SiC wafer 4H-N 6H-N HPSI 4H-semi 6H-semi 4H-P 6H-P 3C mofuta 2inch 3inch 4inch 6inch 8inch
Matlo
4H-N le 6H-N (Li-wafer tsa SiC tsa mofuta oa N)
Kopo:E sebelisoa haholo-holo lits'ebetsong tsa motlakase tsa motlakase, tsa optoelectronics, le tsa mocheso o phahameng.
Bophara ba bophara:50.8 mm ho isa ho 200 mm.
Botenya:350 μm ± 25 μm, ka botenya ba boikhethelo ba 500 μm ± 25 μm.
Ho hanyetsa:Mofuta wa N 4H/6H-P: ≤ 0.1 Ω·cm (Sehlopha sa Z), ≤ 0.3 Ω·cm (Sehlopha sa P); Mofuta wa N 3C-N: ≤ 0.8 mΩ·cm (Sehlopha sa Z), ≤ 1 mΩ·cm (Sehlopha sa P).
Ho se tsitse:Ra ≤ 0.2 nm (CMP kapa MP).
Boima ba Micropipe (MPD):< 1 ka 'ngoe/cm².
TV: ≤ 10 μm bakeng sa bophara bohle.
Sekoahelo: ≤ 30 μm (≤ 45 μm bakeng sa di-wafer tsa di-inch tse 8).
Ho se kenyeletsoe ha Moeli:3 mm ho isa ho 6 mm ho latela mofuta oa wafer.
Sephutheloana:Khasete ea wafer e nang le li-wafer tse ngata kapa setshelo se le seng sa wafer.
Boholo bo fumanehang 3inch 4inch 6inch 8inch
HPSI (Li-wafer tsa SiC tse Sireletsang Bohloeki bo Phahameng)
Kopo:E sebelisoa bakeng sa lisebelisoa tse hlokang khanyetso e phahameng le ts'ebetso e tsitsitseng, joalo ka lisebelisoa tsa RF, lits'ebetso tsa photonic, le li-sensor.
Bophara ba bophara:50.8 mm ho isa ho 200 mm.
Botenya:Botenya bo tloaelehileng ba 350 μm ± 25 μm ka dikgetho bakeng sa di-wafer tse teteaneng ho fihlela ho 500 μm.
Ho se tsitse:Ra ≤ 0.2 nm.
Boima ba Micropipe (MPD): ≤ 1 ka 'ngoe/cm².
Ho hanyetsa:Khanyetso e phahameng, hangata e sebelisoa lits'ebetsong tsa ho thibela mocheso ka halofo.
Sekoahelo: ≤ 30 μm (bakeng sa boholo bo bonyenyane), ≤ 45 μm bakeng sa bophara bo boholo.
TV: ≤ 10 μm.
Boholo bo fumanehang 3inch 4inch 6inch 8inch
4H-P、6H-P&3C SiC wafer(Li-wafer tsa SiC tsa mofuta oa P)
Kopo:Haholo-holo bakeng sa matla le lisebelisoa tse nang le maqhubu a phahameng.
Bophara ba bophara:50.8 mm ho isa ho 200 mm.
Botenya:350 μm ± 25 μm kapa dikgetho tse ikgethileng.
Ho hanyetsa:Mofuta oa P 4H/6H-P: ≤ 0.1 Ω·cm (Sehlopha sa Z), ≤ 0.3 Ω·cm (Sehlopha sa P).
Ho se tsitse:Ra ≤ 0.2 nm (CMP kapa MP).
Boima ba Micropipe (MPD):< 1 ka 'ngoe/cm².
TV: ≤ 10 μm.
Ho se kenyeletsoe ha Moeli:3 mm ho isa ho 6 mm.
Sekoahelo: ≤ 30 μm bakeng sa boholo bo bonyenyane, ≤ 45 μm bakeng sa boholo bo boholo.
Boholo bo fumanehang 3inch 4inch 6inch5×5 10×10
Tafole ea Liparamitha tsa Lintlha tse sa Feleng
| Thepa | Lisenche tse 2 | 3inch | 4inch | 6inch | 8inch | |||
| Mofuta | 4H-N/HPSI/ | 4H-N/HPSI/ | 4H-N/HPSI//4H/6H-P/3C; | 4H-N/HPSI//4H/6H-P/3C; | 4H-N/HPSI/4H-SEMI | |||
| Bophara | 50.8 ± 0.3 mm | 76.2±0.3mm | 100±0.3mm | 150±0.3mm | 200 ± 0.3 mm | |||
| Botenya | 330 ± 25 um | 350 ±25 um | 350 ±25 um | 350 ±25 um | 350 ±25 um | |||
| 350±25um; | 500±25um | 500±25um | 500±25um | 500±25um | ||||
| kapa e etselitsoeng motho ka mong | kapa e etselitsoeng motho ka mong | kapa e etselitsoeng motho ka mong | kapa e etselitsoeng motho ka mong | kapa e etselitsoeng motho ka mong | ||||
| Ho ba le makukuno | Ra ≤ 0.2nm | Ra ≤ 0.2nm | Ra ≤ 0.2nm | Ra ≤ 0.2nm | Ra ≤ 0.2nm | |||
| Koahela | ≤ 30um | ≤ 30um | ≤ 30um | ≤ 30um | ≤45um | |||
| TTV | ≤ 10um | ≤ 10um | ≤ 10um | ≤ 10um | ≤ 10um | |||
| Ngola/Cheka | CMP/MP | |||||||
| MPD | <1 ka 'ngoe/cm-2 | <1 ka 'ngoe/cm-2 | <1 ka 'ngoe/cm-2 | <1 ka 'ngoe/cm-2 | <1 ka 'ngoe/cm-2 | |||
| Sebopeho | Selikalikoe, Se bataletseng 16mm; Bolelele ba 22mm; Bolelele ba 30/32.5mm; Bolelele ba 47.5mm; SELIKHE; SELIKHE; | |||||||
| Bevel | 45°, SEMI Spec; Sebopeho sa C | |||||||
| Sehlopha | Kereiti ea tlhahiso bakeng sa MOS le SBD; Kereiti ea lipatlisiso; Kereiti ea dummy, Kereiti ea wafer ea peo | |||||||
| Litlhaloso | Bophara, Botenya, Tsela eo u shebaneng le eona, litlhaloso tse kaholimo li ka fetoloa ho latela kopo ea hau | |||||||
Likopo
·Matla a Elektroniki
Li-wafer tsa mofuta oa N SiC li bohlokoa haholo lisebelisoa tsa elektroniki tse sebelisang motlakase ka lebaka la bokhoni ba tsona ba ho sebetsana le motlakase o phahameng le motlakase o phahameng. Li sebelisoa hangata ho li-converter tsa motlakase, li-inverter le li-drive tsa enjene bakeng sa liindasteri tse kang matla a nchafatsoang, likoloi tsa motlakase le boiketsetso ba indasteri.
