4H-N/6H-N SiC Wafer Research tlhahiso Dummy grade Dia150mm Silicon carbide substrate
Tlhaloso ea substrate ea silicon carbide (SiC) ea bophara ba lisenthimithara tse 6
| Sehlopha | Lefela la MPD | Tlhahiso | Kereiti ea Lipatlisiso | Sehlopha sa Mashano |
| Bophara | 150.0mm±0.25mm | |||
| Botenya | 4H-N | 350um±25um | ||
| 4H-SI | 500um±25um | |||
| Boikutlo ba Wafer | Mothating:<0001>±0.5° bakeng sa 4H-SI | |||
| Folete ea Pele | {10-10}±5.0° | |||
| Bolelele ba Sephara ba Motheo | 47.5mm±2.5mm | |||
| Ho se kenyelletsoe moeling | 3mm | |||
| TTV/Seqha/Sekoahelo | ≤15um/≤40um/≤60um | |||
| Botebo ba Micropipe | ≤1cm-2 | ≤5cm-2 | ≤15cm-2 | ≤50cm-2 |
| Ho hanyetsa 4H-N 4H-SI | 0.015~0.028Ω!cm | |||
| ≥1E5Ω!cm | ||||
| Ho ba le makukuno | Ra ea Poland ≤1nm CMP Ra≤0.5nm | |||
| #Mapetso a bakoang ke khanya e matla haholo | Ha ho letho | E 1 e lumelletsoe, ≤2mm | Bolelele bo bokellaneng ≤10mm, bolelele bo le bong ≤2mm | |
| *Lipoleiti tsa Hex tse nang le khanya e matla haholo | Sebaka se bokellaneng ≤1% | Sebaka se bokellaneng ≤ 2% | Sebaka se bokellaneng ≤ 5% | |
| *Libaka tsa mofuta o fapaneng ka khanya e matla haholo | Ha ho letho | Sebaka se bokellaneng ≤ 2% | Sebaka se bokellaneng ≤ 5% | |
| *&E ngoapa ka lebaka la khanya e matla haholo | Mekwatla e 3 ho isa ho 1 x bolelele bo kopaneng ba bophara ba wafer | Mekwatla e 5 ho isa ho 1 x bolelele bo kopaneng ba bophara ba wafer | Meqolo e 5 ho isa ho 1 x bolelele ba ho bokellana ba wafer | |
| Chip ea bohale | Ha ho letho | Tse 3 li lumelletsoe, ≤0.5mm ka 'ngoe | 5 e lumelletsoe, ≤1mm ka 'ngoe | |
| Tšilafalo e bakoang ke khanya e matla haholo | Ha ho letho
| |||
Thekiso le Tšebeletso ea Bareki
Theko ea Thepa
Lefapha la ho reka thepa le ikarabella ho bokella thepa eohle e tala e hlokahalang ho hlahisa sehlahisoa sa hau. Ho sala morao ka botlalo ha lihlahisoa le thepa eohle, ho kenyeletsoa le tlhahlobo ea lik'hemik'hale le ea 'mele ho lula ho fumaneha.
Boleng
Nakong le ka mora tlhahiso kapa ts'ebetso ea lihlahisoa tsa hau, lefapha la taolo ea boleng le ameha ho netefatseng hore thepa eohle le mamello li fihlela kapa li feta litlhaloso tsa hau.
Tšebeletso
Re motlotlo ka ho ba le basebetsi ba boenjiniere ba thekiso ba nang le boiphihlelo ba lilemo tse fetang 5 indastering ea semiconductor. Ba koetliselitsoe ho araba lipotso tsa tekheniki hammoho le ho fana ka litheolelo tse nakong bakeng sa litlhoko tsa hau.
Re haufi le uena neng kapa neng ha u na le bothata, 'me re bo rarolla ka mor'a lihora tse 10.
Setšoantšo se qaqileng
