Silicon Carbide Ceramic Chuck bakeng sa SiC safire Si GAAs Wafer

Tlhaloso e Khutšoanyane:

Silicon Carbide Ceramic Chuck ke sethala se sebetsang hantle se entsoeng bakeng sa tlhahlobo ea semiconductor, tlhahiso ea wafer, le lits'ebetso tsa ho kopanya. E hahiloe ka thepa e tsoetseng pele ea letsopa - ho kenyeletsoa SiC e sintered (SSiC), SiC e kopantsoeng le reaction-bonded (RSiC), silicon nitride, le aluminium nitride - e fana ka ho tiea ho hoholo, katoloso e tlase ea mocheso, ho hanyetsa ho tsofala ho hoholo, le bophelo bo bolelele ba ts'ebeletso.

Romella imeile ho rona

Likaroloana

Setšoantšo se qaqileng

Kakaretso ea Silicon Carbide (SiC) Ceramic Chuck

TheSilicon Carbide Ceramic Chuckke sethala se sebetsang hantle se entsoeng bakeng sa tlhahlobo ea semiconductor, tlhahiso ea wafer, le lits'ebetso tsa ho kopanya. E hahiloe ka thepa e tsoetseng pele ea letsopa—ho kenyeletsoaSiC e sintered (SSiC), SiC e kopantsoeng ke karabelo (RSiC), nitride ea siliconlenitride ea aluminium—e fana kaho satalla ho hoholo, katoloso e tlase ea mocheso, ho hanyetsa ho tsofala ho hoholo, le bophelo bo bolelele ba tšebeletso.

Ka boenjiniere bo nepahetseng le ho bentša ha sejoale-joale, chuck e fana kaho batalla ha sub-micron, bokaholimo ba boleng ba seipone, le botsitso ba nako e telele, e leng se etsang hore e be tharollo e phethahetseng bakeng sa lits'ebetso tsa bohlokoa tsa semiconductor.

Melemo ea Bohlokoa

Ho nepahala ho Hoholo
Bophara bo laoloang kahare0.3–0.5 μm, ho netefatsa botsitso ba wafer le ho nepahala ha ts'ebetso e tsitsitseng.
Ho polisha liipone
Li finyeletseRa 0.02 μmho se be le bokaholimo bo thata, ho fokotsa ho ngoatheha ha wafer le tšilafalo—e loketse tikoloho e hloekileng haholo.
Bobebe bo Bobebe haholo
E matla empa e bobebe ho feta di-quartz kapa di-substrate tsa tshepe, e ntlafatsa taolo ya motsamao, karabelo le ho nepahala ha sebaka.
Ho satalla ho Hoholo
Modulus e ikhethang ea Young e netefatsa botsitso ba litekanyo tlas'a meroalo e boima le ts'ebetso e potlakileng.
Katoloso e Tlase ea Thermal
CTE e tšoana hantle le li-wafer tsa silicon, e fokotsa khatello ea mocheso le ho eketsa ts'epo ea ts'ebetso.
Khanyetso e Ikhethang ea ho Aparela
Ho thatafala ho feteletseng ho boloka ho bataletse le ho nepahala esita le tlas'a tšebeliso ea nako e telele, khafetsa.

Mokhoa oa Tlhahiso

Tokisetso ea Lisebelisoa tse Tala
Phofo ea SiC e hloekileng haholo e nang le boholo ba likaroloana tse laoloang le litšila tse tlase haholo.
Ho theha le ho Sintering
Mekhoa e kangsesebelisoa sa ho ntsha metsi ntle le khatello (SSiC) or ho kopana ha karabelo (RSiC)hlahisa di-substrate tse teteaneng, tse tshwanang tsa letsopa.
Ho Sebetsa ka ho Sebetsa
Ho sila ha CNC, ho kuta ka laser, le ho sebetsa ka ho nepahala ho hoholo ho fihlella mamello ea ±0.01 mm le ho tšoana ha ≤3 μm.
Phekolo ea Bokaholimo
Ho sila le ho polisha ka mekhahlelo e mengata ho fihlela ho Ra 0.02 μm; ho koaheloa ka boikhethelo ho fumaneha bakeng sa ho hanyetsa mafome kapa thepa ea khohlano e ikhethileng.
Tlhahlobo le Taolo ea Boleng
Li-interferometer le liteko tsa ho se tsitse li netefatsa ho latela litlhaloso tsa sehlopha sa semiconductor.

