SiC silicon carbide wafer SiC wafer 4H-N 6H-N HPSI (High purity Semi-Insulating) 4H/6H-P 3C -n mofuta 2 3 4 6 8inch fumaneha
Thepa
4H-N le 6H-N (N-mofuta oa SiC Wafers)
Kopo:Haholo-holo e sebelisoa ho lisebelisoa tsa motlakase tsa motlakase, li-optoelectronics, le lits'ebetsong tsa mocheso o phahameng.
Sebaka sa Diameter:50.8 mm ho isa ho 200 mm.
Botenya:350 μm ± 25 μm, ka botenya ba boikhethelo ba 500 μm ± 25 μm.
Resistivity:N-mofuta oa 4H / 6H-P: ≤ 0.1 Ω · cm (Z-grade), ≤ 0.3 Ω · cm (P-grade); N-mofuta 3C-N: ≤ 0.8 mΩ·cm (Z-grade), ≤ 1 mΩ·cm (P-grade).
Bokhopo:Ra ≤ 0.2 nm (CMP kapa MP).
Boima ba Micropipe (MPD):<1 ea/cm².
TTV: ≤ 10 μm bakeng sa bophara bohle.
Warp: ≤ 30 μm (≤ 45 μm bakeng sa li-wafers tse 8-inch).
Kenyelletso ea Edge:3 limilimithara ho 6 limilimithara ho itšetlehile ka mofuta oa sephaphatha.
Sephutheloana:Multi-wafer cassette kapa single wafer setshelo.
Ohter boholo bo fumanehang 3inch 4inch 6inch 8inch
HPSI (High Purity Semi-Insulating SiC Wafers)
Kopo:E sebelisoa bakeng sa lisebelisoa tse hlokang khanyetso e phahameng le ts'ebetso e tsitsitseng, joalo ka lisebelisoa tsa RF, lisebelisoa tsa photonic, le li-sensor.
Sebaka sa Diameter:50.8 mm ho isa ho 200 mm.
Botenya:Botenya bo tloaelehileng ba 350 μm ± 25 μm ka likhetho tsa li-wafers tse teteaneng ho fihla ho 500 μm.
Bokhopo:Ra ≤ 0.2 nm.
Boima ba Micropipe (MPD): ≤ 1 ea/cm².
Resistivity:Khanyetso e phahameng, hangata e sebelisoang lits'ebetsong tsa semi-insulating.
Warp: ≤ 30 μm (bakeng sa boholo bo nyane), ≤ 45 μm bakeng sa bophara bo boholo.
TTV: ≤ 10 μm.
Ohter boholo bo fumanehang 3inch 4inch 6inch 8inch
4H-P,6H-P&3C Sephaphatha sa SiC(P-mofuta oa SiC Wafers)
Kopo:Haholo-holo bakeng sa lisebelisoa tsa matla le tse phahameng-frequency.
Sebaka sa Diameter:50.8 mm ho isa ho 200 mm.
Botenya:350 μm ± 25 μm kapa likhetho tse ikhethileng.
Resistivity:P-mofuta 4H/6H-P: ≤ 0.1 Ω·cm (Z-grade), ≤ 0.3 Ω·cm (P-grade).
Bokhopo:Ra ≤ 0.2 nm (CMP kapa MP).
Boima ba Micropipe (MPD):<1 ea/cm².
TTV: ≤ 10 μm.
Kenyelletso ea Edge:ho tloha ho 3 ho isa ho 6 mm.
Warp: ≤ 30 μm bakeng sa boholo bo nyane, ≤ 45 μm bakeng sa boholo bo boholo.
Ohter boholo bo fumanehang 3inch 4inch 6inch5×5 10×10
Lethathamo la Li-Parameters tsa Boitsebiso bo sa Feleng
Thepa | 2 inch | 3 intshi | 4inch | 6 intshi | 8inch | |||
Mofuta | 4H-N/HPSI/ | 4H-N/HPSI/ | 4H-N/HPSI//4H/6H-P/3C; | 4H-N/HPSI//4H/6H-P/3C; | 4H-N/HPSI/4H-SEMI | |||
Diameter | 50.8 ± 0.3 limilimithara | 76.2±0.3mm | 100±0.3mm | 150±0.3mm | 200 ± 0.3 limilimithara | |||
Botenya | 330 ± 25 um | 350 ±25 um | 350 ±25 um | 350 ±25 um | 350 ±25 um | |||
350±25um | 500±25um | 500±25um | 500±25um | 500±25um | ||||
kapa e etselitsoeng motho | kapa e etselitsoeng motho | kapa e etselitsoeng motho | kapa e etselitsoeng motho | kapa e etselitsoeng motho | ||||
Boqhobane | Ra ≤ 0.2nm | Ra ≤ 0.2nm | Ra ≤ 0.2nm | Ra ≤ 0.2nm | Ra ≤ 0.2nm | |||
Warp | ≤30um | ≤30um | ≤30um | ≤30um | ≤45um | |||
TTV | ≤ 10um | ≤ 10um | ≤ 10um | ≤ 10um | ≤ 10um | |||
Qhepa/ Cheka | CMP/MP | |||||||
MPD | <1ea/cm-2 | <1ea/cm-2 | <1ea/cm-2 | <1ea/cm-2 | <1ea/cm-2 | |||
Sebopeho | Round, Flat 16mm; OF bolelele 22mm; EA Bolelele ba 30/32.5mm; EA Bolelele ba 47.5mm; NOTCH; NOTCH; | |||||||
Bevel | 45 °, SEMI Spec; C Sebopeho | |||||||
Kereiti | Phaello ea tlhahiso ea MOS&SBD; Sehlopha sa lipatlisiso; Sehlopha sa Dummy, Kereiti ea sephaphatha sa peo | |||||||
Litlhaloso | Diameter, Botenya, Boitloaelo, litlhaloso tse ka holimo li ka etsoa ka kopo ea hau |
Lisebelisoa
·Matla a Elektronike
Li-wafer tsa mofuta oa N li bohlokoa lisebelisoa tsa elektroniki ka lebaka la bokhoni ba tsona ba ho sebetsana le motlakase o phahameng le hona joale. Li sebelisoa hangata ho li-converter tsa motlakase, li-inverters le li-drive tsa liindasteri tse kang matla a tsosolositsoeng, likoloi tsa motlakase le li-automation tsa indasteri.
