4inch Silicon wafer FZ CZ N-Type DSP kapa SSP Test grade

Tlhaloso e Khutšoanyane:

Sephaphatha sa silicon ke letlapa le tšesaane le sehiloeng ho silicon e le 'ngoe ea kristale.Li-wafers tsa silicon li fumaneha ka li-diameter tse 2-inch, 3-inch, 4-inch, 6-inch le 8-inch, 'me li sebelisoa haholo-holo ho hlahisa li-circuits tse kopantsoeng.Li-wafers tsa silicon ke thepa e tala feela 'me lichifi ke sehlahisoa se felileng.Li-wafers tsa silicon ke lisebelisoa tsa bohlokoa bakeng sa ho etsa li-circuits tse kopantsoeng, 'me lisebelisoa tse fapaneng tsa semiconductor li ka etsoa ka photolithography le ion implantation holim'a liphaphatha tsa silicon.

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Hlahisa lebokose la wafer

Li-wafers tsa silicon ke karolo ea bohlokoa ea lefapha la theknoloji le ntseng le hola kajeno.Mmaraka oa lisebelisoa tsa semiconductor o hloka li-wafers tsa silicon tse nang le litlhaloso tse nepahetseng ho hlahisa palo e kholo ea lisebelisoa tse ncha tse kopaneng tsa potoloho.Rea hlokomela hore ha litšenyehelo tsa tlhahiso ea semiconductor li ntse li eketseha, le litšenyehelo tsa thepa eo ea tlhahiso, joalo ka li-wafers tsa silicon.Re utloisisa bohlokoa ba boleng le katleho ea litšenyehelo lihlahisoa tseo re li fang bareki ba rona.Re fana ka li-wafers tse bolokang chelete e ngata le tsa boleng bo tsitsitseng.Haholo-holo re hlahisa li-wafers tsa silicon le li-ingots (CZ), li-wafers tsa epitaxial, le li-wafers tsa SOI.

Diameter	Diameter	E bentšitsoe	E rothiloe	Boitloaelo	Resistivity/Ω.cm	Botenya/um
2inch	50.8±0.5mm	SSP DSP	P/N	100	1-20	200-500
3 intshi	76.2±0.5mm	SSP DSP	P/B	100	NA	525±20
4	101.6±0.2 101.6±0.3 101.6±0.4	SSP DSP	P/N	100	0.001-10	200-2000
6	152.5±0.3	SSP DSP	P/N	100	1-10	500-650
8	200±0.3	DSP SSP	P/N	100	0.1-20	625

Tšebeliso ea li-wafers tsa silicon

Substrate: PECVD/LPCVD coating, magnetron sputtering

Substrate: XRD, SEM, atomic force infrared spectroscopy, transmission electron microscopy, fluorescence spectroscopy le liteko tse ling tsa analytical, molecular beam epitaxial growth, X-ray analysis of crystal microstructure processing: etching, bonding, lisebelisoa tsa MEMS, lisebelisoa tsa motlakase, lisebelisoa tsa MOS le tse ling. ho sebetsa

Ho tloha ka 2010, Shanghai XKH Material Tech.Co., Ltd e ikemiselitse ho fa bareki litharollo tse felletseng tsa 4-inch Wafer Silicon Wafer, ho tloha ho li-wafers tsa boemo ba debugging Dummy Wafer, liphaephe tsa liteko tsa liteko, ho isa liphaepheng tsa boemo ba sehlahisoa Prime Wafer, hammoho le liphaephe tse khethehileng, Oxide wafers Oxide, Nitride wafers Si3N4, Aluminium plated wafers, Copper plated silicon wafers, SOI Wafer, MEMS Glass, customized ultra-thick and Ultra-flat wafers, joalo-joalo, ka boholo ba 50mm-300mm, 'me re ka fana ka liphaephe tsa semiconductor tse nang le lehlakore le le leng. / ho bentša ka mahlakoreng a mabeli, ho tšesa, ho pata, MEMS le lits'ebeletso tse ling tsa ho lokisa le ho li etsa.