4H-N/6H-N SiC Wafer Reasearch tlhahiso ea Dummy grade Dia150mm Silicon carbide substrate

Tlhaloso e Khutšoanyane:

Re ka fana ka mocheso o phahameng superconducting tšesaane filimi substrate, matla a khoheli a tšesaane lifilimi le ferroelectric tšesaane filimi substrate, semiconductor kristale, kristale optical, laser kristale thepa, ka nako e tšoanang fana ka tjantjello, kristale itšeha, sila, bentsa le litšebeletso tse ling tsa tshebetso.Li-substrates tsa rona tsa SiC li tsoa Tankeblue Factory e Chaena.

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

6 inch bophara ba silicon carbide (SiC) substrate e boletsoeng

Kereiti	Zero MPD	Tlhahiso	Sehlopha sa Lipatlisiso	Sehlopha sa Dummy
Diameter	150.0mm±0.25mm
Botenya	4H-N	350um±25um
	4H-SI	500um±25um
Wafer Orientation	Ka lehlakoreng le leng :<0001>±0.5° bakeng sa 4H-SI Off axis : 4.0° ho leba<1120>±0.5° bakeng sa 4H-N
Primary Flat	{10-10}±5.0°
Bolelele ba Phatlalatso ba Pele	47.5mm±2.5mm
Kenyelletso ea moeli	3mm
TTV/Bow/Warp	≤15um/≤40um/≤60um
Boima ba Micropipe	≤1cm-2	≤5cm-2	≤15cm-2	≤50cm-2
Ho hanyetsa 4H-N 4H-SI	0.015~0.028Ω!cm
	≥1E5Ω!cm
Boqhobane	Polish Ra ≤1nm CMP Ra≤0.5nm
# Mapetso ka leseli le phahameng haholo	Ha ho letho		1 e lumelletsoe,≤2mm	Bolelele bo akaretsang ≤10mm, bolelele bo le bong≤2mm
* Lipoleiti tsa Hex ka leseli le phahameng haholo	Kakaretso ≤1%		Kakaretso ≤ 2%	Kakaretso ≤ 5%
* Libaka tsa polytype ka khanya e matla e phahameng	Ha ho letho		Kakaretso ≤ 2%	Kakaretso ≤ 5%
*&E mengoa ka khanya e matla haholo	Mengoallo e 3 ho isa ho 1 x wafer bophara ba bolelele bo akaretsang		Mengoako e 5 ho isa ho 1 x wafer bophara ba bolelele bo akaretsang	Li-scratches tse 5 ho isa ho 1 x wafer bophara ba bolelele bo akaretsang
Chip ea moeli	Ha ho letho		3 e lumelletsoe,≤0.5mm ka ngoe	5 e lumelletsoe, ≤1mm ka 'ngoe
Ho silafatsoa ke khanya e matla haholo	Ha ho letho

Thekiso & Tšebeletso ea Bareki

Thepa ea Lintho

Lefapha la ho reka thepa le ikarabella ho bokella lisebelisoa tsohle tse hlokahalang ho hlahisa sehlahisoa sa hau.Ho fumaneha ka botlalo ha lihlahisoa le lisebelisoa, ho kenyelletsa tlhahlobo ea lik'hemik'hale le 'mele li lula li le teng.

Boleng

Nakong le ka mor'a tlhahiso kapa mochini oa lihlahisoa tsa hau, lefapha la taolo ea boleng le kenya letsoho ho netefatsa hore lisebelisoa tsohle le mamello li kopana kapa li feta seo u se behileng.

Tshebeletso

Re motlotlo ka ho ba le basebetsi ba boenjiniere ba thekiso ba nang le boiphihlelo ba lilemo tse fetang 5 indastering ea semiconductor.Ba koetliselitsoe ho araba lipotso tsa tekheniki le ho fana ka mantsoe a qotsitsoeng ka nako bakeng sa litlhoko tsa hau.

re ka lehlakoreng la hau ka nako efe kapa efe ha u na le bothata, 'me u bo rarolle ka mor'a lihora tse 10.