Lisebelisoa tsa semiconductor
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Mochini o phahameng oa ho cheka Laser oa ho cheka ka laser ho itšeha
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Mochini oa ho Cheka Laser oa Khalase
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Sesebelisoa sa ho Tšoaea sa Laser Anti-Counterfeiting Sapphire Wafer Marking
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Sistimi ea ho tšoaea ea Laser Anti-Counterfeiting bakeng sa li-substrates tsa Sapphire, Litaele tsa ho shebella, mabenyane a majabajaba.
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12inch Fully Automatic Precision Dicing Saw Equipment Wafer Dedicated Cutting System bakeng sa Si/SiC & HBM (Al)
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Thepa e Ikemetseng ka ho Fetisisa ea Wafer Ring-Cutting Size e sebetsang ka boholo ba 8inch/12inch Wafer Ring Cutting
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SiC crystal kgolo sebōpi SiC Ingot e holisa 4inch 6inch 8inch PTV Lely TSSG LPE mokhoa oa ho holisa
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Tafole e nyane ea laser punching mochini 1000W-6000W bonyane aperture 0.1MM e ka sebelisoa bakeng sa lisebelisoa tsa tšepe tsa khalase tsa ceramic.
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Mochini oa ho cheka oa laser o phahameng ka ho fetesisa bakeng sa thepa ea safire ea ceramic e nang le lehakoe le nang le nozzle
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Sapphire single crystal Al2O3 sebōpi sa kholo ea KY mokhoa oa Kyropoulos tlhahiso ea kristale ea boleng bo holimo ea safire
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Monocrystalline silicon kgolo sebopi monocrystalline silicon ingot kgolo tsamaiso mocheso thepa ho fihlela ho 2100 ℃
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Sebōpi sa khōlo ea kristale ea Sapphire Czochralski e le 'ngoe ea sebōpi sa kristale CZ mokhoa oa ho holisa sekoahelo sa boleng bo holimo sa safire