· Optoelectronics
Lisebelisoa tsa SiC tsa mofuta oa N, haholo-holo bakeng sa lisebelisoa tsa optoelectronic, li sebelisoa lisebelisoa tse kang light-emitting diodes (LED) le laser diode. Ts'ebetso ea bona e phahameng ea mocheso le li-bandgap tse pharaletseng li etsa hore e be tse loketseng lisebelisoa tsa optoelectronic tse sebetsang hantle haholo.
·Lisebelisoa tsa Mocheso o Phahameng
Li-wafers tsa 4H-N 6H-N SiC li loketse hantle bakeng sa tikoloho ea mocheso o phahameng, joalo ka lisensara le lisebelisoa tsa motlakase tse sebelisoang sebakeng sa sefofane, likoloi, le lits'ebetsong tsa indasteri moo ho qhala mocheso le botsitso maemong a mocheso a phahameng.
·Lisebelisoa tsa RF
Li-wafers tsa 4H-N 6H-N SiC li sebelisoa lisebelisoa tsa maqhubu a seea-le-moea (RF) tse sebetsang maemong a phahameng a maqhubu. Li sebelisoa mekhoeng ea puisano, thekenoloji ea radar, le puisano ea sathelaete, moo matla a phahameng a matla le ts'ebetso e hlokahalang.
·Lisebelisoa tsa Photonic
Ho li-photonics, li-wafers tsa SiC li sebelisoa bakeng sa lisebelisoa tse kang li-photodetectors le li-modulator. Thepa e ikhethang ea thepa e e lumella hore e atlehe ho hlahisa leseli, ho feto-fetoha ha maemo, le ho lemoha lits'ebetsong tsa puisano tsa optical le lisebelisoa tsa litšoantšo.
·Li-sensor
Li-wafers tsa SiC li sebelisoa mefuteng e fapaneng ea li-sensor, haholo-holo libakeng tse thata moo lisebelisoa tse ling li ka hlolehang. Tsena li kenyelletsa mocheso, khatello le li-sensor tsa lik'hemik'hale, tse bohlokoa mafapheng a kang likoloi, oli le khase, le tlhahlobo ea tikoloho.
·Litsamaiso tsa ho khanna likoloi tsa motlakase
Theknoloji ea SiC e bapala karolo ea bohlokoa likoloing tsa motlakase ka ho ntlafatsa ts'ebetso le ts'ebetso ea litsamaiso tsa ho khanna. Ka li-semiconductors tsa motlakase tsa SiC, likoloi tsa motlakase li ka fumana bophelo bo betere ba betri, linako tsa ho tjhaja kapele, le ts'ebeliso e ntle ea matla.
·Li-Sensors tse tsoetseng pele le li-converter tsa Photonic
Litheknolojing tse tsoetseng pele tsa sensor, li-wafers tsa SiC li sebelisoa bakeng sa ho theha li-sensor tse nepahetseng haholo bakeng sa lits'ebetso ho liroboto, lisebelisoa tsa bongaka le tlhahlobo ea tikoloho. Ho li-converter tsa photonic, thepa ea SiC e sebelisoa hampe ho thusa phetoho e nepahetseng ea matla a motlakase ho mats'oao a optical, e leng ntho ea bohlokoa mekhoeng ea puisano ea mehala le marang-rang a marang-rang a potlakileng.
Q&A
Q: 4H ke eng ho 4H SiC?
A: "4H" ho 4H SiC e bua ka sebopeho sa kristale sa silicon carbide, haholo-holo sebopeho sa hexagonal se nang le likarolo tse 'nè (H). "H" e bontša mofuta oa hexagonal polytype, e khethollang ho tse ling tsa SiC polytypes tse kang 6H kapa 3C.
Q: Thermal conductivity ea 4H-SiC ke eng?
A:Thermal conductivity ea 4H-SiC (Silicon Carbide) e ka ba 490-500 W / m·K mocheso oa kamore. Ts'ebetso ena e phahameng ea mocheso e etsa hore e be e loketseng bakeng sa lits'ebetso tsa elektronike tse matla le libakeng tse nang le mocheso o phahameng, moo mocheso o sebetsang hantle o leng bohlokoa.