Li-Wafer tsa Silicon Carbide tse nang le bohloeki bo phahameng ba lisenthimithara tse 3 (HPSl)

Setšoantšo se Hlahisitsoeng sa Silicon Carbide Wafers se nang le semi-Insulating Sic Substrates (HPSl) sa lisenthimithara tse 3 (High Purity)

Tlhaloso e Khutšoanyane:

Wafer ea Silicon Carbide (SiC) ea lisenthimithara tse 3 ke substrate ea boemo bo holimo e ntlafalitsoeng bakeng sa lits'ebetso tsa matla a holimo, maqhubu a holimo, le tsa optoelectronic. Li entsoe ka thepa ea 4H-SiC e sa tsosolosoang, e hloekileng haholo, li bonts'a ho tsamaisoa ha mocheso o motle haholo, lekhalo le leholo la bandgap, le thepa e ikhethang ea ho thibela mocheso o fokolang, e leng se etsang hore e be ea bohlokoa bakeng sa nts'etsopele e tsoetseng pele ea sesebelisoa. Ka botšepehi bo phahameng ba sebopeho le boleng ba bokaholimo, substrates tsa HPSI SiC li sebetsa e le motheo oa mahlale a moloko o latelang indastering ea motlakase ea elektronike, likhokahano tsa mohala le lifofane, li tšehetsa boqapi masimong a fapaneng.

Romella imeile ho rona

Likaroloana

Matlo

1. Thepa ea 'Mele le ea Sebopeho
●Mofuta oa Thepa: Ho Hloeka ho Hoholo (Ho sa Tsoaloa) Silicon Carbide (SiC)
●Bophara: lisenthimithara tse 3 (76.2 mm)
●Botenya: 0.33-0.5 mm, e ka fetoloa ho latela litlhoko tsa ts'ebeliso.
●Sebopeho sa kristale: Polytype ea 4H-SiC e nang le lerako la hexagonal, e tsebahalang ka ho tsamaea ha lielektrone tse ngata le botsitso ba mocheso.
●Tloaelo:
oStandard: [0001] (C-plane), e loketse mefuta e mengata ea lits'ebetso.
oKhetho: Off-axis (4° kapa 8° sekamela) bakeng sa kgolo e ntlafetseng ya epitaxial ya dikarolo tsa sesebediswa.
●Bophara: Phapang ea botenya bohle (TTV) ●Boleng ba Bokaholimo:
o E bentšitsoeng ho isa ho oBongata bo nang le sekoli se tlase (<10/cm² Bongata ba diphaephe tse nyane). 2. Thepa ya Motlakase ●Ho tsitlallela: >109^99 Ω·cm, e tswelang pele ka ho tlosa dintho tse ntshang ka boomo.
●Matla a Dielectric: Ho mamella motlakase o phahameng ka tahlehelo e nyane ea dielectric, e loketseng lits'ebetso tsa motlakase o phahameng.
●Ho tsamaisa mocheso ka mocheso: 3.5-4.9 W/cm·K, ho nolofalletsang ho qhala mocheso ka katleho disebedisweng tse sebetsang hantle.

3. Thepa ea Mocheso le ea Mekaniki
●Sekheo se Sephara sa Band: 3.26 eV, e tšehetsang ts'ebetso tlas'a maemo a phahameng a motlakase, mocheso o phahameng, le mahlaseli a mangata.
●Bothata: Sekala sa Mohs sa 9, se netefatsang ho tiea khahlanong le ho senyeha ha mechini nakong ea ts'ebetso.
●Koefficient ea Katoloso ea Thermal: 4.2×10−6/K4.2 \times 10^{-6}/\text{K}4.2×10−6/K, ho netefatsa botsitso ba litekanyo tlas'a liphetoho tsa mocheso.

