Lihlahisoa
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Thepa ea ho Pholisetsa ka Lehlakoreng le le Leng le Phahameng ka ho Feta
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Mochini oa ho Sila o Mahlakoreng a Habeli oa SiC Sapphire Si sephaphatha
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Multi-Wire Diamond Sawing Machine bakeng sa SiC Sapphire Ultra-Hard Brittle Materials
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SICOI (Silicon Carbide ka Insulator) Liphaephe tsa SiC Film KA Silicon
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Diamond Wire Cutting Machine bakeng sa SiC | Safira | Quartz | Khalase
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Mochini oa ho Pholisa oa Roboti - Ho Finishing e Phahameng ka ho Fetisisa e Ikemetseng
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Mochini o benyang oa Ion Beam bakeng sa sapphire SiC Si
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JGS1, JGS2, le JGS3 Fused Silica Optical Glass
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BF33 Glass Wafer Advanced Borosilicate Substrate 2″4″6″8″12″
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Li-Wafers tsa Quartz tsa High-Purity Fused Semiconductor, Photonics Optical Application 2″4″6″8″12″
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Sapphire Wafer Blank High Purity Raw Sapphire Substrate bakeng sa ho sebetsa
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Lebokose la Wafer le feto-fetohang - Tharollo e le 'ngoe bakeng sa Sizes tse ngata tsa Wafer