LiTaO3 Wafer 2inch-8inch 10x10x0.5 mm 1sp 2sp bakeng sa 5G/6G Communications

LiTaO3 Wafer 2inch-8inch 10x10x0.5 mm 1sp 2sp bakeng sa 5G/6G Setšoantšo se Hlahelitsoeng

Tlhaloso e Khutšoanyane:

LiTaO3 Wafer (lithium tantalate wafer), thepa ea bohlokoa ho li-semiconductors le optoelectronics tsa moloko oa boraro, e phahamisa mocheso oa eona o phahameng oa Curie (610°C), pepeneneng e pharaletseng (0.4–5.0 μm), coefficient e phahameng ea piezoelectric (d33 > 1,500 ditoelectric tahlehelo) le ho fokotseha ho tlase ho 1,500 pC/N Lipuisano tsa 5G, kopanyo ea lifoto, le lisebelisoa tsa quantum. E sebelisa mekhoa e tsoetseng pele ea mahlale e joalo ka transport vapor transport (PVT) le chemical vapor deposition (CVD), XKH e fana ka X/Y/Z-cut, 42°Y-cut, and periodically pole pole (PPLT)ka lifomete tse 2–8-inch, tse nang le bokaholimo ba metsi (Ra) <0.1 cm <0.5 nm le micropie Litšebeletso tsa rona li kenyelletsa Fe doping, phokotso ea lik'hemik'hale, le Smart-Cut heterogeneous integration, ho sebetsana le li-filters tse sebetsang hantle haholo, li-detectors tsa infrared, le mehloli ea khanya ea quantum. Sesebediswa sena se fana ka katleho ho miniaturization, ts'ebetso ea maqhubu a phahameng, le botsitso ba mocheso, ho potlakisa ho nkeloa sebaka ke mahlale a bohlokoa malapeng.

Re romelle lengolo-tsoibila

Likaroloana

Litekanyetso tsa tekheniki

Lebitso	Optical-grade LiTaO3	Boemo ba tafole ea molumo LiTaO3
Axial	Z khaola + / - 0,2 °	36 ° Y sehiloeng / 42 ° Y sehiloeng / X sehiloeng (+ / - 0.2 °)
Diameter	76.2mm + / - 0.3mm/ 100±0.2mm	76.2mm + /-0.3mm 100mm + /-0.3mm 0r 150±0.5mm
Sefofane sa Datum	22mm +/ - 2mm	22mm + /-2mm 32mm + /-2mm
Botenya	500um + /-5mm 1000um + /-5mm	500um + /-20mm 350um + /-20mm
TTV	≤ 10um	≤ 10um
Mocheso oa curie	605 °C + / - 0.7 °C (Mokhoa oa DTA)	605 °C + / -3 °C (DTAmokgwa
Boleng ba bokaholimo	Ho bentša ka mahlakoreng a mabeli	Ho bentša ka mahlakoreng a mabeli
Mathoko a chamfered	ho pota-pota	ho pota-pota

Litšobotsi Tsa Sehlooho

1. Ts'ebetso ea Motlakase le ea Optical
· Electro-Optic Coefficient: r33 e fihla ho 30 pm / V (X-cut), 1.5 × e phahameng ho feta LiNbO3, e nolofalletsang ultra-wideband electro-optic modulation (> 40 GHz bandwidth).
Karabelo e Atolohileng ea Spectral: Sebaka sa phetiso ea 0.4–5.0 μm (botenya ba limilimithara tse 8), se nang le matheba a ultraviolet a tlase ho 280 nm, se loketseng lilase tsa UV le lisebelisoa tsa matheba a quantum.
· Phaello e tlase ea Pyroelectric: dP/dT = 3.5×10⁻⁴ C/(m²·K), e netefatsang botsitso ho li-sensor tsa infrared tsa mocheso o phahameng.