Paramethara	Kereiti ea Tlhahiso	Kereiti ea Lipatlisiso	Sehlopha sa Mashano	Yuniti
Sehlopha	Kereiti ea Tlhahiso	Kereiti ea Lipatlisiso	Sehlopha sa Mashano
Bophara	76.2 ± 0.5	76.2 ± 0.5	76.2 ± 0.5	mm
Botenya	500 ± 25	500 ± 25	500 ± 25	µm
Boikutlo ba Wafer	Mokhahlelo o sebetsang: <0001> ± 0.5°	Mokhahlelo o sebetsang: <0001> ± 2.0°	Mokhahlelo o sebetsang: <0001> ± 2.0°	tekanyo
Boima ba Micropipe (MPD)	≤ 1	≤ 5	≤ 10	cm−2^-2−2
Ho hanyetsa motlakase	≥ 1E10	≥ 1E5	≥ 1E5	Ω·cm
Dopant	E phutholotsoe	E phutholotsoe	E phutholotsoe
Boikutlo ba Motheo bo bataletseng	{1-100} ± 5.0°	{1-100} ± 5.0°	{1-100} ± 5.0°	tekanyo
Bolelele ba Sephara ba Motheo	32.5 ± 3.0	32.5 ± 3.0	32.5 ± 3.0	mm
Bolelele ba Bobedi bo Sephara	18.0 ± 2.0	18.0 ± 2.0	18.0 ± 2.0	mm
Boikutlo bo Bobedi bo bataletseng	90° CW ho tloha foleteng ea mantlha ± 5.0°	90° CW ho tloha foleteng ea mantlha ± 5.0°	90° CW ho tloha foleteng ea mantlha ± 5.0°	tekanyo
Ho se kenyeletsoe ha Moeli	3	3	3	mm
LTV/TTV/Seqha/Koba	3 / 10 / ±30 / 40	3 / 10 / ±30 / 40	5 / 15 / ±40 / 45	µm
Bokahare bo Bobebe	Sefahleho sa Si: CMP, sefahleho sa C: Se bentšitsoeng	Sefahleho sa Si: CMP, sefahleho sa C: Se bentšitsoeng	Sefahleho sa Si: CMP, sefahleho sa C: Se bentšitsoeng
Mapetso (Leseli le Matla a Phahameng)	Ha ho letho	Ha ho letho	Ha ho letho
Lipoleiti tsa Hex (Leseli le Matla a Phahameng)	Ha ho letho	Ha ho letho	Sebaka se kopaneng 10%	%
Libaka tsa Mefuta e Mengata (Leseli le Matla a Phahameng)	Sebaka se kopaneng 5%	Sebaka se kopaneng 20%	Sebaka se kopaneng 30%	%
Mengoapo (Leseli le Matla a Phahameng)	≤ ho ngoatheloa ha 5, bolelele bo kopaneng ≤ 150	≤ mengoapo e 10, bolelele bo kopaneng ≤ 200	≤ mengoapo e 10, bolelele bo kopaneng ≤ 200	mm
Ho qhaqha Edge	Ha ho letho ≥ bophara/botebo ba 0.5 mm	2 e lumelletsoe bophara/botebo ba ≤ 1 mm	5 e lumelletsoe bophara/botebo ba ≤ 5 mm	mm
Tšilafalo ea Bokaholimo	Ha ho letho	Ha ho letho	Ha ho letho

Likopo

1. Matla a Elektroniki
Sebaka se seholo sa leqhubu le phallo e phahameng ea mocheso ea li-substrate tsa HPSI SiC li etsa hore li be ntle bakeng sa lisebelisoa tsa motlakase tse sebetsang maemong a feteletseng, joalo ka:
●Lisebelisoa tse nang le Voltage e Phahameng: Ho kenyeletsoa le MOSFET, IGBT, le Schottky Barrier Diodes (SBDs) bakeng sa phetoho e sebetsang hantle ea matla.
●Mekhoa ea Matla a Nchafalitsoeng: Joalo ka li-inverter tsa letsatsi le li-controller tsa turbine ea moea.
●Likoloi tsa Motlakase (li-EV): Li sebelisoa ho li-inverter, li-charger le litsamaiso tsa powertrain ho ntlafatsa ts'ebetso le ho fokotsa boholo.

