebedisano-mmoho ya phenyo e habeli ya boiphihlelo ba tekheniki le boleng ba kgwebo.
Nako ea poso: Loetse-02-2025