Sejana sa SiC sa mofuta oa P 4H/6H-P 3C-N Botenya ba lisenthimithara tse 6 350 μm se nang le Orientation ea Motheo e bataletseng
Tlhaloso4H/6H-P Mofuta oa SiC Composite Substrates Tafole ea liparamente tse tloaelehileng
6 Sekoti sa Silicon Carbide (SiC) sa bophara ba lisenthimithara tse 10 Tlhaloso
| Sehlopha | Tlhahiso ea MPD ha e eoSehlopha (Z) Sehlopha) | Tlhahiso e TloaelehilengSehlopha (P) Sehlopha) | Sehlopha sa Mashano (D Sehlopha) | ||
| Bophara | 145.5 mm ~ 150.0 mm | ||||
| Botenya | 350 μm ± 25 μm | ||||
| Boikutlo ba Wafer | -OffMothapo: 2.0°-4.0° ho ya ho [1120] ± 0.5° bakeng sa 4H/6H-P, Mothapong:〈111〉± 0.5° bakeng sa 3C-N | ||||
| Botebo ba Micropipe | 0 cm-2 | ||||
| Ho hanyetsa | mofuta oa p 4H/6H-P | ≤0.1 Ωꞏcm | ≤0.3 Ωꞏcm | ||
| mofuta oa n 3C-N | ≤0.8 mΩꞏcm | ≤1 m Ωꞏcm | |||
| Boikutlo ba Motheo bo bataletseng | 4H/6H-P | -{1010} ± 5.0° | |||
| 3C-N | -{110} ± 5.0° | ||||
| Bolelele ba Sephara ba Motheo | 32.5 mm ± 2.0 mm | ||||
| Bolelele ba Bobedi bo Sephara | 18.0 mm ± 2.0 mm | ||||
| Boikutlo bo Bobedi bo bataletseng | Silicon e shebile holimo: 90° CW. ho tloha ho Prime flat ± 5.0° | ||||
| Ho se kenyeletsoe ha Moeli | 3 mm | 6 mm | |||
| LTV/TTV/Seqha/Sekotwana | ≤2.5 μm/≤5 μm/≤15 μm/≤30 μm | ≤10 μm/≤15 μm/≤25 μm/≤40 μm | |||
| Ho ba le makukuno | Ra≤1 nm ea Poland | ||||
| CMP Ra≤0.2 nm | Ra≤0.5 nm | ||||
| Mapetso a Moeli ka Leseli le Matla a Phahameng | Ha ho letho | Bolelele bo bokellaneng ≤ 10 mm, bolelele bo le bong ≤2 mm | |||
| Lipoleiti tsa Hex ka Leseli le Phahameng la Matla | Sebaka se bokellaneng ≤0.05% | Sebaka se bokellaneng ≤0.1% | |||
| Libaka tsa Polytype ka Leseli le Matla a Phahameng | Ha ho letho | Sebaka se bokellaneng ≤3% | |||
| Ho kenyeletsoa ha Khabone e Bonahalang | Sebaka se bokellaneng ≤0.05% | Sebaka se bokellaneng ≤3% | |||
| Ho ngoatheloa ha bokaholimo ba Silicon ke Leseli le Matla a Phahameng | Ha ho letho | Bolelele bo bokellaneng ≤1 × bophara ba wafer | |||
| Li-chips tsa Edge tse Phahameng ka Matla a Phahameng | Ha ho letho le dumelletsweng bophara le botebo ba ≥0.2mm | 5 e lumelletsoe, ≤1 mm ka 'ngoe | |||
| Tšilafalo ea Bokaholimo ba Silicon ka Matla a Phahameng | Ha ho letho | ||||
| Sephutheloana | Cassette ea wafer e nang le li-wafer tse ngata kapa setshelo se le seng sa wafer | ||||
Lintlha:
※ Meeli ea liphoso e sebetsa holim'a wafer eohle ntle le sebaka se ka thoko ho lehlakore. # Maqeba a lokela ho hlahlojoa sefahlehong sa Si o
Wafer ea mofuta oa P SiC, 4H/6H-P 3C-N, e nang le boholo ba lisenthimithara tse 6 le botenya ba 350 μm, e bapala karolo ea bohlokoa tlhahisong ea indasteri ea lisebelisoa tsa motlakase tse sebetsang hantle. Ho tsamaisa mocheso hantle le motlakase o phahameng ho etsa hore e be ntle bakeng sa likarolo tsa tlhahiso tse kang li-switch tsa motlakase, li-diode le li-transistors tse sebelisoang libakeng tse nang le mocheso o phahameng joalo ka likoloi tsa motlakase, li-grid tsa motlakase le litsamaiso tsa matla a tsosolositsoeng. Bokhoni ba wafer ba ho sebetsa hantle maemong a thata bo netefatsa ts'ebetso e tšepahalang lits'ebetsong tsa indasteri tse hlokang matla a mangata le ts'ebetso e ntle ea matla. Ho feta moo, tataiso ea eona ea mantlha e bataletseng e thusa ho hokahanya ka nepo nakong ea tlhahiso ea sesebelisoa, ho ntlafatsa ts'ebetso ea tlhahiso le botsitso ba sehlahisoa.
Melemo ea li-substrate tsa mofuta oa N SiC tse kopaneng e kenyelletsa
- Ho khanna ho Phahameng ha Thermal: Li-wafer tsa mofuta oa P SiC li tlosa mocheso ka katleho, e leng se etsang hore li be ntle bakeng sa lits'ebetso tsa mocheso o phahameng.
- Motlakase o Phahameng oa ho Aroha: E khona ho mamella motlakase o phahameng, e netefatsa hore lisebelisoa tsa motlakase le tsa motlakase o phahameng lia tšepahala.
- Ho Hanela Tikoloho e Bohloko: E tšoarella hantle haholo maemong a feteletseng, joalo ka mocheso o phahameng le libaka tse senyang.
- Phetoho e Sebetsang ea Matla: Ho sebelisa doping ea mofuta oa P ho nolofatsa ts'ebetso e sebetsang ea matla, e leng se etsang hore wafer e lokele litsamaiso tsa phetoho ea matla.
- Boikutlo ba Motheo bo bataletseng: E netefatsa ho otloloha hantle nakong ea tlhahiso, e ntlafatsa ho nepahala le botsitso ba sesebelisoa.
- Sebopeho se Sesesaane (350 μm): Botenya bo botle ba wafer bo tšehetsa ho kopanngoa ha lisebelisoa tsa elektroniki tse tsoetseng pele, tse nang le sebaka se fokolang.
Ka kakaretso, wafer ea mofuta oa P, 4H/6H-P 3C-N, e fana ka melemo e mengata e etsang hore e lokele haholo lits'ebetso tsa indasteri le tsa elektroniki. Ho tsamaisa mocheso le motlakase oa eona o phahameng ho nolofalletsa ts'ebetso e tšepahalang libakeng tse nang le mocheso o phahameng le motlakase o phahameng, ha ho hanyetsa ha eona maemong a thata ho netefatsa ho tšoarella. Ho sebelisa P-type doping ho lumella phetoho e sebetsang hantle ea motlakase, e leng se etsang hore e be e loketseng lisebelisoa tsa motlakase le litsamaiso tsa matla. Ho feta moo, tataiso ea mantlha ea wafer e bataletseng e netefatsa ho lumellana hantle nakong ea ts'ebetso ea tlhahiso, e ntlafatsa botsitso ba tlhahiso. Ka botenya ba 350 μm, e loketse hantle ho kopanngoa le lisebelisoa tse tsoetseng pele, tse nyane.
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