2. Ditshebediso tsa RF le Microwave
Ho hanyetsa ho hoholo le tahlehelo e tlase ea dielectric ea li-wafer tsa HPSI li bohlokoa bakeng sa litsamaiso tsa maqhubu a radio (RF) le microwave, ho kenyeletsoa:
●Meralo ea Motheo ea Khokahano: Liteishene tsa motheo bakeng sa marang-rang a 5G le puisano ea sathelaete.
●Sebaka sa Lifofane le Tšireletso: Litsamaiso tsa radar, li-antenna tse arotsoeng ka mekhahlelo, le likarolo tsa li-avionic.

3. Lisebelisoa tsa Optoelectronics
Ponaletso le lekhalo le pharaletseng la 4H-SiC le nolofalletsa tšebeliso ea eona lisebelisoa tsa optoelectronic, tse kang:
●Li-UV Photodetector: Bakeng sa tlhokomelo ea tikoloho le tlhahlobo ea bongaka.
●Li-LED tse Matla a Phahameng: Li tšehetsa litsamaiso tsa mabone a boemo bo tiileng.
●Li-diode tsa Laser: Bakeng sa lits'ebetso tsa indasteri le tsa bongaka.

4. Patlisiso le Nts'etsopele
Li-substrate tsa HPSI SiC li sebelisoa haholo lilaboratoring tsa R&D tsa thuto le tsa indasteri bakeng sa ho hlahloba thepa e tsoetseng pele ea thepa le tlhahiso ea lisebelisoa, ho kenyeletsoa:
●Khōlo ea Lera la Epitaxial: Lithuto mabapi le phokotso ea liphoso le ntlafatso ea lera.
●Lithuto tsa ho Tsamaea ha Mokhanni: Phuputso ea ho tsamaisoa ha lielektrone le masoba ka har'a thepa e hloekileng haholo.
●Prototype: Ntlafatso ea pele ea lisebelisoa le lipotoloho tse ncha.

Melemo

Boleng bo Phahameng:
Bohloeki bo phahameng le ho ba le sekoli se fokolang li fana ka sethala se tšepahalang bakeng sa lits'ebetso tse tsoetseng pele.

Ho Tsitsisa ha Thermal:
Litšobotsi tse ntle tsa ho qhala mocheso li lumella lisebelisoa ho sebetsa hantle tlas'a maemo a matla a phahameng le mocheso.

Ho lumellana ho pharaletseng:
Mekhoa e fumanehang le likhetho tsa botenya bo ikhethileng li netefatsa hore sesebelisoa sea ikamahanya le maemo bakeng sa litlhoko tse fapaneng.

Ho tšoarella:
Ho thatafala ho ikhethang le botsitso ba sebopeho ho fokotsa ho tsofala le ho fetoha ha sebopeho nakong ea ts'ebetso le ts'ebetso.

Ho feto-fetoha ha maemo:
E loketse mefuta e mengata ea liindasteri, ho tloha ho matla a nchafatsoang ho ea ho lifofane le likhokahano tsa mohala.

Qetello

Sefaha sa Silicon Carbide se nang le Semi-Insulating sa lisenthimithara tse 3 se emela sehlohlolo sa theknoloji ea substrate bakeng sa lisebelisoa tse matla haholo, tse nang le maqhubu a phahameng le tse nang le optoelectronic. Motsoako oa eona oa thepa e ntle ea mocheso, motlakase le ea mechini o netefatsa ts'ebetso e tšepahalang libakeng tse thata. Ho tloha litsamaisong tsa motlakase le tsa RF ho ea ho litsamaiso tsa optoelectronic le R&D e tsoetseng pele, li-substrate tsena tsa HPSI li fana ka motheo oa boqapi ba hosane.
Bakeng sa tlhahisoleseding e batsi kapa ho etsa odara, ka kopo ikopanye le rona. Sehlopha sa rona sa botekgeniki se fumaneha ho fana ka tataiso le dikgetho tsa ho iketsetsa tse tsamaellanang le ditlhoko tsa hao.