2. Thermal le Mechanical Properties
· High Thermal Conductivity: 4.6 W/m·K (X-cut), quadruple ea quartz, e bolokang -200-500 ° C thermal cycling.
· Mocheso o Motla oa Katoloso ea Mocheso: CTE = 4.1 × 10⁻⁶/K (25-1000 ° C), e lumellana le liphutheloana tsa silicon ho fokotsa khatello ea mocheso.
3. Taolo ea Bofokoli le Ts'ebetso e nepahetseng
Boima ba Micropipe: <0.1 cm⁻² (li-wafers tse 8-inch), density deslocation <500 cm⁻² (e netefalitsoe ka KOH etching).
· Boleng ba Bokahohle: CMP e bentšitsoe ho Ra <0.5 nm, e finyella litlhoko tsa EUV lithography-grade flatness.

Lisebelisoa tsa Bohlokoa

Domain	Scenarios ea Kopo	Melemo ea Technical
Lipuisano tsa Optical	100G/400G DWDM lasers, silicon photonics hybrid modules	Phetisetso e pharalletseng ea li-wafer ea LiTaO3 le tahlehelo e tlase ea waveguide (α <0.1 dB/cm) e thusa katoloso ea C-band.
Likhokahano tsa 5G/6G	Lisefe tsa SAW (1.8–3.5 GHz), lihloela tsa BAW-SMR	42°Y-cut wafers e fihlella Kt²>15%, e fana ka tahlehelo e tlase ea ho kenya (<1.5 dB) le roll-off e phahameng (>30 dB).
Quantum Technologies	Li-detectors tsa photon e le 'ngoe, mehloli ea ho fetola maemo a tlase	Coefficient e phahameng ea nonlinear (χ(2)=40 pm/V) le sekhahla se tlase sa palo e lefifi (<100 counts/s) e matlafatsa botšepehi ba palo.
Industrial Sensing	Li-sensor tsa khatello e phahameng ea mocheso, li-transformer tsa hona joale	Karabo ea piezoelectric ea LiTaO3 (g33>20 mV/m) le mamello e phahameng ea mocheso (>400°C) e lumellana le maemo a feteletseng.

Litšebeletso tsa XKH

1. Mokhoa oa ho etsa oafer ea tloaelo

· Boholo le ho Seha: li-wafers tsa 2-8-inch tse nang le X / Y / Z-cut, 42 ° Y-cut, le mekhoa e tloaelehileng ea li-angular (± 0.01 ° mamello).

· Taolo ea Doping: Fe, Mg doping ka mokhoa oa Czochralski (concentration range 10¹⁶–10¹⁹ cm⁻³) ho ntlafatsa li-coefficients tsa electro-optic le botsitso ba mocheso.

2.Advanced Process Technologies
.
· Periodic Poling (PPLT): Theknoloji ea Smart-Cut bakeng sa li-wafers tsa LTOI, ho finyella ± 10 nm nako ea nako e nepahetseng le phetoho ea maqhubu a quasi-phase-matched (QPM).

· Heterogeneous Integration: Si-based LiTaO3 composite wafers (POI) e nang le taolo ea botenya (300-600 nm) le conductivity ea mocheso ho fihlela ho 8.78 W / m·K bakeng sa li-filters tsa SAW tse phahameng-frequency.

3.Litsamaiso tsa Tsamaiso ea Boleng
.
· Teko ea ho Qetela: Raman spectroscopy (polytype verification), XRD (crystallinity), AFM (surface morphology), le tlhahlobo ea optical uniform (Δn <5×10⁻⁵).

4.Global Supply Chain Support
.
· Bokhoni ba Tlhahiso: Phallo ea khoeli le khoeli> li-wafers tse 5,000 (8-inch: 70%), tse nang le phano ea tšohanyetso ea lihora tse 48.

· Logistics Network: Kakaretso Europe, Amerika Leboea, le Asia-Pacific ka thepa ea moea/ea leoatle e nang le liphutheloana tse laoloang ke mocheso.