Litlhaloso tsa Tekheniki

Paramethara	Boleng	Yuniti
Bophara	≤0.5	μm
Boholo ba wafer	6'', 8'', 12'' (e fumaneha ka mokhoa o ikhethileng)	—
Mofuta oa bokaholimo	Mofuta oa phini / Mofuta oa lesale	—
Bolelele ba phini	0.05–0.2	mm
Bophara ba bonyane ba phini	ϕ0.2	mm
Sebaka se senyenyane sa phini	3	mm
Bophara ba lesale la tiiso bo fokolang	0.7	mm
Ho se tsitse ha bokaholimo	Ra 0.02	μm
Ho mamella botenya	± 0.01	mm
Mamello ea bophara	± 0.01	mm
Mamello ea ho tšoana	≤3	μm

Likopo tse ka Sehloohong

Lisebelisoa tsa tlhahlobo ea wafer ea semiconductor
Mekhoa ea tlhahiso le phetisetso ea wafer
Lisebelisoa tsa ho kopanya le ho paka tsa wafer
Tlhahiso e tsoetseng pele ea lisebelisoa tsa optoelectronic
Lisebelisoa tse nepahetseng tse hlokang libaka tse bataletseng haholo, tse hloekileng haholo

Lipotso le Likarabo - Silicon Carbide Ceramic Chuck

P1: Li-chuck tsa ceramic tsa SiC li bapisoa joang le li-chuck tsa quartz kapa tsa tšepe?
A1: Li-chuck tsa SiC li bobebe, li tiile, 'me li na le CTE e haufi le li-wafer tsa silicon, e leng se fokotsang phetoho ea mocheso. Li boetse li fana ka ho hanyetsa ho tsofala ho hoholo le bophelo bo bolelele.

P2: Ke ho batalla hofe ho ka fihlellehang?
A2: E laoloa ka hare ho0.3–0.5 μm, ho fihlela litlhoko tse thata tsa tlhahiso ea semiconductor.

P3: Na bokaholimo bo tla hohla di-wafer?
A3: Tjhe—e bentšitsoeng ka seiponeng hoRa 0.02 μm, ho netefatsa hore ha ho na ho ngoatheha le hore ho fokotswa tlhahiso ya dikarolwana.

P4: Ke boholo bofe ba wafer bo tšehetsoang?
A4: Boholo bo tloaelehileng ba6'', 8'', le 12'', ka mokhoa oa ho iketsetsa o fumanehang.

P5: Khanyetso ea mocheso e joang?
A5: Liserame tsa SiC li fana ka ts'ebetso e ntle haholo ea mocheso o phahameng ka phetoho e fokolang tlas'a potoloho ea mocheso.

Mabapi le rona

XKH e ikhethile ka nts'etsopele ea theknoloji e phahameng, tlhahiso le thekiso ea khalase e khethehileng ea mahlo le thepa e ncha ea kristale. Lihlahisoa tsa rona li sebeletsa lisebelisoa tsa elektroniki tsa mahlo, lisebelisoa tsa elektroniki tsa bareki le sesole. Re fana ka likarolo tsa mahlo tsa Sapphire, likoahelo tsa lense ea mohala oa thekeng, Ceramics, LT, Silicon Carbide SIC, Quartz, le li-wafer tsa kristale tsa semiconductor. Ka boiphihlelo bo nang le boiphihlelo le lisebelisoa tsa sejoale-joale, re ipabola ts'ebetsong ea lihlahisoa tse seng tsa maemo a holimo, re ikemiselitse ho ba khoebo e etellang pele ea theknoloji e phahameng ea lisebelisoa tsa optoelectronic.