· Lisebelisoa tsa Optoelectronics
Lisebelisoa tsa SiC tsa mofuta oa N, haholo-holo bakeng sa lits'ebetso tsa optoelectronic, li sebelisoa lisebelisoa tse kang li-diode tse ntšang leseli (LED) le li-diode tsa laser. Ho khanna ha tsona mocheso o phahameng le lekhalo le pharaletseng ho li etsa hore li be ntle bakeng sa lisebelisoa tsa optoelectronic tse sebetsang hantle.
·Likopo tsa Mocheso o Phahameng
Li-wafer tsa SiC tsa 4H-N 6H-N li loketse hantle libaka tse nang le mocheso o phahameng, joalo ka li-sensor le lisebelisoa tsa motlakase tse sebelisoang lifofaneng, likoloing le liindastering moo ho qhala ha mocheso le botsitso mochesong o phahameng ho leng bohlokoa.
·Lisebelisoa tsa RF
Li-wafer tsa SiC tsa 4H-N 6H-N li sebelisoa lisebelisoa tsa maqhubu a seea-le-moea (RF) tse sebetsang maemong a maqhubu a phahameng. Li sebelisoa lits'ebetsong tsa puisano, theknoloji ea radar, le puisano ea sathelaete, moo ho hlokahalang bokhoni bo phahameng ba matla le ts'ebetso.
·Lisebelisoa tsa Photonic
Ho photonics, di-wafer tsa SiC di sebediswa bakeng sa disebediswa tse kang di-photodetector le di-modulator. Dibopeho tse ikgethang tsa thepa ena di e dumella ho sebetsa hantle tlhahisong ya lesedi, ho feto-fetoha ha lesedi, le ho lemoha ditsamaisong tsa puisano ya optical le disebedisweng tsa ho nka ditshwantsho.
·Li-sensor
Li-wafer tsa SiC li sebelisoa lits'ebetsong tse fapaneng tsa li-sensor, haholo-holo libakeng tse thata moo thepa e 'ngoe e ka 'nang ea hlōleha. Tsena li kenyelletsa li-sensor tsa mocheso, khatello le lik'hemik'hale, tse bohlokoa masimong a kang likoloi, oli le khase, le tlhokomelo ea tikoloho.
·Mekhoa ea ho khanna likoloi tsa motlakase
Theknoloji ea SiC e bapala karolo ea bohlokoa likoloing tsa motlakase ka ho ntlafatsa bokhoni le ts'ebetso ea litsamaiso tsa ho khanna. Ka li-semiconductor tsa motlakase tsa SiC, likoloi tsa motlakase li ka fihlella bophelo bo betere ba betri, linako tsa ho tjhaja kapele, le ts'ebeliso e kholo ea matla.
·Li-sensor tse Tsoetseng Pele le Li-Photonic Converters
Mehlaleng e tsoetseng pele ea li-sensor, li-wafer tsa SiC li sebelisoa bakeng sa ho theha li-sensor tse nepahetseng haholo bakeng sa lits'ebetso tsa liroboto, lisebelisoa tsa bongaka le tlhokomelo ea tikoloho. Li-converter tsa photonic, thepa ea SiC e sebelisoa ho nolofalletsa phetoho e sebetsang ea matla a motlakase ho matšoao a optical, e leng ea bohlokoa mekhoeng ea puisano le meralo ea motheo ea inthanete e potlakileng.
Lipotso le Likarabo
Q:4H ho 4H SiC ke eng?
A"4H" ho 4H SiC e bolela sebopeho sa kristale sa carbide ea silicon, haholo-holo sebopeho sa hexagonal se nang le mekhahlelo e mene (H). "H" e bontša mofuta oa polytype ea hexagonal, e e khethollang ho li-polytype tse ling tsa SiC tse kang 6H kapa 3C.
Q:Motlakase oa mocheso oa 4H-SiC ke ofe?
A:Ho tsamaisa mocheso ha 4H-SiC (Silicon Carbide) ho ka ba 490-500 W/m·K mochesong wa kamore. Ho tsamaisa mocheso ho hoholo ho etsa hore e be ntle bakeng sa ditshebediso tsa motlakase wa motlakase le dibakeng tse nang le mocheso o phahameng, moo ho qhala mocheso ka katleho ho leng bohlokwa.














