Sekhahla sa teko sa Silicon sa lisenthimithara tse 4 FZ CZ N-Type DSP kapa SSP

Sekema sa Silicon sa lisenthimithara tse 4 FZ CZ N-Type DSP kapa SSP Test grade Setšoantšo se Hlahisitsoeng

Tlhaloso e Khutšoanyane:

Wafer ea silicon ke lakane e tšesaane e sehiloeng ka silicon e le 'ngoe ea kristale. Li-wafer tsa silicon li fumaneha ka bophara ba lisenthimithara tse 2, lisenthimithara tse 3, lisenthimithara tse 4, lisenthimithara tse 6, le lisenthimithara tse 8, 'me li sebelisoa haholo ho hlahisa lipotoloho tse kopantsoeng. Li-wafer tsa silicon ke thepa e tala feela 'me li-chips ke sehlahisoa se felileng. Li-wafer tsa silicon ke thepa ea bohlokoa bakeng sa ho etsa lipotoloho tse kopantsoeng, 'me lisebelisoa tse fapaneng tsa semiconductor li ka etsoa ka ho sebelisa photolithography le ion ho li-wafer tsa silicon.

Romella imeile ho rona

Likaroloana

Hlahisa lebokose la wafer

Li-wafer tsa silicon ke karolo ea bohlokoa ea lefapha la theknoloji le ntseng le hola kajeno. 'Maraka oa thepa ea semiconductor o hloka li-wafer tsa silicon tse nang le litlhaloso tse nepahetseng ho hlahisa palo e kholo ea lisebelisoa tse ncha tsa potoloho e kopaneng. Rea hlokomela hore ha litšenyehelo tsa tlhahiso ea li-semiconductor li ntse li eketseha, litšenyehelo tsa thepa eo ea tlhahiso, joalo ka li-wafer tsa silicon le tsona lia eketseha. Re utloisisa bohlokoa ba boleng le katleho ea litšenyehelo lihlahisoa tseo re li fang bareki ba rona. Re fana ka li-wafer tse theko e tlaase le tsa boleng bo tsitsitseng. Haholo-holo re hlahisa li-wafer tsa silicon le li-ingots (CZ), li-wafer tsa epitaxial, le li-wafer tsa SOI.

Bophara	Bophara	E bentšitsoeng	E entsoe ka doped	Boikutlo	Ho hanyetsa/Ω.cm	Botenya/um
2inch	50.8±0.5mm	SSP DSP	P/N	100	1-20	200-500
3inch	76.2±0.5mm	SSP DSP	P/B	100	NA	525±20
4inch	101.6±0.2 101.6±0.3 101.6±0.4	SSP DSP	P/N	100	0.001-10	200-2000
6inch	152.5±0.3	SSPDSP	P/N	100	1-10	500-650
8inch	200±0.3	DSPSSP	P/N	100	0.1-20	625

Tšebeliso ea li-wafer tsa silicon

Substrate: Seaparo sa PECVD/LPCVD, ho phunya ha magnetron

Substrate: XRD, SEM, spectroscopy ea infrared ea matla a athomo, microscopy ea elektrone ea phetisetso, spectroscopy ea fluorescence le liteko tse ling tsa tlhahlobo, kholo ea epitaxial ea mahlaseli a limolek'hule, tlhahlobo ea X-ray ea ts'ebetso ea microstructure ea kristale: ho fata, ho kopanya, lisebelisoa tsa MEMS, lisebelisoa tsa motlakase, lisebelisoa tsa MOS le ts'ebetso e 'ngoe.

Ho tloha ka 2010, Shanghai XKH Material Tech. Co., Ltd e ikemiselitse ho fa bareki litharollo tse felletseng tsa Silicon Wafer ea wafer ea lisenthimithara tse 4, ho tloha ho li-wafer tsa boemo ba ho lokisa liphoso tsa Dummy Wafer, li-wafer tsa boemo ba teko Test Wafer, ho ea ho li-wafer tsa boemo ba sehlahisoa Prime Wafer, hammoho le li-wafer tse khethehileng, li-wafer tsa Oxide Oxide, li-wafer tsa Nitride Si3N4, li-wafer tse koahetsoeng ka aluminium, li-wafer tsa silicon tse koahetsoeng ka koporo, SOI Wafer, MEMS Glass, li-wafer tse entsoeng ka mokhoa o ikhethileng tse teteaneng haholo le tse bataletseng haholo, jj., tse nang le boholo bo tlohang ho 50mm-300mm, 'me re ka fana ka li-wafer tsa semiconductor ka ho bentša ka lehlakore le le leng/mahlakore a mabeli, ho tšesaane, ho arola, MEMS le lits'ebeletso tse ling tsa ts'ebetso le tsa ho iketsetsa.